ES2034086T3 - CONTINUOUS OVEN TO SOLDER ELECTRONIC COMPONENTS. - Google Patents

CONTINUOUS OVEN TO SOLDER ELECTRONIC COMPONENTS.

Info

Publication number
ES2034086T3
ES2034086T3 ES198888115396T ES88115396T ES2034086T3 ES 2034086 T3 ES2034086 T3 ES 2034086T3 ES 198888115396 T ES198888115396 T ES 198888115396T ES 88115396 T ES88115396 T ES 88115396T ES 2034086 T3 ES2034086 T3 ES 2034086T3
Authority
ES
Spain
Prior art keywords
zone
soldering
electronic components
conveyor belt
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES198888115396T
Other languages
Spanish (es)
Inventor
Norbert Mittelstadt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heraeus Quarzglas GmbH and Co KG
Original Assignee
Heraeus Quarzglas GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Quarzglas GmbH and Co KG filed Critical Heraeus Quarzglas GmbH and Co KG
Application granted granted Critical
Publication of ES2034086T3 publication Critical patent/ES2034086T3/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0053—Soldering by means of radiant energy soldering by means of infrared [IR]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Tunnel Furnaces (AREA)

Abstract

Continuous ovens are known for soldering electronic components on circuit boards, with a conveyor belt having supports for the circuit boards, and having infrared radiators disposed in a spaced-apart relationship along the conveyor belt above and/or below the plane of belt movement, which are associated with at least one preheating zone and, following this zone in the direction of movement of the belt, with a soldering zone. To develop a continuous oven such that the temperatures between large and small components to be soldered on circuit board will be nearer one another in the soldering zone than in conventional ovens, a cooling zone is disposed between the preheating zone and the soldering zone, in which a forced cooling is performed with a gaseous coolant which is driven by a blower through nozzles disposed in the cooling zone substantially perpendicularly to the plane of the conveyor belt.
ES198888115396T 1987-11-07 1988-09-20 CONTINUOUS OVEN TO SOLDER ELECTRONIC COMPONENTS. Expired - Lifetime ES2034086T3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3738136A DE3738136C1 (en) 1987-11-07 1987-11-07 Continuous furnace for soldering electronic components

Publications (1)

Publication Number Publication Date
ES2034086T3 true ES2034086T3 (en) 1993-04-01

Family

ID=6340188

Family Applications (1)

Application Number Title Priority Date Filing Date
ES198888115396T Expired - Lifetime ES2034086T3 (en) 1987-11-07 1988-09-20 CONTINUOUS OVEN TO SOLDER ELECTRONIC COMPONENTS.

Country Status (6)

Country Link
US (1) US4915624A (en)
EP (1) EP0315762B1 (en)
JP (1) JPH01138059A (en)
AT (1) ATE78739T1 (en)
DE (2) DE3738136C1 (en)
ES (1) ES2034086T3 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3808073C2 (en) * 1988-03-11 1994-01-13 Lothar Himmelreich Infrared soldering furnace for reflow soldering of electronic components on printed circuit boards
DE3841447C1 (en) * 1988-12-09 1990-08-02 Heraeus Quarzschmelze Gmbh, 6450 Hanau, De
JPH0377772A (en) * 1989-08-18 1991-04-03 Aiwa Co Ltd Method and device for infrared heating type reflow soldering
DE4016366C2 (en) * 1990-05-21 1994-04-28 Siemens Nixdorf Inf Syst Method and device for reflow soldering of electronic components on a printed circuit board
DE4126597A1 (en) * 1991-08-10 1993-02-11 Heraeus Quarzglas Heat treatment of units with mounted electrical and electronics - having components on conveyor moved through successive heating and cooling units
DE4302976A1 (en) * 1992-07-22 1994-01-27 Bosch Gmbh Robert Device and method for soldering components on circuit boards
US5868564A (en) * 1992-07-28 1999-02-09 International Business Machines Corporation Sequential step belt furnace with individual concentric heating elements
BE1007867A3 (en) * 1993-12-10 1995-11-07 Koninkl Philips Electronics Nv Method for heating a strip-shaped support in an oven and device for fixing at least one component of a strip-shaped support.
US5421723A (en) * 1994-03-25 1995-06-06 International Business Machines Corporation Sequential step belt furnace with individual concentric cooling elements
DE29617213U1 (en) * 1996-10-02 1997-01-09 SMT Maschinengesellschaft mbH, 97877 Wertheim Reflow soldering system
US6039236A (en) * 1997-06-11 2000-03-21 Soltec B.V. Reflow soldering apparatus with improved cooling
US6768083B2 (en) * 2002-09-19 2004-07-27 Speedline Technologies, Inc. Reflow soldering apparatus and method for selective infrared heating
US8728831B2 (en) * 2010-12-30 2014-05-20 Stmicroelectronics Pte. Ltd. Reconstituted wafer warpage adjustment
DE102011009693A1 (en) * 2011-01-28 2012-08-02 Centrotherm Thermal Solutions Gmbh & Co. Kg Cooling module and device for the thermal treatment of substrates
DE102011056444C5 (en) 2011-12-14 2015-10-15 Voestalpine Metal Forming Gmbh Method and device for partial hardening of sheet metal components
WO2016022755A2 (en) 2014-08-06 2016-02-11 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media
CN118951217B (en) * 2024-08-13 2025-02-14 无锡固翌智能科技有限公司 Vacuum welding automation equipment for semiconductor device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2254769C3 (en) * 1972-11-09 1985-06-05 Vereinigte Aluminium-Werke AG, 1000 Berlin und 5300 Bonn Continuous furnace for flux-free soldering of aluminum materials under protective gas
FR2405448B1 (en) * 1977-10-07 1985-06-28 Welko Ind Spa INSTALLATION FOR CHECKING THE CONDUIT OF ROLLER OVENS FOR THE COOKING OF CERAMIC OR SIMILAR MATERIALS
JPS5897480A (en) * 1981-12-07 1983-06-09 Matsushita Electric Ind Co Ltd Brazing method for pipe material
FR2536160A1 (en) * 1982-11-17 1984-05-18 Piezo Ceram Electronique CONTINUOUS BURNER OF ELECTRONIC COMPONENTS
US4565917B1 (en) * 1984-01-18 1999-06-08 Vitronics Corp Multi-zone thermal process system utilizing nonfocused infared panel emitters
JPS6127485A (en) * 1984-07-17 1986-02-06 中外炉工業株式会社 Continuous type atmosphere heat treatment furnace
JPH0828569B2 (en) * 1985-06-18 1996-03-21 松下電器産業株式会社 Reflow equipment
IT1205512B (en) * 1986-12-30 1989-03-23 Mauro Poppi OVEN FOR COOKING CERAMIC MATERIALS SUCH AS TILES AND SIMILAR

Also Published As

Publication number Publication date
JPH0555226B2 (en) 1993-08-16
EP0315762B1 (en) 1992-07-29
EP0315762A2 (en) 1989-05-17
EP0315762A3 (en) 1990-01-03
ATE78739T1 (en) 1992-08-15
DE3738136C1 (en) 1989-01-26
JPH01138059A (en) 1989-05-30
DE3873266D1 (en) 1992-09-03
US4915624A (en) 1990-04-10

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