EP4784822A1 - Elektroabscheidung mit ultrakurzzeitimpulsen - Google Patents

Elektroabscheidung mit ultrakurzzeitimpulsen

Info

Publication number
EP4784822A1
EP4784822A1 EP24873450.1A EP24873450A EP4784822A1 EP 4784822 A1 EP4784822 A1 EP 4784822A1 EP 24873450 A EP24873450 A EP 24873450A EP 4784822 A1 EP4784822 A1 EP 4784822A1
Authority
EP
European Patent Office
Prior art keywords
electric pulse
substrate
amps
electrodeposited
volts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP24873450.1A
Other languages
English (en)
French (fr)
Inventor
Alan Michael KRAFT
David Alan DETWILER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atomera Inc
Original Assignee
Nanovis LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanovis LLC filed Critical Nanovis LLC
Publication of EP4784822A1 publication Critical patent/EP4784822A1/de
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00—Electrolytic coating other than with metals
    • C25D9/04—Electrolytic coating other than with metals with inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00—Electrolytic coating other than with metals
    • C25D9/04—Electrolytic coating other than with metals with inorganic materials
    • C25D9/06—Electrolytic coating other than with metals with inorganic materials by anodic processes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00—Electrolytic coating other than with metals
    • C25D9/04—Electrolytic coating other than with metals with inorganic materials
    • C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/54—Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
EP24873450.1A 2023-09-26 2024-09-25 Elektroabscheidung mit ultrakurzzeitimpulsen Pending EP4784822A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202363585386P 2023-09-26 2023-09-26
PCT/US2024/048303 WO2025072258A1 (en) 2023-09-26 2024-09-25 Electrodeposition using ultrashort duration pulses

Publications (1)

Publication Number Publication Date
EP4784822A1 true EP4784822A1 (de) 2026-08-05

Family

ID=95202068

Family Applications (1)

Application Number Title Priority Date Filing Date
EP24873450.1A Pending EP4784822A1 (de) 2023-09-26 2024-09-25 Elektroabscheidung mit ultrakurzzeitimpulsen

Country Status (4)

Country Link
US (1) US20260226646A1 (de)
EP (1) EP4784822A1 (de)
AU (1) AU2024354144A1 (de)
WO (1) WO2025072258A1 (de)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT337829B (de) * 1974-10-28 1977-07-25 Vianova Kunstharz Ag Messanordnung zur ermittlung von umgriffsparametern von elektrotauchlacken
US20040140219A1 (en) * 2003-01-21 2004-07-22 Texas Instruments Incorporated System and method for pulse current plating
JP5177378B2 (ja) * 2005-04-20 2013-04-03 独立行政法人産業技術総合研究所 メソポーラスシリカ厚膜及びその製造方法、吸着装置並びに吸着用膜
US20080029400A1 (en) * 2005-05-13 2008-02-07 Stephen Mazur Selective electroplating onto recessed surfaces
CN107075683A (zh) * 2014-05-27 2017-08-18 奥克兰联合服务公司 于基材上产生金属‑陶瓷覆层的镀覆或涂覆方法
US10669635B2 (en) * 2014-09-18 2020-06-02 Baker Hughes, A Ge Company, Llc Methods of coating substrates with composite coatings of diamond nanoparticles and metal

Also Published As

Publication number Publication date
WO2025072258A1 (en) 2025-04-03
AU2024354144A1 (en) 2026-04-30
US20260226646A1 (en) 2026-08-06

Legal Events

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