ES2066424T3 - Dispositivo para el apantallado de lineas de campo en una instalacion galvanica. - Google Patents

Dispositivo para el apantallado de lineas de campo en una instalacion galvanica.

Info

Publication number
ES2066424T3
ES2066424T3 ES91904170T ES91904170T ES2066424T3 ES 2066424 T3 ES2066424 T3 ES 2066424T3 ES 91904170 T ES91904170 T ES 91904170T ES 91904170 T ES91904170 T ES 91904170T ES 2066424 T3 ES2066424 T3 ES 2066424T3
Authority
ES
Spain
Prior art keywords
screens
galvanic
facility
field lines
screening field
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91904170T
Other languages
English (en)
Inventor
Rudolf Kauper
Gerhard Wilhelm
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Application granted granted Critical
Publication of ES2066424T3 publication Critical patent/ES2066424T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/07—Current distribution within the bath

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Coating With Molten Metal (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)

Abstract

LA INVENCION ESTA BASADA EN UN DISPOSITIVO PARA ENMASCARAR LAS LINEAS DE CAMPO EN UNA INSTALACION GALVANICA PARA EL TRATAMIENTO DE PIEZAS ESENCIALMENTE EN FORMA DE PLACAS, QUE SE INTRODUCEN EN UN BAÑO SUSPENDIDAS DE UN PORTAPIEZAS, EN DONDE ESTA PREVISTA UNA TAPA CONDUCIDA EN DIRECCION VERTICAL REGULABLE EN EL RECIPIENTE DE BAÑO. PARA PODER REALIZAR LA REGULACION DE LA TAPA EN DIRECCION VERTICAL SIN TENER EN CUENTA LA CONFIGURACION Y ESPECIALMENTE EL GROSOR DE LA PIEZA A TRATAR ASI COMO SU SUJECION EN EL PORTAPIEZAS, Y EN DONDE, ADEMAS, SE PUEDA CUBRIR OPCIONALMENTE LA(S) TAPA(S) MENCIONADA(S) LA ZONA INFERIOR O LA SUPERIOR DE LA PIEZA A TRATAR O DE LAS PIEZAS A TRATAR, ESTA PREVISTO QUE EN EL PORTAPIEZAS (6) HAYA DISPUESTO UN SUJETADOR (21) REGULABLE EN ALTURA Y QUE SE PUEDA FIJAR EN CUALQUIER POSICION (24), QUE MUEVE A UNA POSICION PRESELECCIONADA LAS TAPAS (12, 13; 14, 15) DISPUESTAS LATERALMENTE A LAS PIEZAS A GALVANIZAR (5) AL COLOCAR EL PORTAPIEZAS (6) EN LA ESTACION DE TRATAMIENTO (1).
ES91904170T 1990-02-20 1991-02-19 Dispositivo para el apantallado de lineas de campo en una instalacion galvanica. Expired - Lifetime ES2066424T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4005209A DE4005209A1 (de) 1990-02-20 1990-02-20 Vorrichtung zum abblenden von feldlinien in einer galvanikanlage

Publications (1)

Publication Number Publication Date
ES2066424T3 true ES2066424T3 (es) 1995-03-01

Family

ID=6400509

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91904170T Expired - Lifetime ES2066424T3 (es) 1990-02-20 1991-02-19 Dispositivo para el apantallado de lineas de campo en una instalacion galvanica.

Country Status (8)

