ES2077200T3 - Dedo de enfriamiento de un circuito semiconductor y dispositivo criogenico provisto de dicho dedo. - Google Patents

Dedo de enfriamiento de un circuito semiconductor y dispositivo criogenico provisto de dicho dedo.

Info

Publication number
ES2077200T3
ES2077200T3 ES91403455T ES91403455T ES2077200T3 ES 2077200 T3 ES2077200 T3 ES 2077200T3 ES 91403455 T ES91403455 T ES 91403455T ES 91403455 T ES91403455 T ES 91403455T ES 2077200 T3 ES2077200 T3 ES 2077200T3
Authority
ES
Spain
Prior art keywords
finger
semiconductor circuit
cooling
device provided
cryogenic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91403455T
Other languages
English (en)
Inventor
Patrick Langle
Jean-Pierre Langlet
Joseph Loiseau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Societe Anonyme de Telecommunications SAT
Original Assignee
Societe Anonyme de Telecommunications SAT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Societe Anonyme de Telecommunications SAT filed Critical Societe Anonyme de Telecommunications SAT
Application granted granted Critical
Publication of ES2077200T3 publication Critical patent/ES2077200T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F25D19/006—Thermal coupling structure or interface
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F25B9/02—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using Joule-Thompson effect; using vortex effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/30—Arrangements for thermal protection or thermal control wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid
    • H10W40/305—Arrangements for thermal protection or thermal control wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid the fluid being a liquefied gas, e.g. liquid nitrogen

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Radiation Pyrometers (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)

Abstract

EL DEDO (1) DESTINADO A REFRIGERAR UN CIRCUITO SEMICONDUCTOR (2A, 2B) EN CONTACTO TERMICO CON SU EXTREMO LIBRE (7), ESTA HUECO Y SU PARED (3) DELIMITA, CERCA DEL EXTREMO LIBRE (7), UN VOLUMEN CUYA SECCION TRANSVERSAL DISMINUYE AL ALEJARSE DE ESTE EXTREMO LIBRE (7). UN FLUIDO CRIOGENICO (5) CIRCULA EN EL VOLUMEN INTERIOR DEL DEDO PARA ENFRIARLO. LA INVENCION SE APLICA EN PARTICULAR PARA EL ENFRIAMIENTO DE LOS DETECTORES INFRARROJOS.
ES91403455T 1990-12-28 1991-12-19 Dedo de enfriamiento de un circuito semiconductor y dispositivo criogenico provisto de dicho dedo. Expired - Lifetime ES2077200T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9016454A FR2671230B1 (fr) 1990-12-28 1990-12-28 Doigt de refroidissement d'un circuit semi-conducteur et dispositif cryogenique pourvu d'un tel doigt.

Publications (1)

Publication Number Publication Date
ES2077200T3 true ES2077200T3 (es) 1995-11-16

Family

ID=9403816

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91403455T Expired - Lifetime ES2077200T3 (es) 1990-12-28 1991-12-19 Dedo de enfriamiento de un circuito semiconductor y dispositivo criogenico provisto de dicho dedo.

Country Status (4)

Country Link
EP (1) EP0493208B1 (es)
DE (1) DE69112010T2 (es)
ES (1) ES2077200T3 (es)
FR (1) FR2671230B1 (es)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6140141A (en) * 1998-12-23 2000-10-31 Sun Microsystems, Inc. Method for cooling backside optically probed integrated circuits
FR2834127B1 (fr) * 2001-12-26 2005-01-14 Sagem Photodetecteur refroidi
FR2856522B1 (fr) * 2003-06-20 2005-08-19 Sagem Photodetecteur refroidi
FR2860637B1 (fr) * 2003-10-01 2005-12-02 Sagem Dispositif de support d'un detecteur
CN108895696B (zh) * 2018-06-08 2020-06-09 上海理工大学 具有锯齿形微通道节流制冷器的复合冷却装置及设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4344302A (en) * 1981-06-08 1982-08-17 Hughes Aircraft Company Thermal coupling structure for cryogenic refrigeration
US4950181A (en) * 1988-07-28 1990-08-21 Ncr Corporation Refrigerated plug-in module
FR2638023B1 (fr) * 1988-10-13 1992-07-31 Telecommunications Sa Dispositif cryostatique pour detecteur de rayonnements
EP0372108B1 (en) * 1988-12-05 1994-08-31 Heinz Karl Diedrich Vacuum container for cryogenically cooled electron device packaging

Also Published As

Publication number Publication date
DE69112010T2 (de) 1996-04-11
EP0493208B1 (fr) 1995-08-09
EP0493208A1 (fr) 1992-07-01
DE69112010D1 (de) 1995-09-14
FR2671230B1 (fr) 1993-04-16
FR2671230A1 (fr) 1992-07-03

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