ES2088694T3 - Conjunto de montaje de tarjetas de circuitos. - Google Patents

Conjunto de montaje de tarjetas de circuitos.

Info

Publication number
ES2088694T3
ES2088694T3 ES94301123T ES94301123T ES2088694T3 ES 2088694 T3 ES2088694 T3 ES 2088694T3 ES 94301123 T ES94301123 T ES 94301123T ES 94301123 T ES94301123 T ES 94301123T ES 2088694 T3 ES2088694 T3 ES 2088694T3
Authority
ES
Spain
Prior art keywords
heat exchanger
circuit boards
boards
assembly
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES94301123T
Other languages
English (en)
Inventor
Ronald Alex Nordin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Application granted granted Critical
Publication of ES2088694T3 publication Critical patent/ES2088694T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20627—Liquid coolant without phase change
    • H05K7/20645—Liquid coolant without phase change within cabinets for removing heat from sub-racks

Landscapes

  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

UN CONJUNTO PARA MONTAR TARJETAS DE CIRCUITO QUE TIENEN DISPOSITIVO DE CHIP MCM DE ALEACION DE GRAN PODER OPTICO Y ELECTRICO INSTALADOS SOBRE ESTAS. EL CONJUNTO TIENE UN CONDUCTO DE ALIMENTACION REFRIGERANTE VERTICAL CENTRAL QUE SE EXTIENDE DESDE UNA BOMBA A UNA UNIDAD DE INTERCAMBIADOR DE CALOR A TRAVES DE UNA UNIDAD DE REFRIGERACION SEPARADA DE UNA UNIDAD DE INTERCAMBIADOR DE CALOR POR TABLEROS DE MONTAJE DE TABLEROS DE CIRCUITOS EQUIPADOS CON APARATOS DE PLACA DE APOYO ELECTRICA Y OPTICA QUE INTERCONECTAN LAS TARJETAS DE CIRCUITO MONTADAS SOBRE LOS TABLEROS DE MONTAJE. LA UNIDAD DE INTERCAMBIADOR DE CALOR TIENE ALETAS DE RADIADORES SEPARADOS POR ALETAS EXTENDIDAS HACIA FUERA DESDE UN SALIENTE DE LA UNIDAD Y SE INTERCONECTA POR TUBOS DE RETORNO QUE SE EXTIENDEN A TRAVES DE LOS TABLEROS DE MONTAJE DE AS TARJETAS DE CIRCUITO Y SE TERMINAN EN LA UNIDAD DE REFRIGERACION QUE SE CONECTA MEDIANTE UN TUBO DE RETORNO A LA BOMBA. LOS TUBOS DE VENTILACION CONECTADO CON ALETAS DEL INTERCAMBIADOR DE CALOR SE EXTIENDEN DESDE LA UNIDAD DE INTERCAMBIADOR DE CALOR DENTRO DE LOS TABLEROS DE MONTAJE DE TARJETAS DE CIRCUITO EN ACOPLAMIENTO CON LAS TARJETAS DE CIRCUITO PARA TRANSFERIR EL CALOR GENERADO POR LAS TARJETAS DE CIRCUITO A LA UNIDAD DE INTERCAMBIADOR DE CALOR. LOS TUBOS DE VENTILACION SE DESPLAZAN PARA ACOPLARSE CON LOS CONECTORES DE INTERCAMBIADOR DE CALOR QUE SE TERMINAN LOS TUBOS DE VENTILACION CON LOS FOCOS FRIOS DE TARJETAS DE CIRCUITO CUANDO LAS TARJETAS DE CIRCUITO SE INSTALAN EN EL TABLERO DE MONTAJE PARA EFECTUAR UNA TRANSFERENCIA DE CALOR GENERADO POR LAS TARJETAS DE CIRCUITO MONTADAS A UNIDAD DE INTERCAMBIADOR DE CALOR.
ES94301123T 1993-02-26 1994-02-16 Conjunto de montaje de tarjetas de circuitos. Expired - Lifetime ES2088694T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/023,306 US5289694A (en) 1993-02-26 1993-02-26 Circuit card mounting assembly

Publications (1)

Publication Number Publication Date
ES2088694T3 true ES2088694T3 (es) 1996-08-16

Family

ID=21814318

Family Applications (1)

Application Number Title Priority Date Filing Date
ES94301123T Expired - Lifetime ES2088694T3 (es) 1993-02-26 1994-02-16 Conjunto de montaje de tarjetas de circuitos.

