ES2006049A6 - Un aparato y un metodo para inspeccionar la integridad electronica de una union o junta de soldadura expuesta. - Google Patents

Un aparato y un metodo para inspeccionar la integridad electronica de una union o junta de soldadura expuesta.

Info

Publication number
ES2006049A6
ES2006049A6 ES888800093A ES8800093A ES2006049A6 ES 2006049 A6 ES2006049 A6 ES 2006049A6 ES 888800093 A ES888800093 A ES 888800093A ES 8800093 A ES8800093 A ES 8800093A ES 2006049 A6 ES2006049 A6 ES 2006049A6
Authority
ES
Spain
Prior art keywords
solder joints
circuit board
heating
pulse
simultaneous testing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES888800093A
Other languages
English (en)
Inventor
David B Chang
Michael F Berg
James E Drummond
Lee Mickelson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of ES2006049A6 publication Critical patent/ES2006049A6/es
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)

Abstract

SE TRATA DE UN SISTEMA PARA INSPECCIONAR LA INTEGRIDAD ELECTRONICA DE LAS JUNTAS O UNIONES DE SOLDADURA <BLANDA> MEDIANTE CALENTAMIENTO REPETITIVO (POR IMPULSOS) DE LAS JUNTAS DE SOLDADURA CON ENERGIA RADIANTE Y DETERMINANDO LA OSCILACION DE TEMPERATURA DE LAS JUNTAS DE SOLDADURA ASI CALENTADAS POR IMPULSOS, MIDIENDO PARA ELLO LAS EMISIONES DE RAYOS INFRARROJOS PROCEDENTES DE LAS JUNTAS DE SOLDADURA DURANTE LOS PERIODOS DE CALENTAMIENTO Y DE AUSENCIA DE CALENTAMIENTO. PARA MAYOR VENTAJA, LAS JUNTAS DE SOLDADURA EXPUESTAS DE UNA PLACA DE CIRCUITOS PUEDEN SER PROBADAS O ENSAYADAS TODAS DE UNA VEZ, CALENTANDO POR IMPULSOS LA PLACA ENTERA DE CIRCUITOS. LA OSCILACION DE TEMPERATURA DE CADA JUNTA PUEDE SER COMPARADA CON LAS OSCILACIONES DE TEMPERATURA DE UNAS JUNTAS DE SOLDADURA STANDAR CORRESPONDIENTES, DE BUENA INTEGRIDED ELECTRONICA CONOCIDA, EN PLACAS DE CIRCUITOS QUE FUNCIONAN ADECUADAMENTE.
ES888800093A 1987-01-16 1988-01-15 Un aparato y un metodo para inspeccionar la integridad electronica de una union o junta de soldadura expuesta. Expired ES2006049A6 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/004,009 US4792683A (en) 1987-01-16 1987-01-16 Thermal technique for simultaneous testing of circuit board solder joints

Publications (1)

Publication Number Publication Date
ES2006049A6 true ES2006049A6 (es) 1989-04-01

Family

ID=21708691

Family Applications (1)

Application Number Title Priority Date Filing Date
ES888800093A Expired ES2006049A6 (es) 1987-01-16 1988-01-15 Un aparato y un metodo para inspeccionar la integridad electronica de una union o junta de soldadura expuesta.

Country Status (5)

Country Link
US (1) US4792683A (es)
JP (1) JPS6446638A (es)
ES (1) ES2006049A6 (es)
GB (1) GB2199942B (es)
IL (1) IL85007A (es)

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US6394646B1 (en) 1999-04-16 2002-05-28 General Electric Company Method and apparatus for quantitative nondestructive evaluation of metal airfoils using high resolution transient thermography
US6340817B1 (en) * 1999-04-23 2002-01-22 Creo S.R.L. Inspection method for unpopulated printed circuit boards
US6367969B1 (en) * 1999-07-21 2002-04-09 General Electric Company Synthetic reference thermal imaging method
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US6585146B2 (en) * 2000-01-06 2003-07-01 Thermal Wave Imaging, Inc. Automated non-destructive weld evaluation method and apparatus
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US6728653B1 (en) * 2000-03-21 2004-04-27 Unisys Corporation Method for testing multi-chip packages
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RU2419100C2 (ru) * 2006-06-02 2011-05-20 Эйрбас Дойчланд Гмбх Испытательная аппаратура и способ обнаружения контактного дефекта токопроводного соединения
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US7845849B1 (en) * 2008-04-15 2010-12-07 Avaya Inc. Testing BGA solder joints by localized pulsed-heat thermography
EP2743688B1 (en) * 2012-12-17 2017-05-03 Thermosensorik Gmbh Method and system for the examination of a sample by means of thermography
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DE102015207551A1 (de) * 2015-04-24 2016-10-27 Robert Bosch Gmbh Vorrichtung und Verfahren zur photothermischen Qualitätskontrolle von Korngröße und Schichthaftung eines Bauteils
CN110621988A (zh) * 2017-05-15 2019-12-27 三菱电机株式会社 缺陷检查装置以及缺陷检查方法
CN110967376A (zh) * 2019-12-13 2020-04-07 上海吉埃姆智能设备有限公司 一种焊接质量检测系统
CN111639449B (zh) * 2020-05-26 2023-04-21 东风小康汽车有限公司重庆分公司 焊点建模方法、装置及系统
CN111735850B (zh) * 2020-06-24 2022-08-23 哈尔滨工业大学 扫描式电路板焊点虚焊自动检测系统及检测方法
CN115684270B (zh) * 2022-11-02 2025-07-22 哈尔滨工业大学 高密度封装电路板焊点虚焊红外快速筛查系统和筛查方法

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Also Published As

Publication number Publication date
IL85007A0 (en) 1988-06-30
US4792683A (en) 1988-12-20
GB2199942B (en) 1991-05-08
IL85007A (en) 1991-08-16
GB8800085D0 (en) 1988-02-10
JPS6446638A (en) 1989-02-21
GB2199942A (en) 1988-07-20

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19980504