ES2034676T3 - Circuito impreso flexible. - Google Patents

Circuito impreso flexible.

Info

Publication number
ES2034676T3
ES2034676T3 ES198989401213T ES89401213T ES2034676T3 ES 2034676 T3 ES2034676 T3 ES 2034676T3 ES 198989401213 T ES198989401213 T ES 198989401213T ES 89401213 T ES89401213 T ES 89401213T ES 2034676 T3 ES2034676 T3 ES 2034676T3
Authority
ES
Spain
Prior art keywords
printed circuit
flexible printed
conductors
contacts
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES198989401213T
Other languages
English (en)
Inventor
Daniel Champagne
Alain Le Loc'h
Olivier Lefort
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bull CP8 SA
Original Assignee
Bull CP8 SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bull CP8 SA filed Critical Bull CP8 SA
Application granted granted Critical
Publication of ES2034676T3 publication Critical patent/ES2034676T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/881—Bump connectors and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/764—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Structure Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

EL CIRCUITO IMPRESO (10) DEL INVENTO ESTA PROVISTO DE CONDUCTORES (14) CONECTADOS A UNOS CONTACTOS (15) REPARTIDOS EN UNA PRIMERA ZONA DE DICHO CIRCUITO IMPRESO Y DESTINADOS A UNA CONEXION HECHA EN UNA SEGUNDA ZONA APARTADA DE LA PRIMERA. SE CARACTERIZA PORQUE LOS CONDUCTORES (14) SALEN DE LOS CONTACTOS RESPECTIVOS (15) SENSIBLEMENTE EN PERPENDICULAR AL EJE (A) DEL CIRCUITO IMPRESO INMEDIATO A LAS DOS ZONAS Y FORMAN POR CONSIGUIENTE UNAS CURVAS O SINUOSIDADES RELATIVAMENTE A ESTE EJE, HASTA LA SEGUNDA ZONA.
ES198989401213T 1988-05-09 1989-04-28 Circuito impreso flexible. Expired - Lifetime ES2034676T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8806201A FR2631200B1 (fr) 1988-05-09 1988-05-09 Circuit imprime souple, notamment pour carte a microcircuits electroniques, et carte incorporant un tel circuit

Publications (1)

Publication Number Publication Date
ES2034676T3 true ES2034676T3 (es) 1993-04-01

Family

ID=9366115

Family Applications (1)

Application Number Title Priority Date Filing Date
ES198989401213T Expired - Lifetime ES2034676T3 (es) 1988-05-09 1989-04-28 Circuito impreso flexible.

Country Status (11)

Country Link
US (1) US4980802A (es)
EP (1) EP0343030B1 (es)
JP (1) JPH06104396B2 (es)
KR (1) KR0162247B1 (es)
AT (1) ATE79504T1 (es)
AU (1) AU626542B2 (es)
CA (1) CA1319430C (es)
DE (1) DE68902421T2 (es)
ES (1) ES2034676T3 (es)
FR (1) FR2631200B1 (es)
HK (1) HK92395A (es)

