ES2092799T3 - Procedimiento y dispositivo para el recubrimiento de material en forma de placa, especialmente de placas de circuitos impresos. - Google Patents

Procedimiento y dispositivo para el recubrimiento de material en forma de placa, especialmente de placas de circuitos impresos.

Info

Publication number
ES2092799T3
ES2092799T3 ES93810577T ES93810577T ES2092799T3 ES 2092799 T3 ES2092799 T3 ES 2092799T3 ES 93810577 T ES93810577 T ES 93810577T ES 93810577 T ES93810577 T ES 93810577T ES 2092799 T3 ES2092799 T3 ES 2092799T3
Authority
ES
Spain
Prior art keywords
printed circuit
circuit boards
coating
station
supporting elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93810577T
Other languages
English (en)
Inventor
Kaspar Kuster
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novartis AG
Original Assignee
Ciba Geigy AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy AG filed Critical Ciba Geigy AG
Application granted granted Critical
Publication of ES2092799T3 publication Critical patent/ES2092799T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/159—Using gravitational force; Processing against the gravity direction; Using centrifugal force
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/227—Drying of printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

UN DISPOSITIVO PARA EL RECUBRIMIENTO DE MATERIAL CON FORMA DE PLACAS, EN ESPECIAL CIRCUITOS 2 IMPRESOS, COMPRENDE UNA ESTACION DE PRECALENTAMIENTO PARA LOS CIRCUITOS IMPRESOS, DISPUESTA EN EL LADO DE ENTRADA DE DISPOSITIVO, Y A CONTINUACION DE ELLA, EN EL ORDEN DE SU DISPOSICION, AL MENOS UNA ESTACION DE RECUBRIMIENTO PARA EL RECUBRIMIENTO DE AL MENOS UNA CARA DE LOS CIRCUITOS IMPRESOS CON, PREFERENTEMENTE, MATERIAL PLASTICO CURABLE CON RADIACIONES UV, LACA O ANALOGO Y AL MENOS UNA ESTACION 8 DE SALIDA DE AIRE Y DE SECADO, POSEYENDO ESTAS ESTACIONES DE TRATAMIENTO MEDIOS DE TRANSPORTE PARA LOS CIRCUITOS IMPRESOS. LOS MEDIOS DE TRANSPORTE DE LA ESTACION 8 DE SALIDA DE AIRE Y DE SECADO ESTAN PROVISTOS DE ELEMENTOS 20 DE SUSTENTACION PARA LOS BORDES 3 LONGITUDINALES DE LOS CIRCUITOS 2 IMPRESOS, CUYO ANCHO SE PUEDE AJUSTAR AL ANCHO B DE LOS CIRCUITOS 2 IMPRESOS A SUSTENTAR Y QUE SUSTENTAN Y CONDUCEN LOS CIRCUITOS 2 IMPRESOS EN LOS BORDES 3 LONGITUDINALES EN TODA SU LONGITUD. EN EL PROCEDIMIENTO, SEGUN EL INVENTO, SE ALINEAN LOS CIRCUITOS 2 IMPRESOS UNA SOLA VEZ DIRECTAMENTE EN LA ENTRADA DE LA PRIMERA ESTACION DE RECUBRIMIENTO. A PARTIR DE ESTE INSTANTE,LOS CIRCUITOS IMPRESOS 2 SOLO SON SUSTENTADOS Y CONDUCIDOS EN SUS BORDES 3 LATERALES POR LOS DIFERENTES MEDIOS DE TRANSPORTE DE LAS DIFERENTES ESTACIONES DE TRATAMIENTO. EN LA TRANSFERENCIA DE LOS CIRCUITOS IMPRESOS RECUBIERTOS EN UNA CARA O EN LAS DOS DE UNA ESTACION DE TRATAMIENTO A LA SIGUIENTE SE SUSTENTAN Y GUIAN LOS 2 CIRCUITOS IMPRESOS ESENCIALMENTE EN SUS BORDES 3 LONGITUDINALES EXENTOS DE RECUBRIMIENTO.
ES93810577T 1992-08-24 1993-08-16 Procedimiento y dispositivo para el recubrimiento de material en forma de placa, especialmente de placas de circuitos impresos. Expired - Lifetime ES2092799T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH263692 1992-08-24

Publications (1)

Publication Number Publication Date
ES2092799T3 true ES2092799T3 (es) 1996-12-01

Family

ID=4238219

Family Applications (1)

Application Number Title Priority Date Filing Date
ES93810577T Expired - Lifetime ES2092799T3 (es) 1992-08-24 1993-08-16 Procedimiento y dispositivo para el recubrimiento de material en forma de placa, especialmente de placas de circuitos impresos.

