ES2074662T3 - Circuiteria electroformada tridimensional. - Google Patents

Circuiteria electroformada tridimensional.

Info

Publication number
ES2074662T3
ES2074662T3 ES91307916T ES91307916T ES2074662T3 ES 2074662 T3 ES2074662 T3 ES 2074662T3 ES 91307916 T ES91307916 T ES 91307916T ES 91307916 T ES91307916 T ES 91307916T ES 2074662 T3 ES2074662 T3 ES 2074662T3
Authority
ES
Spain
Prior art keywords
chuck
silvered
circuiteria
electric circuit
wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91307916T
Other languages
English (en)
Inventor
William R Crumly
Christopher M Schreiber
Haim Feigenbaum
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Application granted granted Critical
Publication of ES2074662T3 publication Critical patent/ES2074662T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0117—Pattern shaped electrode used for patterning, e.g. plating or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

SE DESCRIBE UN CONTACTO DE TIPO PRESURIZADO PARA TERMINACIONES FLEXIBLES O CONVENCIONALES DE CABLE QUE SE FABRICA A PARTIR DE OBLEAS METALICAS ELECTROFORMADAS (100) EN QUE UNA OBLEA ES PLATEADA CON UNA SUPERFICIE CONDUCTIVA DE INTERCONEXION (122). EL CIRCUITO ELECTRICO (118, 120) SE REALIZA SOBRE UN MANDRIL DE ACERO INOXIDABLE (10, 10A) QUE TIENE UNA PAUTA DE TEFLON (16, 16A) EN SU SUPERFICIE QUE PERMITE HACER EL CIRCUITO ELECTRICO DESEADO (30, 32, 34, 30A, 32A, 34A) A SER PLATEADO ELECTROLITICAMENTE SOBRE LA SUPERFICIE DEL MANDRIL CONDUCTIVO. LA SUPERFICIE DEL MANDRIL SE FORMA CON SUS PROPIEDADES PROYECTADAS EN FORMA DE UNA DEPRESION (24, 24A) QUE FORMARA UNA SERIE DE PUNTOS O INTERCONEXIONES ELEVADAS SOBRE LA OBLEA FINAL. EL MANDRIL TAMBIEN DISPONE DE POSTES (16) PARA SUMINISTRAR UNA CONEXION ELECTRICA EN EL SUSTRATO.
ES91307916T 1990-09-11 1991-08-29 Circuiteria electroformada tridimensional. Expired - Lifetime ES2074662T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/580,758 US5197184A (en) 1990-09-11 1990-09-11 Method of forming three-dimensional circuitry

Publications (1)

Publication Number Publication Date
ES2074662T3 true ES2074662T3 (es) 1995-09-16

Family

ID=24322444

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91307916T Expired - Lifetime ES2074662T3 (es) 1990-09-11 1991-08-29 Circuiteria electroformada tridimensional.

Country Status (5)

