ES2010233A6 - Revestimientos ceramicos, metodo para su produccion y dispositivos electronicos asi revestidos. . - Google Patents

Revestimientos ceramicos, metodo para su produccion y dispositivos electronicos asi revestidos. .

Info

Publication number
ES2010233A6
ES2010233A6 ES8703427A ES8703427A ES2010233A6 ES 2010233 A6 ES2010233 A6 ES 2010233A6 ES 8703427 A ES8703427 A ES 8703427A ES 8703427 A ES8703427 A ES 8703427A ES 2010233 A6 ES2010233 A6 ES 2010233A6
Authority
ES
Spain
Prior art keywords
electronic devices
ceramic
coated
ceramic coatings
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES8703427A
Other languages
English (en)
Inventor
Loren Andrew Haluska
Keith Winton Michael
Leo Tarhay
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp filed Critical Dow Corning Corp
Publication of ES2010233A6 publication Critical patent/ES2010233A6/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon

Landscapes

  • Formation Of Insulating Films (AREA)
  • Chemically Coating (AREA)
  • Paints Or Removers (AREA)

Abstract

REVESTIMIENTOS CERAMICOS, METODO PARA SU PRODUCCION Y DISPOSITIVOS ELECTRONICOS ASI REVESTIDOS. ESTA INVENCION SE REFIERE A MATERIALES PRODUCIDOS DILUYENDO EN UN DISOLVENTE UNA MEZCLA PRECERAMICA DE UNA RESINA DE HIDROGENO SILSESQUIOXANO Y UN PRECURSOR DE OXIDO METALICO SELECCIONADO DEL GRUPO FORMADO POR UN ALCOXIDO DE ALUMINIO, UN ALCOXIDO DE TITANIO Y UN ALCOXIDO DE ZIRCONIO. LA SOLUCION DE LA MEZCLA PRECERAMICA EN EL DISOLVENTE SE APLICA A UN SUSTRATO Y SE CERAMIFICA APLICANDO CALOR. SOBRE EL REVESTIMIENTO DE SIO2/OXIDO METALICO CERAMIFICADO, SE PUEDEN APLICAR UNO O MAS REVESTIMIENTOS CERAMICOS QUE CONTIENEN SILICIO Y CARBONO, SILICIO Y NITROGENO, O SILICIO, CARBONO Y NITROGENO. PARA CONSEGUIR UNA MEJOR PROTECCION, SE PUEDE APLICAR UN ULTIMO REVESTIMIENTO MEDIANTE CVD O PECVD. LA INVENCION ES PARTICULARMENTE UTIL PARA REVESTIR DISPOSITIVOS ELECTRONICOS.
ES8703427A 1986-12-04 1987-11-30 Revestimientos ceramicos, metodo para su produccion y dispositivos electronicos asi revestidos. . Expired ES2010233A6 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/938,677 US4753855A (en) 1986-12-04 1986-12-04 Multilayer ceramic coatings from metal oxides for protection of electronic devices

Publications (1)

Publication Number Publication Date
ES2010233A6 true ES2010233A6 (es) 1989-11-01

Family

ID=25471786

Family Applications (1)

Application Number Title Priority Date Filing Date
ES8703427A Expired ES2010233A6 (es) 1986-12-04 1987-11-30 Revestimientos ceramicos, metodo para su produccion y dispositivos electronicos asi revestidos. .

Country Status (7)

Country Link
US (1) US4753855A (es)
EP (1) EP0270263B1 (es)
JP (1) JPH0646631B2 (es)
KR (1) KR950014274B1 (es)
CA (1) CA1329736C (es)
DE (1) DE3789605T2 (es)
ES (1) ES2010233A6 (es)

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US6914114B2 (en) 2000-07-17 2005-07-05 Honeywell International Inc. Absorbing compounds for spin-on-glass anti-reflective coatings for photolithography

