ES1053051Y - Placa de circuitos impresos con plaqueta dorsal de masa. - Google Patents

Placa de circuitos impresos con plaqueta dorsal de masa.

Info

Publication number
ES1053051Y
ES1053051Y ES200202577U ES200202577U ES1053051Y ES 1053051 Y ES1053051 Y ES 1053051Y ES 200202577 U ES200202577 U ES 200202577U ES 200202577 U ES200202577 U ES 200202577U ES 1053051 Y ES1053051 Y ES 1053051Y
Authority
ES
Spain
Prior art keywords
plate
dorsal
printed circuit
mass
circuit plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
ES200202577U
Other languages
English (en)
Other versions
ES1053051U (es
Inventor
Marian Baran
Bernd Kaiser
Joerg Romahn
Annette Bolcke
Robert Kalicki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of ES1053051U publication Critical patent/ES1053051U/es
Application granted granted Critical
Publication of ES1053051Y publication Critical patent/ES1053051Y/es
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09254—Branched layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Non-Reversible Transmitting Devices (AREA)
  • Pens And Brushes (AREA)
ES200202577U 2002-05-29 2002-10-25 Placa de circuitos impresos con plaqueta dorsal de masa. Expired - Fee Related ES1053051Y (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20208478U DE20208478U1 (de) 2002-05-29 2002-05-29 Leiterplatte mit rückseitigem Massepad

Publications (2)

Publication Number Publication Date
ES1053051U ES1053051U (es) 2003-03-01
ES1053051Y true ES1053051Y (es) 2003-06-16

Family

ID=7971699

Family Applications (1)

Application Number Title Priority Date Filing Date
ES200202577U Expired - Fee Related ES1053051Y (es) 2002-05-29 2002-10-25 Placa de circuitos impresos con plaqueta dorsal de masa.

Country Status (5)

Country Link
CN (1) CN2572720Y (es)
DE (1) DE20208478U1 (es)
ES (1) ES1053051Y (es)
FR (1) FR2840503B3 (es)
IT (1) ITMI20030013U1 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20314526U1 (de) * 2003-09-12 2003-11-20 Siemens AG, 80333 München Leiterplatte für ein Funkmodul
CN102509957B (zh) * 2011-10-18 2014-02-19 华为终端有限公司 一种通用串行总线usb公头

Also Published As

Publication number Publication date
DE20208478U1 (de) 2002-08-29
ITMI20030013U1 (it) 2003-11-30
CN2572720Y (zh) 2003-09-10
FR2840503A3 (fr) 2003-12-05
FR2840503B3 (fr) 2004-04-30
ES1053051U (es) 2003-03-01

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Legal Events

Date Code Title Description
FG1K Utility model granted
FD1K Utility model lapsed

Effective date: 20100309