Country Link
US (1) US5197184A (es)
EP (1) EP0476868B1 (es)
JP (1) JPH0758827B2 (es)
DE (1) DE69111004T2 (es)
ES (1) ES2074662T3 (es)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5180311A (en) * 1991-01-22 1993-01-19 Hughes Aircraft Company Resilient interconnection bridge
JPH07105420B2 (ja) * 1991-08-26 1995-11-13 ヒューズ・エアクラフト・カンパニー 成形された接点をもった電気接続
US5334802A (en) * 1992-09-02 1994-08-02 Texas Instruments Incorporated Method and configuration for reducing electrical noise in integrated circuit devices
US5288235A (en) * 1992-12-14 1994-02-22 Hughes Aircraft Company Electrical interconnects having a supported bulge configuration
US5295838A (en) * 1993-01-14 1994-03-22 Hughes Aircraft Company Raised feature/gold dot pressure interconnections of rigid-flex circuits and rigid circuit boards
US5435733A (en) * 1993-11-12 1995-07-25 Hughes Aircraft Company Connector assembly for microelectronic multi-chip-module
CA2135241C (en) * 1993-12-17 1998-08-04 Mohi Sobhani Cavity and bump interconnection structure for electronic packages
US5468917A (en) * 1994-03-23 1995-11-21 International Business Machines Corporation Circuitized structure including flexible circuit with elastomeric member bonded thereto
US6232866B1 (en) 1995-09-20 2001-05-15 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Composite material switches
US5937512A (en) * 1996-01-11 1999-08-17 Micron Communications, Inc. Method of forming a circuit board
US6236445B1 (en) 1996-02-22 2001-05-22 Hughes Electronics Corporation Method for making topographic projections
US5738530A (en) * 1996-05-28 1998-04-14 Packard Hughes Interconnect Company Contact pad having metallically anchored elastomeric electrical contacts
US5747358A (en) * 1996-05-29 1998-05-05 W. L. Gore & Associates, Inc. Method of forming raised metallic contacts on electrical circuits
WO1997046062A1 (en) * 1996-05-29 1997-12-04 W.L. Gore & Associates, Inc. Method of forming raised metallic contacts on electrical circuits for permanent bonding
US6103992A (en) * 1996-11-08 2000-08-15 W. L. Gore & Associates, Inc. Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias
US6246548B1 (en) * 1997-03-24 2001-06-12 Maxtor Corporation Mechanically formed standoffs in a circuit interconnect
US5963426A (en) * 1997-05-19 1999-10-05 Raytheon Company Electronic micropackaging assembly and its fabrication
DK0917167T3 (da) * 1997-07-23 2000-11-06 Molex Inc Elektrisk omskifter og kredløbsstruktur
JPH11238831A (ja) * 1997-12-16 1999-08-31 Shinko Electric Ind Co Ltd テープキャリア及びその製造方法
US6230402B1 (en) * 1999-02-17 2001-05-15 Scitex Digital Printing, Inc. Electrical contact termination for a flexible circuit
GB2352315B (en) 1999-07-19 2003-12-03 Nokia Mobile Phones Ltd Sim card reader
US6849168B2 (en) * 2000-11-13 2005-02-01 Kval, Inc. Electrochemical microsensor package
JP2003344451A (ja) * 2002-05-30 2003-12-03 Advantest Corp プローブカード、プローブカード製造方法、及び接触子
US6898850B2 (en) * 2002-08-06 2005-05-31 Matsushita Electric Industrial Co., Ltd. Method of manufacturing circuit board and communication appliance
US6869291B2 (en) * 2002-09-19 2005-03-22 Delphi Technologies, Inc. Electrical connector having improved elastomeric contact pressure pad
JP2006101631A (ja) * 2004-09-29 2006-04-13 Fanuc Ltd 静電モータ及びその製造方法
JP5653144B2 (ja) * 2004-12-16 2015-01-14 新光電気工業株式会社 半導体パッケージの製造方法
US7637009B2 (en) * 2006-02-27 2009-12-29 Sv Probe Pte. Ltd. Approach for fabricating probe elements for probe card assemblies using a reusable substrate
JP4896247B2 (ja) * 2010-04-23 2012-03-14 株式会社メイコー プリント基板の製造方法及びこれを用いたプリント基板

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2955351A (en) * 1954-12-28 1960-10-11 Plast O Fab Circuits Inc Method of making a printed circuit
US2961746A (en) * 1956-06-18 1960-11-29 Aladdin Ind Inc Printed circuits
US3039177A (en) * 1957-07-29 1962-06-19 Itt Multiplanar printed circuit
US3158926A (en) * 1960-06-06 1964-12-01 Borg Warner Method of making an electrical terminal board
US3350250A (en) * 1962-03-21 1967-10-31 North American Aviation Inc Method of making printed wire circuitry
US3324014A (en) * 1962-12-03 1967-06-06 United Carr Inc Method for making flush metallic patterns
JPS51104570A (en) * 1975-03-12 1976-09-16 Kuranosuke Ito Metsukikairono tenshaahaisenban
US4453795A (en) * 1975-12-01 1984-06-12 Hughes Aircraft Company Cable-to-cable/component electrical pressure wafer connector assembly
US4125310A (en) * 1975-12-01 1978-11-14 Hughes Aircraft Co Electrical connector assembly utilizing wafers for connecting electrical cables
US4116517A (en) * 1976-04-15 1978-09-26 International Telephone And Telegraph Corporation Flexible printed circuit and electrical connection therefor
US4566184A (en) * 1981-08-24 1986-01-28 Rockwell International Corporation Process for making a probe for high speed integrated circuits
JPS59197191A (ja) * 1983-04-22 1984-11-08 セイコーインスツルメンツ株式会社 回路基板およびその製造方法
US4564423A (en) * 1984-11-28 1986-01-14 General Dynamics Pomona Division Permanent mandrel for making bumped tapes and methods of forming
JPS6345888A (ja) * 1986-08-13 1988-02-26 宇部興産株式会社 バンプ付配線板の製造方法
US4878990A (en) * 1988-05-23 1989-11-07 General Dynamics Corp., Pomona Division Electroformed and chemical milled bumped tape process

Also Published As

Publication number Publication date
EP0476868A1 (en) 1992-03-25
DE69111004D1 (de) 1995-08-10
JPH0758827B2 (ja) 1995-06-21
US5197184A (en) 1993-03-30
DE69111004T2 (de) 1996-02-29
EP0476868B1 (en) 1995-07-05
JPH04245693A (ja) 1992-09-02

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