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US5661092A (en) * 1995-09-01 1997-08-26 The University Of Connecticut Ultra thin silicon oxide and metal oxide films and a method for the preparation thereof
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US6177199B1 (en) 1999-01-07 2001-01-23 Alliedsignal Inc. Dielectric films from organohydridosiloxane resins with low organic content
EP1190277B1 (en) * 1999-06-10 2009-10-07 AlliedSignal Inc. Semiconductor having spin-on-glass anti-reflective coatings for photolithography
US6472076B1 (en) 1999-10-18 2002-10-29 Honeywell International Inc. Deposition of organosilsesquioxane films
US6440550B1 (en) * 1999-10-18 2002-08-27 Honeywell International Inc. Deposition of fluorosilsesquioxane films
US8053159B2 (en) 2003-11-18 2011-11-08 Honeywell International Inc. Antireflective coatings for via fill and photolithography applications and methods of preparation thereof
KR20070008546A (ko) * 2003-12-18 2007-01-17 하이브리드 플라스틱스 인코포레이티드 코팅, 복합재 및 첨가제로서의 다면체 올리고머실세스퀴옥산 및 금속화 다면체 올리고머 실세스퀴옥산
US7380412B2 (en) 2004-07-21 2008-06-03 Donna Roth Food storage system
US8011205B2 (en) 2004-12-27 2011-09-06 Cool Gear International, Llc Food storage system
US7170093B2 (en) * 2004-11-05 2007-01-30 Xerox Corporation Dielectric materials for electronic devices
US8642246B2 (en) 2007-02-26 2014-02-04 Honeywell International Inc. Compositions, coatings and films for tri-layer patterning applications and methods of preparation thereof
WO2008122292A1 (en) * 2007-04-04 2008-10-16 Ecole Polytechnique Federale De Lausanne (Epfl) Diffusion-barrier coating for protection of moisture and oxygen sensitive devices
US9953952B2 (en) * 2008-08-20 2018-04-24 Infineon Technologies Ag Semiconductor device having a sealant layer including carbon directly contact the chip and the carrier
US8557877B2 (en) 2009-06-10 2013-10-15 Honeywell International Inc. Anti-reflective coatings for optically transparent substrates
US8840970B2 (en) * 2011-01-16 2014-09-23 Sigma Laboratories Of Arizona, Llc Self-assembled functional layers in multilayer structures
US8864898B2 (en) 2011-05-31 2014-10-21 Honeywell International Inc. Coating formulations for optical elements
TWI633640B (zh) 2013-12-16 2018-08-21 新力股份有限公司 Semiconductor element, method of manufacturing semiconductor element, and electronic device
JP6803842B2 (ja) 2015-04-13 2020-12-23 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． オプトエレクトロニクス用途のためのポリシロキサン製剤及びコーティング
CN109427692B (zh) * 2017-08-23 2020-11-20 Tcl科技集团股份有限公司 封装薄膜及其应用
FI129480B (en) * 2018-08-10 2022-03-15 Pibond Oy Silanol-containing organic-inorganic hybrid coatings for high resolution patterning
KR102946062B1 (ko) * 2021-12-24 2026-04-01 삼성전기주식회사 적층형 전자 부품
US20240026186A1 (en) * 2022-07-25 2024-01-25 Vapor Technologies, Inc. Coated article with quasi-ceramic basecoat cured at low temperatures

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6914114B2 (en) 2000-07-17 2005-07-05 Honeywell International Inc. Absorbing compounds for spin-on-glass anti-reflective coatings for photolithography

Also Published As

Publication number Publication date
US4753855A (en) 1988-06-28
EP0270263A3 (en) 1989-12-13
JPH0646631B2 (ja) 1994-06-15
JPS63152131A (ja) 1988-06-24
KR950014274B1 (ko) 1995-11-24
CA1329736C (en) 1994-05-24
DE3789605D1 (de) 1994-05-19
DE3789605T2 (de) 1994-11-03
EP0270263A2 (en) 1988-06-08
EP0270263B1 (en) 1994-04-13
KR880008443A (ko) 1988-08-31

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Legal Events

Date Code Title Description
SA6 Expiration date (snapshot 920101)

Free format text: 2007-11-30