ES123823U - Una caja para material electrico. - Google Patents

Una caja para material electrico.

Info

Publication number
ES123823U
ES123823U ES123823U ES123823U ES123823U ES 123823 U ES123823 U ES 123823U ES 123823 U ES123823 U ES 123823U ES 123823 U ES123823 U ES 123823U ES 123823 U ES123823 U ES 123823U
Authority
ES
Spain
Prior art keywords
sheet
box
substrate
vitreous material
electrical equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES123823U
Other languages
English (en)
Other versions
ES123823Y (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Glass Works
Original Assignee
Corning Glass Works
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Glass Works filed Critical Corning Glass Works
Publication of ES123823U publication Critical patent/ES123823U/es
Application granted granted Critical
Publication of ES123823Y publication Critical patent/ES123823Y/es
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60Seals
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/062Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/062Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C03C3/074Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
    • C03C3/0745Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc containing more than 50% lead oxide, by weight
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00Packaging processes not covered by the other groups of this subclass
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Glass Compositions (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Laminated Bodies (AREA)

Abstract

Una caja para material eléctrico caracterizada porque está constituída por un substrato plano de alúmina sobre el cual está colocado un dispositivo eléctrico una hoja flexible de aluminio y una película de material vítreo adherente aplicado a un a superficie de la indicada hoja presentando dicho material vítreo un coeficiente de dilatación térmica compatible con el de dicho substrato y una temperatura de reblandecimiento menor que la temperatura de fusión de la alúmina y el aluminio y estando dicha hoja fundida herméticamente al citado substrato en torno a la periferia de dicha hoja mediante el indicado material vítreo.
ES123823U 1965-08-10 1966-08-09 Una caja para material electrico. Expired ES123823Y (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US478690A US3405441A (en) 1965-08-10 1965-08-10 Method of enclosing an electrical device

Publications (2)

Publication Number Publication Date
ES123823U true ES123823U (es) 1967-06-16
ES123823Y ES123823Y (es) 1967-11-01

Family

ID=23900984

Family Applications (2)

Application Number Title Priority Date Filing Date
ES123823U Expired ES123823Y (es) 1965-08-10 1966-08-09 Una caja para material electrico.
ES0330076A Expired ES330076A1 (es) 1965-08-10 1966-08-09 Metodo de fabricacion de cajas para material electrico

Family Applications After (1)

Application Number Title Priority Date Filing Date
ES0330076A Expired ES330076A1 (es) 1965-08-10 1966-08-09 Metodo de fabricacion de cajas para material electrico

Country Status (7)

Country Link
US (1) US3405441A (es)
CH (1) CH451274A (es)
DE (1) DE1590251A1 (es)
ES (2) ES123823Y (es)
FR (1) FR1488922A (es)
GB (1) GB1160732A (es)
NL (1) NL6611257A (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3672034A (en) * 1970-01-14 1972-06-27 Bell Telephone Labor Inc Method for bonding a beam-lead device to a substrate
US4063349A (en) * 1976-12-02 1977-12-20 Honeywell Information Systems Inc. Method of protecting micropackages from their environment
US5268533A (en) * 1991-05-03 1993-12-07 Hughes Aircraft Company Pre-stressed laminated lid for electronic circuit package
US5434750A (en) * 1992-02-07 1995-07-18 Lsi Logic Corporation Partially-molded, PCB chip carrier package for certain non-square die shapes
US5262927A (en) * 1992-02-07 1993-11-16 Lsi Logic Corporation Partially-molded, PCB chip carrier package
US5438477A (en) * 1993-08-12 1995-08-01 Lsi Logic Corporation Die-attach technique for flip-chip style mounting of semiconductor dies
US5508888A (en) * 1994-05-09 1996-04-16 At&T Global Information Solutions Company Electronic component lead protector

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3105868A (en) * 1960-12-29 1963-10-01 Sylvania Electric Prod Circuit packaging module
US3187240A (en) * 1961-08-08 1965-06-01 Bell Telephone Labor Inc Semiconductor device encapsulation and method
US3171187A (en) * 1962-05-04 1965-03-02 Nippon Electric Co Method of manufacturing semiconductor devices
US3178506A (en) * 1962-08-09 1965-04-13 Westinghouse Electric Corp Sealed functional molecular electronic device

Also Published As

Publication number Publication date
CH451274A (fr) 1968-05-15
GB1160732A (en) 1969-08-06
FR1488922A (fr) 1967-07-13
ES123823Y (es) 1967-11-01
ES330076A1 (es) 1967-06-01
DE1590251A1 (de) 1970-05-14
NL6611257A (es) 1967-02-13
US3405441A (en) 1968-10-15

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