ES2005470A6 - Un metodo para formar revestimientos que contienen silicio y nitrogeno sobre un dispositivo electronico. - Google Patents

Un metodo para formar revestimientos que contienen silicio y nitrogeno sobre un dispositivo electronico.

Info

Publication number
ES2005470A6
ES2005470A6 ES8703426A ES8703426A ES2005470A6 ES 2005470 A6 ES2005470 A6 ES 2005470A6 ES 8703426 A ES8703426 A ES 8703426A ES 8703426 A ES8703426 A ES 8703426A ES 2005470 A6 ES2005470 A6 ES 2005470A6
Authority
ES
Spain
Prior art keywords
electronic devices
coatings
sin
containing coatings
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES8703426A
Other languages
English (en)
Inventor
Loren Andrew Haluska
Leo Tarhay
Ronald Howard Baney
Keith Winton Michael
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp filed Critical Dow Corning Corp
Publication of ES2005470A6 publication Critical patent/ES2005470A6/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/6903—Inorganic materials containing silicon
    • H10P14/6905—Inorganic materials containing silicon being a silicon carbide or silicon carbonitride and not containing oxygen, e.g. SiC or SiC:H
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6328—Deposition from the gas or vapour phase
    • H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
    • H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
    • H10P14/6682—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/6903—Inorganic materials containing silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6342—Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
    • H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
    • H10P14/6687—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and nitrogen
    • H10P14/6689—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and nitrogen the compound being a silazane
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/6922—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/694—Inorganic materials composed of nitrides
    • H10P14/6943—Inorganic materials composed of nitrides containing silicon
    • H10P14/69433—Inorganic materials composed of nitrides containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Formation Of Insulating Films (AREA)
  • Paints Or Removers (AREA)

Abstract

ESTA INVENCION SE REFIERE A UN METODO PARA FORMAR A BAJAS TEMPERATURAS REVESTIMIENTOS CERAMICOS O SEMEJANTES A CERAMICOS QUE CONTIENEN SILICIO Y NITROGENO QUE SIRVEN PARA PROTEGER DISPOSITIVOS ELECTRONICOS. LOS REVESTIMIENTOS SON PRODUCIDOS MEDIANTE LA CERAMIFICACION A TEMPERATURAS MENORES O IGUALES QUE 400GC DE LOS REVESTIMIENTOS POLIMERICOS PRECERAMICOS QUE CONTIENEN SILICIO Y NITROGENO DEPOSITADOS A PARTIR DE UNA SOLUCION EN DISOLVENTE. LOS REVESTIMIENTOS SON UTILES PARA PLANARIZAR LA SUPERFICIE DE LOS DISPOSITIVOS ELECTRONICOS Y PARA PASIVARLA.
ES8703426A 1986-12-03 1987-11-30 Un metodo para formar revestimientos que contienen silicio y nitrogeno sobre un dispositivo electronico. Expired ES2005470A6 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/937,276 US4826733A (en) 1986-12-03 1986-12-03 Sin-containing coatings for electronic devices

Publications (1)

Publication Number Publication Date
ES2005470A6 true ES2005470A6 (es) 1989-03-01

Family

ID=25469722

Family Applications (1)

Application Number Title Priority Date Filing Date
ES8703426A Expired ES2005470A6 (es) 1986-12-03 1987-11-30 Un metodo para formar revestimientos que contienen silicio y nitrogeno sobre un dispositivo electronico.

Country Status (7)

Country Link
US (1) US4826733A (es)
EP (1) EP0270220B1 (es)
JP (1) JPH0612773B2 (es)
KR (1) KR950006348B1 (es)
CA (1) CA1284749C (es)
DE (1) DE3782623T2 (es)
ES (1) ES2005470A6 (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4756977A (en) * 1986-12-03 1988-07-12 Dow Corning Corporation Multilayer ceramics from hydrogen silsesquioxane
US4753855A (en) * 1986-12-04 1988-06-28 Dow Corning Corporation Multilayer ceramic coatings from metal oxides for protection of electronic devices
US4847162A (en) * 1987-12-28 1989-07-11 Dow Corning Corporation Multilayer ceramics coatings from the ceramification of hydrogen silsequioxane resin in the presence of ammonia
CA2027031A1 (en) * 1989-10-18 1991-04-19 Loren A. Haluska Hermetic substrate coatings in an inert gas atmosphere
EP0611067B1 (en) * 1993-02-05 1999-03-10 Dow Corning Corporation Coating electronic substrates with silica derived from silazane polymers
US5912047A (en) * 1993-03-25 1999-06-15 Dow Corning Corporation Borosilicate electronic coatings
JPH08148559A (ja) * 1994-11-15 1996-06-07 Fujitsu Ltd 絶縁膜を有する半導体装置の製造方法
WO1997007070A1 (en) * 1995-08-16 1997-02-27 Lanxide Technology Company, Lp Coated optical devices and methods of making the same
US5761367A (en) * 1996-08-13 1998-06-02 Lanxide Technology Company, Lp Coated optical devices and methods of making the same
TW437017B (en) * 1998-02-05 2001-05-28 Asm Japan Kk Silicone polymer insulation film on semiconductor substrate and method for formation thereof