Country Link
US (1) US5401370A (es)
EP (1) EP0516670B1 (es)
JP (1) JPH05504601A (es)
AT (1) ATE117028T1 (es)
CA (1) CA2076365A1 (es)
DE (3) DE9007542U1 (es)
ES (1) ES2066424T3 (es)
WO (1) WO1991013190A1 (es)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4106733A1 (de) * 1991-03-02 1992-09-03 Schering Ag Vorrichtung zum abblenden von feldlinien in einer galvanikanlage (iii)
DE9309768U1 (de) * 1993-07-01 1993-11-04 Metzka GmbH, 90596 Schwanstetten Kontaktiereinrichtung für ein Leiterplattengestell einer Galvanikanlage
GB9325297D0 (en) 1993-12-10 1994-02-16 Process Automation Internation Improvements in or relating to clamps and the use thereof
US6168691B1 (en) * 1996-08-09 2001-01-02 Atotech Deutschland Gmbh Device for electrochemical treatment of elongate articles
US5788829A (en) * 1996-10-16 1998-08-04 Mitsubishi Semiconductor America, Inc. Method and apparatus for controlling plating thickness of a workpiece
US6132583A (en) * 1997-05-16 2000-10-17 Technic, Inc. Shielding method and apparatus for use in electroplating process
DE19736352C1 (de) * 1997-08-21 1998-12-10 Atotech Deutschland Gmbh Vorrichtung zur Kontaktierung von flachem Behandlungsgut in Durchlaufgalvanisieranlagen
US6274010B1 (en) 1997-10-07 2001-08-14 Process Automation International Limited Electroplating apparatus
GB2330151A (en) * 1997-10-07 1999-04-14 Process Automation Internation An electroplating apparatus with movable diaphragms
DE19932785C1 (de) * 1999-07-14 2000-11-16 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum präzisen Justieren von Abschirmmasken bei der elektrochemischen Behandlung von stabförmigem Behandlungsgut
DE19951324C2 (de) 1999-10-20 2003-07-17 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Oberflächen von gegeneinander vereinzelten Platten- und Folienmaterialstücken sowie Anwendung des Verfahrens
US6294060B1 (en) 1999-10-21 2001-09-25 Ati Properties, Inc. Conveyorized electroplating device
US6811669B2 (en) * 2002-08-08 2004-11-02 Texas Instruments Incorporated Methods and apparatus for improved current density and feature fill control in ECD reactors
US7097749B2 (en) * 2002-10-08 2006-08-29 Lacks Enterprises, Inc. Plating rack with rotatable insert
CN101343771B (zh) * 2007-07-13 2010-10-06 富葵精密组件(深圳)有限公司 电镀装置
CN110592652A (zh) * 2019-09-03 2019-12-20 昆山东威科技股份有限公司 遮蔽组件及其应用的电解装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2859166A (en) * 1955-09-15 1958-11-04 Pennsalt Chemicals Corp Shielding means for effecting uniform plating of lead dioxide in the formation of lead dioxide electrodes
US3090823A (en) * 1959-09-25 1963-05-21 Ford Motor Co Tank for forming battery elements
CA971505A (en) * 1970-09-04 1975-07-22 International Nickel Company Of Canada Electrowinning metal utilizing higher current densities on upper surfaces
US3862891A (en) * 1973-09-24 1975-01-28 Gte Automatic Electric Lab Inc Uniform plating current apparatus and method
US4113586A (en) * 1977-10-25 1978-09-12 Kennecott Copper Corporation Method and apparatus for the electrolytic recovery of metal employing electrolyte convection
JPS55145199A (en) * 1979-04-25 1980-11-12 Hitachi Ltd Shielding board for plating
DE3027751A1 (de) * 1980-07-22 1982-02-18 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum galvanischen metallisieren von substraten
DE3726571C1 (en) * 1987-08-10 1989-03-23 Siemens Ag Screening and positioning frame
US4879007B1 (en) * 1988-12-12 1999-05-25 Process Automation Int L Ltd Shield for plating bath

Also Published As

Publication number Publication date
DE4005209A1 (de) 1991-08-22
DE59104260D1 (de) 1995-02-23
DE4005209C2 (es) 1992-02-13
ATE117028T1 (de) 1995-01-15
DE9007542U1 (de) 1992-06-25
EP0516670B1 (de) 1995-01-11
JPH05504601A (ja) 1993-07-15
CA2076365A1 (en) 1991-08-21
EP0516670A1 (de) 1992-12-09
WO1991013190A1 (de) 1991-09-05
US5401370A (en) 1995-03-28

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