Country Status (9)

Country Link
US (1) US5462599A (es)
EP (1) EP0585204B1 (es)
JP (1) JP3203455B2 (es)
KR (1) KR100275232B1 (es)
AT (1) ATE143565T1 (es)
DE (1) DE59303954D1 (es)
ES (1) ES2092799T3 (es)
HK (1) HK1005204A1 (es)
TW (1) TW220028B (es)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0592745B1 (de) * 1992-09-28 1996-01-24 Ciba-Geigy Ag Verfahren und Vorrichtung zur beidseitigen Beschichtung von plattenförmigem Stückgut
US5628112A (en) * 1995-03-03 1997-05-13 Ford Motor Company Circuit board assembly system and method
EP0885084B1 (en) * 1995-08-29 2001-07-25 Soltec B.V. Reflow soldering apparatus with a rotative configuration
US6258165B1 (en) * 1996-11-01 2001-07-10 Speedline Technologies, Inc. Heater in a conveyor system
TW416261B (en) * 1997-04-24 2000-12-21 Ciba Sc Holding Ag Process and apparatus for the treatment of coated printed circuit boards
DE10151708A1 (de) * 2001-10-19 2003-05-08 All4 Pcb Switzerland Ltd Verfahren zum Aufnehmen von horizontal geförderten Platten in einer Puffervorrichtung sowie Puffervorrichtung
US6760981B2 (en) 2002-01-18 2004-07-13 Speedline Technologies, Inc. Compact convection drying chamber for drying printed circuit boards and other electronic assemblies by enhanced evaporation
US20060273138A1 (en) * 2005-06-07 2006-12-07 Samsung Electronics Co., Ltd. Soldering apparatus for printed circuit board, soldering method for printed circuit board and soldering cream printing unit for soldering printed circuit board
KR100862343B1 (ko) * 2007-05-29 2008-10-13 삼성전기주식회사 조명용 ｌｅｄ 모듈 및 그 제조방법
CN101979153B (zh) * 2010-10-11 2012-10-03 李荣根 全自动水平式pcb板双面涂布机
KR101030268B1 (ko) 2010-11-12 2011-04-21 (주)유창 광촉매 코팅장치 및 이를 이용한 광촉매 코팅방법
CN106696475B (zh) * 2015-11-13 2019-06-18 富泰华工业（深圳）有限公司 打印机及利用打印机打印电路板的方法
CN110497701B (zh) * 2018-05-18 2021-01-29 富泰华工业（深圳）有限公司 立式电路板打印机及其打印方法
CN113636270A (zh) * 2021-08-04 2021-11-12 深圳市宏讯实业有限公司 一种氛围连续加工设备
CN113492076B (zh) * 2021-09-10 2021-11-09 南通普力新机械科技有限公司 不锈钢板保护剂喷涂设备
CN114980542B (zh) * 2022-05-24 2023-11-10 东莞市黄江大顺电子有限公司 一种新能源汽车印刷电路板制造用设备

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2802339A1 (de) * 1978-01-20 1979-07-26 Paper Converting Machine Co Vorrichtung zur zwischenpufferung auf paletten
CH641708A5 (de) * 1979-11-02 1984-03-15 Sinter Ltd Vorrichtung zum aufbringen von lot auf leiterplatten.
US4559896A (en) * 1983-09-15 1985-12-24 Ciba Geigy Corporation Coating apparatus
ES2009804B3 (es) * 1985-11-08 1989-10-16 Ciba Specialty Chemicals Holding Inc Dispositivo de transporte para placas.
DE3539959A1 (de) * 1985-11-11 1987-05-21 Weber Erich Dipl Ing Fh Verfahren zum transportieren von leiterplatten durch trocknungsanlagen und vorrichtung zur durchfuehrung dieses verfahrens
DE3602350C2 (de) * 1986-01-27 1994-08-18 Weber Marianne Verfahren und Anlage zum beidseitigen Beschichten von Platten mit flüssigem Beschichtungsmaterial
DE3721404A1 (de) * 1987-06-29 1989-01-12 Kopperschmidt Mueller & Co Vorrichtung zur elektrostatischen spruehbeschichtung von plattenfoermigen werkstuecken
US4926789A (en) * 1987-10-13 1990-05-22 Ciba-Geigy Corporation Transport apparatus for boards
DE3738067A1 (de) * 1987-11-09 1989-05-18 Wolfgang Anger Einrichtung zum mehrfachen beschichten von platten
EP0421931A1 (de) * 1989-10-06 1991-04-10 Ciba-Geigy Ag Transportvorrichtung für Platten, insbesondere mit empfindlicher Oberfläche
DE3937071A1 (de) * 1989-11-07 1991-05-08 Kopperschmidt Mueller & Co Vorrichtung und verfahren zum beschichten von plattenfoermigen substraten, wie leiterplatten
EP0441743A1 (de) * 1990-02-05 1991-08-14 Ciba-Geigy Ag Transportvorrichtung für Platten mit empfindlicher Oberfläche, insbesondere für nassbeschichtete Leiterplatten
US5188669A (en) * 1991-02-22 1993-02-23 Nordson Corporation Circuit board coating apparatus with inverting pallet shuttle
DE4107224C1 (es) * 1991-03-07 1992-06-04 Dupont De Nemours Gmbh, 6380 Bad Homburg, De
EP0542684B1 (de) * 1991-11-13 1997-04-09 Ciba-Geigy Ag Beschichtungsvorrichtung für Platten

Also Published As

Publication number Publication date
DE59303954D1 (de) 1996-10-31
EP0585204A1 (de) 1994-03-02
JPH06182284A (ja) 1994-07-05
EP0585204B1 (de) 1996-09-25
KR100275232B1 (ko) 2001-01-15
ATE143565T1 (de) 1996-10-15
JP3203455B2 (ja) 2001-08-27
TW220028B (en) 1994-02-01
KR940005197A (ko) 1994-03-16
US5462599A (en) 1995-10-31
HK1005204A1 (en) 1998-12-24

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