ES1049733U - Heatsinks for mounting semiconductors. (Machine-translation by Google Translate, not legally binding) - Google Patents

Heatsinks for mounting semiconductors. (Machine-translation by Google Translate, not legally binding)

Info

Publication number
ES1049733U
ES1049733U ES200101916U ES200101916U ES1049733U ES 1049733 U ES1049733 U ES 1049733U ES 200101916 U ES200101916 U ES 200101916U ES 200101916 U ES200101916 U ES 200101916U ES 1049733 U ES1049733 U ES 1049733U
Authority
ES
Spain
Prior art keywords
pieces
translation
machine
legally binding
google translate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES200101916U
Other languages
Spanish (es)
Other versions
ES1049733Y (en
Inventor
Sanchez Francisco Bausa
Payro Jordi Joan Argemi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rectificadores Guasch S A
Original Assignee
Rectificadores Guasch S A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rectificadores Guasch S A filed Critical Rectificadores Guasch S A
Priority to ES200101916U priority Critical patent/ES1049733Y/en
Publication of ES1049733U publication Critical patent/ES1049733U/en
Application granted granted Critical
Publication of ES1049733Y publication Critical patent/ES1049733Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Cooling body for mounting semiconductors; characterized in that it consists of a variable number of intermediate pieces (1) located between two end pieces (2) and all of them joined together by means of complementary pressure coupling means located in the respective ends of the pieces, in thickened (11, 21) acting as spacers between the pieces, forming a prismatic configuration with all the smooth outer surfaces and with through holes (3) between the pieces that allow air circulation. (Machine-translation by Google Translate, not legally binding)
ES200101916U 2001-07-26 2001-07-26 REFRIGERATION BODY FOR SEMICONDUCTOR ASSEMBLY. Expired - Fee Related ES1049733Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ES200101916U ES1049733Y (en) 2001-07-26 2001-07-26 REFRIGERATION BODY FOR SEMICONDUCTOR ASSEMBLY.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES200101916U ES1049733Y (en) 2001-07-26 2001-07-26 REFRIGERATION BODY FOR SEMICONDUCTOR ASSEMBLY.

Publications (2)

Publication Number Publication Date
ES1049733U true ES1049733U (en) 2002-01-01
ES1049733Y ES1049733Y (en) 2002-05-16

Family

ID=8498737

Family Applications (1)

Application Number Title Priority Date Filing Date
ES200101916U Expired - Fee Related ES1049733Y (en) 2001-07-26 2001-07-26 REFRIGERATION BODY FOR SEMICONDUCTOR ASSEMBLY.

Country Status (1)

Country Link
ES (1) ES1049733Y (en)

Also Published As

Publication number Publication date
ES1049733Y (en) 2002-05-16

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Legal Events

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Effective date: 20130919