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IN147578B (es) * 1977-02-24 1980-04-19 Rca Corp
US4200666A (en) * 1978-08-02 1980-04-29 Texas Instruments Incorporated Single component monomer for silicon nitride deposition
DE2932569C2 (de) * 1979-08-10 1983-04-07 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Reduzierung der Dichte der schnellen Oberflächenzustände bei MOS-Bauelementen
US4404153A (en) * 1981-01-15 1983-09-13 Dow Corning Corporation Process for the preparation of poly(disilyl)silazane polymers and the polymers therefrom
US4340619A (en) * 1981-01-15 1982-07-20 Dow Corning Corporation Process for the preparation of poly(disilyl)silazane polymers and the polymers therefrom
US4312970A (en) * 1981-02-20 1982-01-26 Dow Corning Corporation Silazane polymers from {R'3 Si}2 NH and organochlorosilanes
US4395460A (en) * 1981-09-21 1983-07-26 Dow Corning Corporation Preparation of polysilazane polymers and the polymers therefrom
US4397828A (en) * 1981-11-16 1983-08-09 Massachusetts Institute Of Technology Stable liquid polymeric precursor to silicon nitride and process
US4540803A (en) * 1983-11-28 1985-09-10 Dow Corning Corporation Hydrosilazane polymers from [R3 Si]2 NH and HSiCl3
US4543344A (en) * 1983-11-28 1985-09-24 Dow Corning Corporation Silicon nitride-containing ceramic material prepared by pyrolysis of hydrosilazane polymers from (R3 Si)2 NH and HSiCl3
US4482669A (en) * 1984-01-19 1984-11-13 Massachusetts Institute Of Technology Preceramic organosilazane polymers
US4482689A (en) * 1984-03-12 1984-11-13 Dow Corning Corporation Process for the preparation of polymetallo(disily)silazane polymers and the polymers therefrom
US4535007A (en) * 1984-07-02 1985-08-13 Dow Corning Corporation Silicon nitride-containing ceramics
US4757035A (en) * 1984-09-21 1988-07-12 Dow Corning Corporation Ceramic materials with increased crystallinity from silazane polymers
JPS62145822A (ja) * 1985-12-20 1987-06-29 Nec Corp 半導体装置の製造方法
US4696834A (en) * 1986-02-28 1987-09-29 Dow Corning Corporation Silicon-containing coatings and a method for their preparation
US4745205A (en) * 1986-11-03 1988-05-17 Dow Corning Corporation Novel preceramic polymers derived from cyclic silazanes and halogenated disilanes and a method for their preparation
US4742143A (en) * 1986-11-04 1988-05-03 Dow Corning Corporation Preceramic polymers derived from cyclic silazanes, and halosilanes and a method for their preparation
US4822697A (en) * 1986-12-03 1989-04-18 Dow Corning Corporation Platinum and rhodium catalysis of low temperature formation multilayer ceramics

Also Published As

Publication number Publication date
JPS63144526A (ja) 1988-06-16
CA1284749C (en) 1991-06-11
JPH0612773B2 (ja) 1994-02-16
KR880008442A (ko) 1988-08-31
DE3782623T2 (de) 1993-04-15
EP0270220A2 (en) 1988-06-08
DE3782623D1 (de) 1992-12-17
EP0270220A3 (en) 1989-04-26
US4826733A (en) 1989-05-02
KR950006348B1 (ko) 1995-06-14
EP0270220B1 (en) 1992-11-11

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Legal Events

Date Code Title Description
SA6 Expiration date (snapshot 920101)

Free format text: 2007-11-30