Country Status (5)

Country Link
US (1) US5289694A (es)
EP (1) EP0613337B1 (es)
CA (1) CA2113120C (es)
DE (1) DE69400238T2 (es)
ES (1) ES2088694T3 (es)

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GB9307117D0 (en) * 1993-04-06 1993-05-26 Hercules Inc Card bonded comfort barrier fabrics
US6393853B1 (en) * 2000-12-19 2002-05-28 Nortel Networks Limited Liquid cooling of removable electronic modules based on low pressure applying biasing mechanisms
US6981543B2 (en) * 2001-09-20 2006-01-03 Intel Corporation Modular capillary pumped loop cooling system
US6693797B2 (en) * 2002-01-04 2004-02-17 Intel Corporation Computer system having a chassis-level thermal interface component and a frame-level thermal interface component that are thermally engageable with and disengageable from one another
US6836407B2 (en) 2002-01-04 2004-12-28 Intel Corporation Computer system having a plurality of server units transferring heat to a fluid flowing through a frame-level fluid-channeling structure
US6700785B2 (en) * 2002-01-04 2004-03-02 Intel Corporation Computer system which locks a server unit subassembly in a selected position in a support frame
US7133283B2 (en) * 2002-01-04 2006-11-07 Intel Corporation Frame-level thermal interface component for transfer of heat from an electronic component of a computer system
US6643132B2 (en) * 2002-01-04 2003-11-04 Intel Corporation Chassis-level thermal interface component for transfer of heat from an electronic component of a computer system
US20050207134A1 (en) 2004-03-16 2005-09-22 Belady Christian L Cell board interconnection architecture
US7137855B2 (en) * 2004-04-16 2006-11-21 National Instruments Corporation Mechanical adapter for circuitry modules
TW200741470A (en) * 2006-04-19 2007-11-01 Tyan Computer Corp Multi-processor system and tubelike computer architecture thereof
GB0703995D0 (en) * 2007-03-01 2007-04-11 Stevens Jason Data centers
US7819667B2 (en) * 2007-08-28 2010-10-26 General Dynamics Advanced Information Systems, Inc. System and method for interconnecting circuit boards
US8773864B2 (en) * 2008-06-18 2014-07-08 Lockheed Martin Corporation Enclosure assembly housing at least one electronic board assembly and systems using same
US8189345B2 (en) * 2008-06-18 2012-05-29 Lockheed Martin Corporation Electronics module, enclosure assembly housing same, and related systems and methods
US8279597B2 (en) 2010-05-27 2012-10-02 International Business Machines Corporation Heatsink allowing in-situ maintenance in a stackable module
US8174826B2 (en) 2010-05-27 2012-05-08 International Business Machines Corporation Liquid cooling system for stackable modules in energy-efficient computing systems
US8358503B2 (en) * 2010-05-28 2013-01-22 International Business Machines Corporation Stackable module for energy-efficient computing systems
US8842432B2 (en) * 2012-09-22 2014-09-23 Facebook, Inc. Arrangement of computing assets in a data center
US10499524B2 (en) 2017-12-20 2019-12-03 Capital One Services, Llc Apparatus for mounting a processor for cluster computing
WO2026042022A1 (en) 2024-08-22 2026-02-26 3M Innovative Properties Company Respirators containing recycled components
WO2026042031A1 (en) 2024-08-22 2026-02-26 3M Innovative Properties Company Polymer composition having a first and second polypropylene, fibers with such polymer composition, and nonwoven fabrics with such polymer composition
WO2026041945A1 (en) 2024-08-22 2026-02-26 3M Innovative Properties Company Polymer composition, fibers with such polymer composition, and nonwoven fabrics with such polymer composition

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1563403B2 (de) * 1966-09-15 1977-02-17 Siemens AG, 1000 Berlin und 8000 München Steuerbarer hochspannungsstromrichter
CS159563B1 (es) * 1972-12-28 1975-01-31
DE3044314C2 (de) * 1980-11-25 1986-08-14 kabelmetal electro GmbH, 3000 Hannover Gehäuse zur Aufnahme von mit Wärme erzeugenden elektronischen Bauteilen bestückten gedruckten Schaltungen
CA1204950A (en) * 1981-12-02 1986-05-27 Fl"Pakt Aktiebolag Apparatus for cooling telecommunications equipment in a rack
GB8329269D0 (en) * 1983-11-02 1983-12-07 British Aerospace Electronic apparatus stowage
US4514746A (en) * 1983-12-01 1985-04-30 Flakt Aktiebolag Apparatus for cooling telecommunications equipment in a rack
DE3679978D1 (de) * 1985-12-13 1991-08-01 Hasler Ag Ascom Verfahren und vorrichtung zum abfuehren der verlustwaerme wenigstens einer baugruppe elektrischer elemente.
US4679872A (en) * 1986-01-27 1987-07-14 Coe Larry D Cylindrical back plane structure for receiving printed circuit boards
US5000254A (en) * 1989-06-20 1991-03-19 Digital Equipment Corporation Dynamic heat sink
US5063475A (en) * 1990-03-19 1991-11-05 International Business Machines Corporation Multileveled electronic assembly with cooling means

Also Published As

Publication number Publication date
EP0613337B1 (en) 1996-06-12
CA2113120A1 (en) 1994-08-27
US5289694A (en) 1994-03-01
CA2113120C (en) 1997-12-02
DE69400238D1 (de) 1996-07-18
EP0613337A1 (en) 1994-08-31
DE69400238T2 (de) 1996-10-10

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