ES2026520T3 - Conjunto de montaje para modulos electronicos. - Google Patents
Conjunto de montaje para modulos electronicos.Info
- Publication number
- ES2026520T3 ES2026520T3 ES87200708T ES87200708T ES2026520T3 ES 2026520 T3 ES2026520 T3 ES 2026520T3 ES 87200708 T ES87200708 T ES 87200708T ES 87200708 T ES87200708 T ES 87200708T ES 2026520 T3 ES2026520 T3 ES 2026520T3
- Authority
- ES
- Spain
- Prior art keywords
- assembly
- heat
- dissiping
- nerves
- brackets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 210000005036 nerve Anatomy 0.000 abstract 2
- 239000000919 ceramic Substances 0.000 abstract 1
- 238000010276 construction Methods 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
Landscapes
- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
UN CONJUNTO DE MONTAJE PARA MODULOS ELECTRONICOS QUE COMPRENDE UNA LAMINA RIGIDA DISIPADORA DE CALOR (26) PARA SOPORTAR UN MODULO ELECTRONICO, LA LAMINA DISIPADORA DE CALOR ESTA FORMADA INTEGRAMENTE ENTRE RANURAS YUXTAPUESTAS EN UN RACK DE MONTAJE Y SUJETADOS ALLI, MEDIANTE ABRAZADERAS ROSCADAS (16,17) QUE SIRVEN PARA MANTENER LOS NERVIOS EN CONTACTO INTIMO CON LAS PAREDES DE LAS RANURAS PARA FACILITAR LA TRANSFERENCIA DE CALOR DESDE LOS NERVIOS HACIA EL RACK MEDIANTE CONDUCCION. ESTA CONSTRUCCION PERMITE MODULOS TALES COMO LAS BALDOSAS CERAMICAS PORTANDO COMPONENTES ELECTRONICOS PARA SER APILADOS EN UN RACK A UNA ALTA DENSIDAD DE EMBALADO, PERMITIENDO BUENA DISIPACION DEL CALOR GENERADO EN SU USO.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8608723A GB2189085B (en) | 1986-04-10 | 1986-04-10 | Electronics module mounting assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2026520T3 true ES2026520T3 (es) | 1992-05-01 |
Family
ID=10595972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES87200708T Expired - Lifetime ES2026520T3 (es) | 1986-04-10 | 1987-04-15 | Conjunto de montaje para modulos electronicos. |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0242005B1 (es) |
| DE (1) | DE3773975D1 (es) |
| ES (1) | ES2026520T3 (es) |
| GB (1) | GB2189085B (es) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4819713A (en) * | 1987-04-23 | 1989-04-11 | Calmark Corporation | Retainer for electronic modules |
| US6545375B2 (en) * | 2001-02-20 | 2003-04-08 | Ralph L. Hollis, Jr. | Field-joinable platen tiles for planar motors |
| NL1022633C2 (nl) | 2003-02-10 | 2004-08-12 | Keltub B V | Verbeterde schuimvormingseenheid. |
| US20080037231A1 (en) * | 2006-08-14 | 2008-02-14 | Honeywell International Inc. | Heat Transferring Guide for Electronic Cards |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2052164B (en) * | 1979-06-30 | 1983-12-07 | Burroughs Corp | Assemblies of electrical components |
| US4298904A (en) * | 1979-12-17 | 1981-11-03 | The Boeing Company | Electronic conduction cooling clamp |
| US4354770A (en) * | 1980-05-19 | 1982-10-19 | The United States Of America As Represented By The Secretary Of The Navy | Wedge assembly |
| US4318157A (en) * | 1980-06-06 | 1982-03-02 | Control Data Corporation | Apparatus for mounting circuit cards |
| GB2102209A (en) * | 1981-07-17 | 1983-01-26 | Marconi Avionics | Clamp arrangements for cooling electrical circuits |
| DE3147790A1 (de) * | 1981-12-03 | 1983-06-09 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungsmodul und verfahren zu seiner herstellung |
| GB2111758B (en) * | 1981-12-17 | 1985-07-31 | Standard Telephones Cables Ltd | Plug in module connector mount |
-
1986
- 1986-04-10 GB GB8608723A patent/GB2189085B/en not_active Expired
-
1987
- 1987-04-15 ES ES87200708T patent/ES2026520T3/es not_active Expired - Lifetime
- 1987-04-15 DE DE8787200708T patent/DE3773975D1/de not_active Expired - Fee Related
- 1987-04-15 EP EP19870200708 patent/EP0242005B1/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB2189085B (en) | 1989-11-22 |
| EP0242005A3 (en) | 1988-05-11 |
| GB8608723D0 (en) | 1986-05-14 |
| EP0242005B1 (en) | 1991-10-23 |
| EP0242005A2 (en) | 1987-10-21 |
| DE3773975D1 (de) | 1991-11-28 |
| GB2189085A (en) | 1987-10-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG2A | Definitive protection |
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