ES2051043T3 - Procedimiento para la fabricacion de un dispositivo de bobinas magneticas de hf en el tipo de construccion de chip. - Google Patents

Procedimiento para la fabricacion de un dispositivo de bobinas magneticas de hf en el tipo de construccion de chip.

Info

Publication number
ES2051043T3
ES2051043T3 ES91105864T ES91105864T ES2051043T3 ES 2051043 T3 ES2051043 T3 ES 2051043T3 ES 91105864 T ES91105864 T ES 91105864T ES 91105864 T ES91105864 T ES 91105864T ES 2051043 T3 ES2051043 T3 ES 2051043T3
Authority
ES
Spain
Prior art keywords
manufacture
construction
chip
procedure
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91105864T
Other languages
English (en)
Inventor
Michael Ganslmeier
Horst Wunschmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GW Elektronik GmbH
Original Assignee
GW Elektronik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GW Elektronik GmbH filed Critical GW Elektronik GmbH
Application granted granted Critical
Publication of ES2051043T3 publication Critical patent/ES2051043T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/04—Fixed inductances of the signal type with magnetic core
    • H01F17/06—Fixed inductances of the signal type with magnetic core with core substantially closed in itself, e.g. toroid
    • H01F17/062—Toroidal core with turns of coil around it
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F27/2814—Printed windings with only part of the coil or of the winding in the printed circuit board, e.g. the remaining coil or winding sections can be made of wires or sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

SE TRATA DE UNA DISPOSICION DE BOBINAS MAGNETICAS DE HF, P. EJ. DE TRANSMISORES DE NUCLEOS TOROIDALES, DE CONSTRUCCION EN MINIATURA O CHIPS, DOTADA DE UN CUERPO BASE (1) DE PLASTICO, QUE MUESTRA ESCOTADURAS PARA NUCLEOS MAGNETICOS (2) Y QUE TIENE PLACAS CONDUCTORAS (5) ELECTRICAS EN SUS LADOS SUPERIOR (10) E INFERIOR (11). EN SU INTERIOR SE ENCUENTRAN PERFORACIONES (16) CON CONTACTOS QUE COMUNICAN CON LAS PLACAS CONDUCTORAS (5) DE MODO QUE SE CONFORMAN VUELTAS AISLADAS ALREDEDOR DEL NUCLEO MAGNETICO QUE SE CONVIERTEN EN DEVANADOS DE BOBINAS (6, 7). SE DESCRIBEN ADEMAS PROCEDIMIENTOS QUE PERMITEN UNA FABRICACION DE ESTA DISPOSICION EN GRANDES CANTIDADES.
ES91105864T 1990-09-04 1991-04-12 Procedimiento para la fabricacion de un dispositivo de bobinas magneticas de hf en el tipo de construccion de chip. Expired - Lifetime ES2051043T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4027994A DE4027994A1 (de) 1990-09-04 1990-09-04 Hf-magnetspulenanordnung und verfahren zu ihrer herstellung

Publications (1)

Publication Number Publication Date
ES2051043T3 true ES2051043T3 (es) 1994-06-01

Family

ID=6413554

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91105864T Expired - Lifetime ES2051043T3 (es) 1990-09-04 1991-04-12 Procedimiento para la fabricacion de un dispositivo de bobinas magneticas de hf en el tipo de construccion de chip.

Country Status (6)

