EP4728568A1 - Emballage de sortance de capteur - Google Patents

Emballage de sortance de capteur

Info

Publication number
EP4728568A1
EP4728568A1 EP24824207.5A EP24824207A EP4728568A1 EP 4728568 A1 EP4728568 A1 EP 4728568A1 EP 24824207 A EP24824207 A EP 24824207A EP 4728568 A1 EP4728568 A1 EP 4728568A1
Authority
EP
European Patent Office
Prior art keywords
carrier
die
molding material
releasing
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP24824207.5A
Other languages
German (de)
English (en)
Inventor
Ravi Billa
Tracy FUNG
Hai Tran
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Illumina Inc
Original Assignee
Illumina Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illumina Inc filed Critical Illumina Inc
Publication of EP4728568A1 publication Critical patent/EP4728568A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Apparatus Associated With Microorganisms And Enzymes (AREA)

Abstract

L'invention concerne, dans divers exemples, un procédé permettant de fabriquer des aspects d'une cellule d'écoulement. Le procédé peut consister à lier une puce à un premier support avec un premier matériau de liaison, à encapsuler la puce avec un matériau de moulage, à lier un second support à une surface du matériau de moulage avec un second matériau de liaison, à libérer le premier support de la puce encapsulée avec le matériau de moulage pour exposer une surface qui comprend des régions de sortance, à appliquer une chimie à la surface exposée de la puce de telle sorte que la surface donnée de la puce devienne une zone de détection active pour la cellule d'écoulement, et à placer une couche d'operculage sur la surface exposée pour former un espace sur la zone de détection active, l'espace définissant un canal fluidique.
EP24824207.5A 2023-06-16 2024-06-14 Emballage de sortance de capteur Pending EP4728568A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202363508708P 2023-06-16 2023-06-16
PCT/US2024/033967 WO2024259203A1 (fr) 2023-06-16 2024-06-14 Emballage de sortance de capteur

Publications (1)

Publication Number Publication Date
EP4728568A1 true EP4728568A1 (fr) 2026-04-22

Family

ID=93852663

Family Applications (1)

Application Number Title Priority Date Filing Date
EP24824207.5A Pending EP4728568A1 (fr) 2023-06-16 2024-06-14 Emballage de sortance de capteur

Country Status (2)

Country Link
EP (1) EP4728568A1 (fr)
WO (1) WO2024259203A1 (fr)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2954310B1 (fr) * 2013-02-06 2024-01-03 Alentic Microscience Inc. Détection et utilisation d'une lumière représentative d'un échantillon
EP3116651B1 (fr) * 2014-03-11 2020-04-22 Illumina, Inc. Cartouche microfluidique intégrée jetable, et procédés pour la fabriquer
US10861829B2 (en) * 2017-12-26 2020-12-08 Illumina, Inc. Sensor system
KR102016495B1 (ko) * 2018-01-31 2019-10-21 삼성전기주식회사 팬-아웃 센서 패키지
TWI685960B (zh) * 2018-02-03 2020-02-21 美商伊路米納有限公司 使用感測器的主動表面的結構和方法

Also Published As

Publication number Publication date
WO2024259203A1 (fr) 2024-12-19

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