ES2060159T3 - Metodo y composicion para proteger y mejorar la soldadura de superficies metalicas. - Google Patents

Metodo y composicion para proteger y mejorar la soldadura de superficies metalicas.

Info

Publication number
ES2060159T3
ES2060159T3 ES90906556T ES90906556T ES2060159T3 ES 2060159 T3 ES2060159 T3 ES 2060159T3 ES 90906556 T ES90906556 T ES 90906556T ES 90906556 T ES90906556 T ES 90906556T ES 2060159 T3 ES2060159 T3 ES 2060159T3
Authority
ES
Spain
Prior art keywords
welding
metallic surface
protect
composition
improve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES90906556T
Other languages
English (en)
Inventor
Alfred F Kaspaul
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Application granted granted Critical
Publication of ES2060159T3 publication Critical patent/ES2060159T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Nonmetallic Welding Materials (AREA)

Abstract

UN METODO Y COMPOSICION PARA PROTEGER Y MEJORAR LA CAPACIDAD DE SOLDADURA DE UNA SUPERFICIE METALICA. SE APLICA UNA MEZCLA QUE INCLUYE UN MATERIAL PROTECTOR ELEGIDO Y UN AGENTE DE CIRCULACION DE ACIDO DICARBOXILICO A LA SUPERFICIE METALICA PARA FORMAR UNA PELICULA O RECUBRIMIENTO PROTECTOR QUE MEJORE TAMBIEN LA CAPACIDAD DE SOLDADURA DE LA SUPERFICIE METALICA. LA MEZCLA SE APLICA A LA SUPERFICIE METALICA COMO UNA SOLUCION QUE TIENE UN TRANSPORTADOR DE DISOLVENTE QUE SE EVAPORA PARA DEJAR LA PELICULA. LA PELICULA SE ACTIVA POR CALOR A TEMPERATURAS DE SOLDADURA PARA LIBERAR EL AGENTE DE CIRCULACION.
ES90906556T 1989-04-11 1990-02-23 Metodo y composicion para proteger y mejorar la soldadura de superficies metalicas. Expired - Lifetime ES2060159T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US33617889A 1989-04-11 1989-04-11

Publications (1)

Publication Number Publication Date
ES2060159T3 true ES2060159T3 (es) 1994-11-16

Family

ID=23314909

Family Applications (1)

Application Number Title Priority Date Filing Date
ES90906556T Expired - Lifetime ES2060159T3 (es) 1989-04-11 1990-02-23 Metodo y composicion para proteger y mejorar la soldadura de superficies metalicas.

Country Status (14)

Country Link
EP (1) EP0423286B1 (es)
JP (1) JPH0822473B2 (es)
KR (1) KR930006435B1 (es)
AU (1) AU612075B2 (es)
CA (1) CA2027570C (es)
DE (1) DE69012941T2 (es)
DK (1) DK0423286T3 (es)
ES (1) ES2060159T3 (es)
GR (1) GR1000702B (es)
IL (1) IL93537A (es)
MY (1) MY105262A (es)
NO (1) NO905310D0 (es)
TR (1) TR25823A (es)
WO (1) WO1990011867A1 (es)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5177134A (en) * 1990-12-03 1993-01-05 Motorola, Inc. Tacking agent
US6796482B2 (en) 2002-10-31 2004-09-28 Freescale Semiconductor, Inc. Phase separated system for fluxing
DE10314700A1 (de) * 2003-03-31 2004-10-14 Behr Gmbh & Co. Kg Verfahren zur Herstellung oberflächenmodifizierter Werkstücke
JP2008062253A (ja) * 2006-09-05 2008-03-21 Denso Corp はんだ付け用フラックスおよびはんだペースト組成物
JP2014168791A (ja) * 2013-03-01 2014-09-18 Hitachi Chemical Co Ltd フラックスフィルム、フリップチップ接続方法、及び半導体装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR879907A (fr) * 1941-04-15 1943-03-09 Fides Gmbh Résine synthétique pour soudure
US2715616A (en) * 1951-12-20 1955-08-16 Robert M Macintosh Organic coating for wire
US2898255A (en) * 1958-06-30 1959-08-04 Ibm Soldering flux composition
GB1050444A (en) * 1962-06-13 1966-12-07 Libbey-Owens-Ford Glass Co. Method of soldering and fluxing composition therefor
JPS4855854A (es) * 1971-11-17 1973-08-06
US3977916A (en) * 1974-12-20 1976-08-31 Chevron Research Company Wax-flux composition containing alkylaryl sulfonic acid for soldering
US3960614A (en) * 1975-01-31 1976-06-01 Chevron Research Company Wax-flux composition containing a diester of sulfomaleic acid for soldering
AT356776B (de) * 1977-09-19 1980-05-27 Herberts & Co Gmbh Verfahren zur herstellung von elektrisch isolierenden, hochflexiblen und/oder loetfaehigen ueberzuegen
DE2828197A1 (de) * 1978-06-27 1980-01-03 Winchester Electronics Gmbh Halogenfreies flussmittel fuer die weichloetung auf kolophoniumbasis
JPS5592293A (en) * 1978-12-28 1980-07-12 Sanwa Kagaku Kogyo Kk Solid flux for soldering
JPS5649680A (en) * 1979-09-27 1981-05-06 Toshiba Electric Equip Corp Power source device
DE3205315A1 (de) * 1982-02-15 1983-08-25 Siemens AG, 1000 Berlin und 8000 München Flussmittel zur verwendung beim weichloeten
JPS6216899A (ja) * 1985-07-15 1987-01-26 Asahi Kagaku Kenkyusho:Kk 水溶性フラツクス
GB8628916D0 (en) * 1986-12-03 1987-01-07 Multicore Solders Ltd Solder composition
JP5649680B2 (ja) 2013-03-25 2015-01-07 株式会社ミツバ アクチュエータ

Also Published As

Publication number Publication date
KR930006435B1 (ko) 1993-07-16
AU612075B2 (en) 1991-06-27
IL93537A (en) 1992-11-15
GR1000702B (el) 1992-10-08
GR900100172A (en) 1991-09-27
NO905310L (no) 1990-12-07
KR920700092A (ko) 1992-02-19
TR25823A (tr) 1993-09-01
JPH03505305A (ja) 1991-11-21
DE69012941D1 (de) 1994-11-03
AU5438190A (en) 1990-11-05
DK0423286T3 (da) 1994-10-24
DE69012941T2 (de) 1995-03-02
WO1990011867A1 (en) 1990-10-18
EP0423286B1 (en) 1994-09-28
IL93537A0 (en) 1990-11-29
NO905310D0 (no) 1990-12-07
EP0423286A1 (en) 1991-04-24
CA2027570C (en) 1998-05-12
MY105262A (en) 1994-09-30
CA2027570A1 (en) 1990-10-12
JPH0822473B2 (ja) 1996-03-06

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