Country Link
US (1) US5191699A (es)
EP (1) EP0473875B1 (es)
KR (1) KR920007010A (es)
DE (2) DE4027994A1 (es)
ES (1) ES2051043T3 (es)
HK (1) HK80894A (es)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0845738A (ja) * 1994-07-27 1996-02-16 Canon Inc インダクタンス素子
US5828283A (en) * 1995-12-31 1998-10-27 Daewoo Electronics Co., Ltd. Apparatus for connecting primary conductive lines of flexible transformer
DE19608913A1 (de) * 1996-03-07 1997-09-11 Gw Elektronik Gmbh Hochfrequenzübertrager und Verfahren zu seiner Herstellung
DE19615921A1 (de) * 1996-04-22 1997-10-23 Vacuumschmelze Gmbh Induktives Bauelement in flacher Bauform
EP0884128B1 (en) * 1996-11-20 2007-08-08 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
US7732732B2 (en) * 1996-11-20 2010-06-08 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
JP4030028B2 (ja) * 1996-12-26 2008-01-09 シチズン電子株式会社 Ｓｍｄ型回路装置及びその製造方法
EP0851439B1 (en) * 1996-12-26 2002-03-06 Citizen Electronics Co., Ltd. Modular surface mount circuit device and a manufacturing method thereof
JPH10223447A (ja) * 1997-02-04 1998-08-21 Mitsubishi Electric Corp 有心シート、これを用いたシートコイル、及びこのシートコイルを用いた電気機器
JP3058121B2 (ja) * 1997-05-19 2000-07-04 日本電気株式会社 プリント基板
DE19723068C1 (de) * 1997-06-02 1999-05-12 Vacuumschmelze Gmbh Induktives Bauelement
DE69803014T2 (de) * 1997-07-25 2002-07-04 Tokin Corp., Sendai Magnetischer Fühler mit einer auf den Spulenkörper aufgebrachten lineare Dünnschichtleiterabschnitte aufweisenden Erregerspule mit darauf gewickelter Detektorspule
JP4216917B2 (ja) * 1997-11-21 2009-01-28 Ｔｄｋ株式会社 チップビーズ素子およびその製造方法
US6337571B2 (en) * 1998-11-13 2002-01-08 Tektronix, Inc. Ultra-high-frequency current probe in surface-mount form factor
US6690165B1 (en) 1999-04-28 2004-02-10 Hironori Takahashi Magnetic-field sensing coil embedded in ceramic for measuring ambient magnetic field
KR100443233B1 (ko) * 2001-06-12 2004-08-04 학교법인 청석학원 전원공급 장치용 플라스틱형 코어
US6952153B2 (en) * 2003-02-04 2005-10-04 Raytheon Company Electrical transformer
DE602004028349D1 (de) 2003-03-04 2010-09-09 Rohm & Haas Elect Mat Koaxiale wellenleitermikrostrukturen und verfahern zu ihrer bildung
US6990729B2 (en) * 2003-09-05 2006-01-31 Harris Corporation Method for forming an inductor
US7372886B2 (en) * 2004-06-07 2008-05-13 Avago Technologies Fiber Ip Pte Ltd High thermal conductivity vertical cavity surface emitting laser (VCSEL)
US8350657B2 (en) * 2005-06-30 2013-01-08 Derochemont L Pierre Power management module and method of manufacture
CN101274734A (zh) 2006-12-30 2008-10-01 罗门哈斯电子材料有限公司 三维微结构及其形成方法
US8203418B2 (en) * 2007-01-11 2012-06-19 Planarmag, Inc. Manufacture and use of planar embedded magnetics as discrete components and in integrated connectors
US9070509B2 (en) 2007-01-11 2015-06-30 Tyco Electronics Corporation Method for manufacturing a planar electronic device having a magnetic component
US7304558B1 (en) * 2007-01-18 2007-12-04 Harris Corporation Toroidal inductor design for improved Q
KR101593686B1 (ko) 2007-03-20 2016-02-12 누보트로닉스, 엘.엘.씨 일체화된 전자 요소들 및 이들의 형성 방법
KR101472134B1 (ko) 2007-03-20 2014-12-15 누보트로닉스, 엘.엘.씨 동축 전송선 마이크로구조물 및 그의 형성방법
US20090309687A1 (en) 2008-06-11 2009-12-17 Aleksandar Aleksov Method of manufacturing an inductor for a microelectronic device, method of manufacturing a substrate containing such an inductor, and substrate manufactured thereby,
US20090322460A1 (en) * 2008-06-25 2009-12-31 Lin Hsun-I High-frequency switching-type direct-current rectifier
WO2010065113A1 (en) * 2008-12-03 2010-06-10 Planarmag,Inc. An integrated planar variable transformer with embedded magnetic core
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
US9440378B2 (en) * 2010-05-05 2016-09-13 Tyco Electronics Corporation Planar electronic device and method for manufacturing
US8466769B2 (en) 2010-05-26 2013-06-18 Tyco Electronics Corporation Planar inductor devices
US8358193B2 (en) 2010-05-26 2013-01-22 Tyco Electronics Corporation Planar inductor devices
US8325002B2 (en) * 2010-05-27 2012-12-04 Advanced Semiconductor Engineering, Inc. Power inductor structure
TWI435438B (zh) * 2011-01-28 2014-04-21 Ajoho Entpr Co Ltd Structure and manufacturing method of inductance element
US8866300B1 (en) 2011-06-05 2014-10-21 Nuvotronics, Llc Devices and methods for solder flow control in three-dimensional microstructures
US8814601B1 (en) 2011-06-06 2014-08-26 Nuvotronics, Llc Batch fabricated microconnectors
EP2731783A4 (en) 2011-07-13 2016-03-09 Nuvotronics Llc METHOD FOR PRODUCING ELECTRONIC AND MECHANICAL STRUCTURES
DE102012213263A1 (de) * 2011-09-20 2013-03-21 Robert Bosch Gmbh Handwerkzeugvorrichtung mit zumindest einer Ladespule
US8766759B2 (en) * 2012-10-01 2014-07-01 Zippy Technology Corp. Transformer
TWI546000B (zh) * 2012-10-02 2016-08-11 健鼎科技股份有限公司 電路板封裝結構及其製造方法
CN103854838B (zh) * 2012-12-03 2017-02-08 上海卓凯电子科技有限公司 平面式磁性元件及其制造方法
US9325044B2 (en) 2013-01-26 2016-04-26 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
WO2015109208A2 (en) 2014-01-17 2015-07-23 Nuvotronics, Llc Wafer scale test interface unit: low loss and high isolation devices and methods for high speed and high density mixed signal interconnects and contactors
JP6323213B2 (ja) * 2014-06-26 2018-05-16 株式会社村田製作所 コイルモジュール
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
TWI559341B (zh) * 2014-11-28 2016-11-21 矽品精密工業股份有限公司 電子封裝件
US10511073B2 (en) 2014-12-03 2019-12-17 Cubic Corporation Systems and methods for manufacturing stacked circuits and transmission lines
WO2016111282A1 (ja) 2015-01-07 2016-07-14 株式会社村田製作所 コイル部品
WO2017147129A1 (en) 2016-02-24 2017-08-31 Murata Manufacturing Co., Ltd. Substrate-embedded transformer with improved isolation
SK289113B6 (sk) * 2016-09-19 2023-09-13 Logomotion, S.R.O Anténa sjadrom, najmä miniatúrna RFID a/alebo NFC anténa, a spôsob jej výroby
DE102016119164A1 (de) 2016-10-10 2018-04-12 Phoenix Contact Gmbh & Co. Kg Planarer Übertrager mit integriertem Ringkern
US10395816B2 (en) * 2017-11-03 2019-08-27 Ajoho Enterprise Co., Ltd. Magnetic device fabrication method
EP3483905B1 (en) * 2017-11-10 2020-07-15 ABB Schweiz AG Choke
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
WO2024000230A1 (zh) * 2022-06-29 2024-01-04 京东方科技集团股份有限公司 电感及其制备方法、滤波器、电子设备
CN115154746A (zh) * 2022-07-14 2022-10-11 湖南千山医疗器械有限公司 芯片级驱动胰岛素泵

