ES2024660B3 - Modulo de potencia para equipos automoviles. - Google Patents

Modulo de potencia para equipos automoviles.

Info

Publication number
ES2024660B3
ES2024660B3 ES88401126T ES88401126T ES2024660B3 ES 2024660 B3 ES2024660 B3 ES 2024660B3 ES 88401126 T ES88401126 T ES 88401126T ES 88401126 T ES88401126 T ES 88401126T ES 2024660 B3 ES2024660 B3 ES 2024660B3
Authority
ES
Spain
Prior art keywords
power module
automobile equipment
automobile
equipment
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES88401126T
Other languages
English (en)
Inventor
Jean-Louis Boucheron
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Electronique SA
Original Assignee
Valeo Electronique SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Electronique SA filed Critical Valeo Electronique SA
Application granted granted Critical
Publication of ES2024660B3 publication Critical patent/ES2024660B3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
ES88401126T 1987-05-15 1988-05-09 Modulo de potencia para equipos automoviles. Expired - Lifetime ES2024660B3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8706837A FR2615347B1 (fr) 1987-05-15 1987-05-15 Module de puissance pour equipements automobiles

Publications (1)

Publication Number Publication Date
ES2024660B3 true ES2024660B3 (es) 1992-03-01

Family

ID=9351130

Family Applications (1)

Application Number Title Priority Date Filing Date
ES88401126T Expired - Lifetime ES2024660B3 (es) 1987-05-15 1988-05-09 Modulo de potencia para equipos automoviles.

Country Status (4)

Country Link
EP (1) EP0291400B1 (es)
DE (1) DE3863390D1 (es)
ES (1) ES2024660B3 (es)
FR (1) FR2615347B1 (es)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01261848A (ja) * 1988-04-13 1989-10-18 Toshiba Corp 半導体装置
EP0489958B1 (de) * 1990-12-12 1994-03-16 Siemens Aktiengesellschaft Leiterplatte für elektronische Steuergeräte und Verfahren zum Herstellen einer solchen Leiterplatte
DE4204391A1 (de) * 1992-02-14 1993-08-19 Rheinmetall Gmbh Leiterkarte fuer eine leistungshalbleiter aufweisende leistungselektronikschaltung
DE4240755A1 (de) * 1992-12-03 1994-06-16 Siemens Ag Steuergerät, insbesondere für ein Kraftfahrzeug
US5272599A (en) * 1993-03-19 1993-12-21 Compaq Computer Corporation Microprocessor heat dissipation apparatus for a printed circuit board
EP0667736B1 (en) * 1994-01-12 1996-12-18 MAGNETEK S.p.A. Laminar board for the production of printed circuits, printed circuit made with the said board, and method for its fabrication
DE19533251A1 (de) * 1995-06-27 1997-01-02 Braun Ag Verfahren zur wärmeleitenden Befestigung eines elektronischen Leistungsbauelementes auf einer Leiterplatte mit einem Kühlblech oder Kühlkörper
ATE203355T1 (de) * 1995-06-27 2001-08-15 Braun Gmbh Wärmeleite-befestigung eines elektronischen leistungsbauelementes auf einer leiterplatte mit kühlblech
DE19748597A1 (de) * 1997-11-04 1998-10-15 Bosch Gmbh Robert Elektrisches Gerät und ein Verfahren zu dessen Herstellung
FR2798814B1 (fr) * 1999-09-22 2001-11-16 Valeo Vision Perfectionnements aux assemblages electroniques a drain thermique, notamment pour module de commande de lampe a decharge de projecteur de vehicule automobile
FR2802714B1 (fr) * 1999-12-21 2002-03-08 Sagem Module electrique de puissance et procede pour sa fabrication
FR2839607B1 (fr) * 2002-05-07 2004-09-10 Univ Angers Assemblage de composants de puissance sur un circuit imprime ainsi qu'un procede d'obtention d'un tel assemblage
FR2872992B1 (fr) * 2004-07-09 2006-09-29 Valeo Vision Sa Assemblage electronique a drain thermique notamment pour module de commande de lampe a decharge de projecteurs de vehicule automobile
EP3805637B1 (en) * 2019-10-07 2025-01-15 Lumileds Holding B.V. Electronic device and method for manufacturing an electronic device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1063226B (de) * 1957-04-26 1959-08-13 Blaupunkt Werke Gmbh Rundfunk- oder Fernsehgeraet mit gedruckten Schaltungen auf Isolierfolie
DE3146504A1 (de) * 1981-11-24 1983-06-01 Siemens AG, 1000 Berlin und 8000 München Kuehlkonzept fuer bausteine mit hoher verlustleistung
FR2520932A1 (fr) * 1982-02-02 1983-08-05 Thomson Csf Support de montage de boitier de circuit integre, a connexions de sorties reparties sur le perimetre du boitier

Also Published As

Publication number Publication date
EP0291400B1 (fr) 1991-06-26
FR2615347A1 (fr) 1988-11-18
DE3863390D1 (de) 1991-08-01
EP0291400A1 (fr) 1988-11-17
FR2615347B1 (fr) 1993-07-23

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