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BE1002529A6 (nl) * 1988-09-27 1991-03-12 Bell Telephone Mfg Methode om een elektronische component te monteren en geheugen kaart waarin deze wordt toegepast.
US5227338A (en) * 1990-04-30 1993-07-13 International Business Machines Corporation Three-dimensional memory card structure with internal direct chip attachment
FR2671418B1 (fr) * 1991-01-04 1995-03-24 Solais Procede pour la fabrication d'une carte a memoire et carte a memoire ainsi obtenue.
FR2671417B1 (fr) * 1991-01-04 1995-03-24 Solaic Sa Procede pour la fabrication d'une carte a memoire et carte a memoire ainsi obtenue .
US5250758A (en) * 1991-05-21 1993-10-05 Elf Technologies, Inc. Methods and systems of preparing extended length flexible harnesses
FR2684236B1 (fr) * 1991-11-27 1998-08-21 Gemplus Card Int Dispositif de connexion de circuit integre.
JP2745933B2 (ja) * 1992-02-17 1998-04-28 日本電気株式会社 Ｔａｂ−集積回路
DE19512191C2 (de) * 1995-03-31 2000-03-09 Siemens Ag Kartenförmiger Datenträger und Leadframe zur Verwendung in einem solchen Datenträger
DE19516227C2 (de) * 1995-05-03 2002-02-07 Infineon Technologies Ag Datenträgeranordnung, insbesondere Chipkarte
US6441736B1 (en) 1999-07-01 2002-08-27 Keith R. Leighton Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices
US6036099A (en) * 1995-10-17 2000-03-14 Leighton; Keith Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom
US5817207A (en) 1995-10-17 1998-10-06 Leighton; Keith R. Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards
DE19539181C2 (de) * 1995-10-20 1998-05-14 Ods Gmbh & Co Kg Chipkartenmodul sowie entsprechendes Herstellungsverfahren
FR2740887B1 (fr) * 1995-11-08 1997-12-12 Solaic Sa Article a circuit integre
FR2745405B1 (fr) * 1996-02-28 1998-04-10 Solaic Sa Carte a circuit integre comportant des pistes conductrices en polymere conducteur
DE19611237A1 (de) * 1996-03-21 1997-09-25 Siemens Ag Multichipkarte
FR2749976B1 (fr) * 1996-06-18 1998-10-09 Solaic Sa Carte a circuit integre comportant des lignes conductrices subdivisees
NL1003693C2 (nl) * 1996-07-26 1998-01-28 Nederland Ptt Connector gevormd als chipkaart, inrichting voor samenwerking daarmee en inrichting voorzien daarvan.
US6068191A (en) * 1996-08-01 2000-05-30 Siemens Aktiengesellschaft Smart card with card body and semiconductor chip on a leadframe
DE19631166C2 (de) * 1996-08-01 2000-12-07 Siemens Ag Chipkarte
DE19647846C1 (de) * 1996-11-19 1998-03-12 Pav Card Gmbh Verfahren zum Herstellen einer Chipkarte
US6069323A (en) * 1997-01-21 2000-05-30 Dell Usa, L.P. Pad with indentations surface mount
US6008532A (en) * 1997-10-23 1999-12-28 Lsi Logic Corporation Integrated circuit package having bond fingers with alternate bonding areas
DE19803020C2 (de) * 1998-01-27 1999-12-02 Siemens Ag Chipkartenmodul für biometrische Sensoren
FR2794264B1 (fr) * 1999-05-27 2001-11-02 Gemplus Card Int Adaptateur pour dispositif electronique portable a circuit integre, de type carte a puce, d'un format reduit par rapport au format standard d'une mini-carte
AU2002239594A1 (en) * 2000-12-15 2002-06-24 Leonard Reiffel Multi-imager multi-source multi-use coded data source data input product
WO2002086807A1 (en) * 2001-04-19 2002-10-31 Leonard Reiffel Combined imaging coded data source data acquisition
US20060291797A1 (en) * 2003-05-27 2006-12-28 Leonard Reiffel Multi-imager multi-source multi-use coded data source data input product
EP1486911A1 (en) * 2003-06-12 2004-12-15 Axalto S.A. Dielectric separation between inputs/outputs of a smart card
WO2004111926A1 (en) * 2003-06-12 2004-12-23 Axalto Sa Dielectric separation between inputs/outputs of a smart card
US20050023098A1 (en) * 2003-07-01 2005-02-03 Imad Mahawili Energy recovery system
US20090057084A1 (en) * 2004-06-30 2009-03-05 Energy Recovery Technology, Llc Energy recovery system
DE102005038132B4 (de) 2005-08-11 2008-04-03 Infineon Technologies Ag Chipmodul und Chipkarte
US20080048817A1 (en) * 2006-07-26 2008-02-28 Energy Recovery Technology, Llc Circuit module
US20090153099A1 (en) * 2007-12-17 2009-06-18 Energy Recovery Technology, Llc Method of electric energy transfer between a vehicle and a stationary collector
WO2010036914A2 (en) * 2008-09-25 2010-04-01 Energy Recovery Technology, Llc. Vehicle energy recovery system
USD686214S1 (en) * 2011-07-28 2013-07-16 Lifenexus, Inc. Smartcard with iChip contact pad
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
USD707682S1 (en) * 2012-12-05 2014-06-24 Logomotion, S.R.O. Memory card
USD759022S1 (en) 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
USD729808S1 (en) * 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
US9647997B2 (en) 2013-03-13 2017-05-09 Nagrastar, Llc USB interface for performing transport I/O
USD758372S1 (en) * 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
USD780763S1 (en) 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) * 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
CN105335776A (zh) * 2015-09-25 2016-02-17 东莞市锐祥智能卡科技有限公司 一种地铁币的制作方法
CN111083869A (zh) * 2019-12-16 2020-04-28 精电(河源)显示技术有限公司 一种显示屏的柔性电路板
KR102798626B1 (ko) * 2020-10-26 2025-04-23 외티커 엔와이, 인크. 유체 연결 조립체

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Publication number Priority date Publication date Assignee Title
FR87716E (fr) * 1965-04-07 1966-07-22 Cie Des Produits Elementaires Procédé permettant la réalisation de contacts électriques saillants à la surface d'agencements de plaquettes isolantes porteuses de réseaux de conducteurs métalliques
NL191959B (nl) * 1981-03-24 1996-07-01 Gao Ges Automation Org Identificatiekaart met IC-bouwsteen en dragerelement voor een IC-bouwsteen.
CA1242528A (en) * 1984-01-06 1988-09-27 Peter Poetker Data processing card system and method of forming same
US4727246A (en) * 1984-08-31 1988-02-23 Casio Computer Co., Ltd. IC card
JPS61201390A (ja) * 1985-03-04 1986-09-06 Casio Comput Co Ltd Ｉｃカ−ド
FR2581480A1 (fr) * 1985-04-10 1986-11-07 Ebauches Electroniques Sa Unite electronique notamment pour carte a microcircuits et carte comprenant une telle unite
FR2584235B1 (fr) * 1985-06-26 1988-04-22 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
JPS62179994A (ja) * 1986-02-04 1987-08-07 カシオ計算機株式会社 電子カ−ド
FR2620586A1 (fr) * 1987-09-14 1989-03-17 Em Microelectronic Marin Sa Procede de fabrication de modules electroniques, notamment pour cartes a microcircuits

Also Published As

Publication number Publication date
FR2631200A1 (fr) 1989-11-10
FR2631200B1 (fr) 1991-02-08
DE68902421T2 (de) 1993-03-11
JPH06104396B2 (ja) 1994-12-21
KR0162247B1 (ko) 1999-01-15
US4980802A (en) 1990-12-25
AU3402789A (en) 1989-11-09
AU626542B2 (en) 1992-08-06
JPH0217690A (ja) 1990-01-22
EP0343030A1 (fr) 1989-11-23
ATE79504T1 (de) 1992-08-15
DE68902421D1 (de) 1992-09-17
EP0343030B1 (fr) 1992-08-12
CA1319430C (fr) 1993-06-22
KR900019542A (ko) 1990-12-24
HK92395A (en) 1995-06-16

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