ES2066477T3 - ACID BATHROOM FOR THE ELECTRODEPOSICION OF COPPER COATINGS AND PROCEDURE WITH USE OF THIS COMBINATION. - Google Patents

ACID BATHROOM FOR THE ELECTRODEPOSICION OF COPPER COATINGS AND PROCEDURE WITH USE OF THIS COMBINATION.

Info

Publication number
ES2066477T3
ES2066477T3 ES91917496T ES91917496T ES2066477T3 ES 2066477 T3 ES2066477 T3 ES 2066477T3 ES 91917496 T ES91917496 T ES 91917496T ES 91917496 T ES91917496 T ES 91917496T ES 2066477 T3 ES2066477 T3 ES 2066477T3
Authority
ES
Spain
Prior art keywords
electrodeposicion
procedure
combination
copper coatings
bathroom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91917496T
Other languages
Spanish (es)
Inventor
Wolfgang Dahms
Horst Westphal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Application granted granted Critical
Publication of ES2066477T3 publication Critical patent/ES2066477T3/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

The invention concerns an aqueous acid copper-electroplating bath and the use of the bath for the electrolytic deposition of copper.
ES91917496T 1990-10-13 1991-10-11 ACID BATHROOM FOR THE ELECTRODEPOSICION OF COPPER COATINGS AND PROCEDURE WITH USE OF THIS COMBINATION. Expired - Lifetime ES2066477T3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4032864A DE4032864A1 (en) 1990-10-13 1990-10-13 ACIDIC BATH FOR THE GALVANIC DEPOSITION OF COPPER COVERS AND METHODS USING THIS COMBINATION

Publications (1)

Publication Number Publication Date
ES2066477T3 true ES2066477T3 (en) 1995-03-01

Family

ID=6416407

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91917496T Expired - Lifetime ES2066477T3 (en) 1990-10-13 1991-10-11 ACID BATHROOM FOR THE ELECTRODEPOSICION OF COPPER COATINGS AND PROCEDURE WITH USE OF THIS COMBINATION.

Country Status (7)

Country Link
EP (1) EP0554275B1 (en)
JP (1) JPH06501986A (en)
AT (1) ATE115651T1 (en)
CA (1) CA2093924C (en)
DE (2) DE4032864A1 (en)
ES (1) ES2066477T3 (en)
WO (1) WO1992007116A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10261852B3 (en) * 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling
DE10337669B4 (en) * 2003-08-08 2006-04-27 Atotech Deutschland Gmbh Aqueous, acid solution and process for the electrodeposition of copper coatings and use of the solution
DE102004041701A1 (en) * 2004-08-28 2006-03-02 Enthone Inc., West Haven Process for the electrolytic deposition of metals
US7282602B2 (en) * 2004-09-21 2007-10-16 Bionumerik Pharmaceuticals, Inc. Medicinal disulfide salts
KR101362062B1 (en) * 2006-01-27 2014-02-11 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 Additive added to solution for electrolytic copper plating using anode of phosphorated copper, solution for electrolytic copper plating and method of electrolytic copper plating
DE102014208733A1 (en) 2014-05-09 2015-11-12 Dr. Hesse Gmbh & Cie Kg Process for the electrolytic deposition of copper from water-based electrolytes
KR102381803B1 (en) 2016-08-15 2022-04-01 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 Acidic aqueous composition for electrolytic copper plating

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL291575A (en) * 1962-04-16
DE1246347B (en) * 1966-03-08 1967-08-03 Schering Ag Acid galvanic copper bath
DE2039831C3 (en) * 1970-06-06 1979-09-06 Schering Ag, 1000 Berlin Und 4619 Bergkamen Acid bath for the galvanic deposition of shiny copper coatings
NL7510771A (en) * 1975-03-11 1976-09-14 Oxy Metal Industries Corp PROCEDURE FOR ELECTROLYTIC DEPOSITION OF COPPER FROM Aqueous ACID GALVANIZING BATHS.
DE2721985A1 (en) * 1977-05-14 1978-11-16 Bayer Ag PROCESS FOR THE PRODUCTION OF POLYISOCYANATE POLYADDITION PRODUCTS CONTAINING URETHANE AND / OR UREA GROUPS
DE2746938C2 (en) * 1977-10-17 1987-04-09 Schering AG, 1000 Berlin und 4709 Bergkamen Aqueous acid bath for the galvanic deposition of shiny and crack-free copper coatings and use of this bath
US4272335A (en) * 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper
US4374709A (en) * 1980-05-01 1983-02-22 Occidental Chemical Corporation Process for plating polymeric substrates
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
FR2510145B1 (en) * 1981-07-24 1986-02-07 Rhone Poulenc Spec Chim ADDITIVE FOR AN ACID ELECTROLYTIC COPPER BATH, ITS PREPARATION METHOD AND ITS APPLICATION TO COPPER PRINTED CIRCUITS
JPS59501829A (en) * 1982-09-30 1984-11-01 リ−ロ−ナル　インコ−ポレ−テツド electrolytic copper plating solution
DE3402999A1 (en) * 1984-01-28 1985-08-01 Skw Trostberg Ag, 8223 Trostberg Fertiliser solutions
DE3721985A1 (en) * 1987-06-30 1989-01-12 Schering Ag AQUEOUS ACID BATH FOR GALVANIC DEPOSITION OF GLOSSY AND LEVELED COPPER COATINGS

Also Published As

Publication number Publication date
ATE115651T1 (en) 1994-12-15
DE4032864A1 (en) 1992-04-16
CA2093924A1 (en) 1992-04-14
JPH06501986A (en) 1994-03-03
EP0554275A1 (en) 1993-08-11
DE4032864C2 (en) 1993-01-07
DE59103933D1 (en) 1995-01-26
CA2093924C (en) 2002-02-05
EP0554275B1 (en) 1994-12-14
WO1992007116A1 (en) 1992-04-30

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