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3477051A (en) * 1967-12-26 1969-11-04 Ibm Die casting of core windings
FR96356E (es) * 1968-01-15 1972-06-16
US4536733A (en) * 1982-09-30 1985-08-20 Sperry Corporation High frequency inverter transformer for power supplies
DE3322004A1 (de) * 1983-06-18 1984-12-20 Robert Bosch Gmbh, 7000 Stuttgart Induktives element, insbesondere uebertrager
DE3425153A1 (de) * 1984-07-07 1986-01-16 Robert Bosch Gmbh, 7000 Stuttgart Elektrischer uebertrager
DD245296A1 (de) * 1985-12-30 1987-04-29 Inst Prueffeld Elekt Toroidspule mit duennwandigem wickelkoerper
JPH01278707A (ja) * 1988-04-30 1989-11-09 Taiyo Yuden Co Ltd チップ形状インダクタとその製法

Also Published As

Publication number Publication date
US5191699A (en) 1993-03-09
EP0473875A1 (de) 1992-03-11
DE4027994A1 (de) 1992-03-05
HK80894A (en) 1994-08-19
DE59100992D1 (de) 1994-03-17
KR920007010A (ko) 1992-04-28
EP0473875B1 (de) 1994-02-02

Similar Documents

Publication Publication Date Title
ES2101941T3 (es) Elementos de circuito dependientes de la inductancia del nucleo y fabricacion de los mismos.
EP0110997A4 (en) Semiconductor device package.
ES521113A0 (es) Procedimiento para la fabricacion de dispositivos de circuitos integrados complementarios.
FR2854745B1 (fr) Circuit electronique a transformateur piezo-electrique integre
ITMI913266A1 (it) Dispositivo semiconduttore incapsulato in resina e elettricamente isolato di migliorate caratteristiche di isolamento, e relativo processo di fabbricazione
PL198146A1 (pl) Lacznik elektryczny oraz sposob wytwarzania lacznika elektrycznego
ATE348416T1 (de) Induktives miniatur-bauelement, insbesondere antenne
ES2018626B3 (es) Cartucho de recepcion de un broche para realizar una conexion electrica y conectador comportando al menos un cartucho como este
NO862853D0 (no) Fremgangsmaate for fremstilling av askefattig og elektrisk ledende sot.
DE3586395D1 (de) Tastschalter.
JPS5321549A (en) Microwave integrated circuit
NO841047L (no) Plateholder, spesielt for rf-moensterkort, samt fremgangsmaate til fremstilling av denne
ES2035710T3 (es) Bobina de encendido.
ES8102973A1 (es) Un dispositivo de soporte de bobinas para uso en el apilami-ento de bobinas toroidales en relacion axialmente alineada
DE3366418D1 (de) Electrical transformer
IT1138586B (it) Circuito stampato e relativo procedimento di fabbricazione
ES2085507T3 (es) Bobina de circuito oscilante para un oscilador controlado por campo magnetico.
DE3888149D1 (de) Weichmagnetisches Eisen-Kobalt-Material.
DE3779608D1 (de) Stromkompensierte drossel zur funk-entstoerung.
JPS6425497A (en) Inductance element
IT1187602B (it) Interruttore universale a linguette contattori integrali
FR2363874A2 (fr) Transformateur de puissance haute-frequence a large bande
IT8319237A0 (it) Procedimento per la fabbricazione di dispositivi a circuiti integrati a semiconduttori.
DE3669615D1 (de) Elektronen-zyklotron-resonanz-ionenquelle.
DE3880604D1 (de) Elektromagnetischer ausloeser eines niederspannungs-schaltgeraetes.

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 473875

Country of ref document: ES