ES2100307T3 - Adhesivo que contiene microcapsulas. - Google Patents

Adhesivo que contiene microcapsulas.

Info

Publication number
ES2100307T3
ES2100307T3 ES92310649T ES92310649T ES2100307T3 ES 2100307 T3 ES2100307 T3 ES 2100307T3 ES 92310649 T ES92310649 T ES 92310649T ES 92310649 T ES92310649 T ES 92310649T ES 2100307 T3 ES2100307 T3 ES 2100307T3
Authority
ES
Spain
Prior art keywords
water
resin
adhesive
adhesive containing
containing microcapsules
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92310649T
Other languages
English (en)
Inventor
Satoshi Matsuo
Ikuzo Usami
Makoto Kurihara
Kunihiko Nakashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ThreeBond Co Ltd
Original Assignee
ThreeBond Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ThreeBond Co Ltd filed Critical ThreeBond Co Ltd
Application granted granted Critical
Publication of ES2100307T3 publication Critical patent/ES2100307T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
    • C09J129/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/936—Encapsulated chemical agent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)
  • Manufacturing Of Micro-Capsules (AREA)

Abstract

SE PRESENTA UN ADHESIVO DEL TIPO DE LOS QUE ESTAN COMPUESTOS POR MICROCAPSULAS QUE TIENE UNA SUPERIOR ESTABILIDAD AL ALMACENAMIENTO, UNA MEJOR FUERZA ADHESIVA Y SEGURIDAD. EL ADHESIVO DEL TIPO DE LOS QUE CONTIENEN MICROCAPSULAS COMPRENDE UNA RESINA EPOXIDA COMO MATERIAL DE NUCLEO Y UNA RESINA DE ALDHEIDO O UNA RESINA DE UREA COMO MATERIAL DE PARED, UN AMALGAMADOR DE RESINA DE POLIACETAL SOLUBLE EN AGUA, Y UN AGENTE ENDURECEDOR CON BASE DE AMINO SOLUBLE EN AGUA O DISPERSIBLE EN AGUA.
ES92310649T 1991-11-22 1992-11-20 Adhesivo que contiene microcapsulas. Expired - Lifetime ES2100307T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35420791A JP3180400B2 (ja) 1991-11-22 1991-11-22 マイクロカプセル型接着剤

Publications (1)

Publication Number Publication Date
ES2100307T3 true ES2100307T3 (es) 1997-06-16

Family

ID=18436007

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92310649T Expired - Lifetime ES2100307T3 (es) 1991-11-22 1992-11-20 Adhesivo que contiene microcapsulas.

Country Status (7)

Country Link
US (1) US5283266A (es)
EP (1) EP0543675B1 (es)
JP (1) JP3180400B2 (es)
KR (1) KR100243810B1 (es)
DE (1) DE69218891T2 (es)
ES (1) ES2100307T3 (es)
TW (1) TW257788B (es)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3052735B2 (ja) * 1994-06-10 2000-06-19 株式会社スリーボンド ねじ部材の緩み止め用接着剤組成物
US5585438A (en) * 1995-08-29 1996-12-17 Esu; Charles S. Remeltable thermoset resin
KR20020010473A (ko) * 2000-07-26 2002-02-04 토마스 더블유. 버크맨 화학 고정 접착제를 적용하는 방법
KR20020071793A (ko) * 2002-06-05 2002-09-13 조석형 에폭시계 접착제 제조
AU2003256277A1 (en) * 2002-06-21 2004-01-06 3M Innovative Properties Company Humidity resistant water-based adhesive compositions
US20040258922A1 (en) * 2003-06-20 2004-12-23 Willett Peggy S. Water-based adhesive compositions with polyamine curative and binder
JP4715517B2 (ja) * 2003-12-03 2011-07-06 株式会社スリーボンド マイクロカプセル型接着剤組成物
JP4754796B2 (ja) * 2004-09-17 2011-08-24 関西ペイント株式会社 水性被覆組成物
TWI326544B (en) 2006-11-15 2010-06-21 Ind Tech Res Inst An intelligent heterogeneous network packet dispatcher methodology
US20130313753A1 (en) * 2012-05-25 2013-11-28 Delphi Technologies, Inc. Electric terminals sealed with microencapsulated polymers
DE102012220149B4 (de) * 2012-11-06 2014-12-11 ibex Beteiligungs- und Managementgesellschaft mbH Zusammensetzung mit Kapseln, deren Verwendung sowie ein Verfahren zum Verfugen von Wand- und Bodenbelägen
JP2015086249A (ja) 2013-10-28 2015-05-07 スリーボンドファインケミカル株式会社 マイクロカプセル型硬化性樹脂組成物
JP6406502B2 (ja) * 2014-07-04 2018-10-17 株式会社スリーボンド 重合性封着組成物
CN104893635A (zh) * 2015-04-24 2015-09-09 烟台德邦科技有限公司 一种单组分螺纹锁固环氧预涂胶及其制备方法
KR101649760B1 (ko) 2015-04-29 2016-08-19 한국신발피혁연구원 내수 및 내열 특성이 우수한 1액형 수성 접착제 조성물의 제조방법 및 이 방법에 의해 제조된 1액형 수성 접착제 조성물
CN116948579A (zh) * 2022-04-13 2023-10-27 李平 水基单组分环氧紧固胶
CN115287030B (zh) * 2022-08-23 2023-11-28 稳理新材料科技(上海)有限公司 一种单组份环氧预涂干膜粘合剂及其制备方法、应用

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3391095A (en) * 1965-09-20 1968-07-02 Interchem Corp Normally stable curable epoxy resin composition containing encapsulated water insoluble amine curing agents
NL6806343A (es) * 1967-05-15 1968-11-18
US3657379A (en) * 1970-07-02 1972-04-18 Ncr Co Intercrossing resin/curing agent adhesive systems
JPS5246339A (en) * 1975-10-13 1977-04-13 Seikosha Kk Process for producing steel having titanium carbide cemented coating
JPS5311883A (en) * 1976-07-21 1978-02-02 Toagosei Chem Ind Co Ltd Aqueous slurry-like composite containing microcapsule
JPS57147430A (en) * 1981-03-06 1982-09-11 Kureha Chem Ind Co Ltd Preparation of microcapsule
CA1217294A (en) * 1981-04-21 1987-01-27 Ronald L. Hart Microencapsulated epoxy adhesive system
US4760108A (en) * 1984-12-25 1988-07-26 Mitsui Toatsu Chemicals, Incorporated Microcapsule-containing water-base coating formulation and copying and/or recording material making use of said coating formulation
JP2697140B2 (ja) * 1989-05-24 1998-01-14 東亞合成株式会社 接着剤組成物

Also Published As

Publication number Publication date
HK1005463A1 (en) 1999-01-08
EP0543675A1 (en) 1993-05-26
DE69218891D1 (de) 1997-05-15
KR100243810B1 (ko) 2000-02-01
JPH05140514A (ja) 1993-06-08
KR930010152A (ko) 1993-06-22
JP3180400B2 (ja) 2001-06-25
TW257788B (es) 1995-09-21
EP0543675B1 (en) 1997-04-09
DE69218891T2 (de) 1997-07-17
US5283266A (en) 1994-02-01

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