ES2102224T3 - Procedimiento para la deposicion de capas de paladio. - Google Patents

Procedimiento para la deposicion de capas de paladio.

Info

Publication number
ES2102224T3
ES2102224T3 ES94915040T ES94915040T ES2102224T3 ES 2102224 T3 ES2102224 T3 ES 2102224T3 ES 94915040 T ES94915040 T ES 94915040T ES 94915040 T ES94915040 T ES 94915040T ES 2102224 T3 ES2102224 T3 ES 2102224T3
Authority
ES
Spain
Prior art keywords
palladium
layers
palladium layers
deposited
deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES94915040T
Other languages
English (en)
Inventor
Ludwig Stein
Hartmut Mahlkow
Waltraud Strache
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19934316679 external-priority patent/DE4316679C1/de
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Application granted granted Critical
Publication of ES2102224T3 publication Critical patent/ES2102224T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)

Abstract

LAS CAPAS DE PALADIO SE UTILIZAN CON FRECUENCIA COMO CAPAS PROTECTORAS SOBRE LA SUPERFICIE DE SUBSTRATOS ELABORADOS DE COBRE, NIQUEL Y COBALTO, ASI COMO SUS ALEACIONES CON UNO O CON OTRO Y/O CON FOSFORO O BORO. LOS PROCESOS CONOCIDOS, SIN EMBARGO, NO PERMITEN CAPAS DE PALADIO ADHESIVO, PERMANENTEMENTE CON BRILLO, ASPECTO CLARO, SIENDO DEPOSITADO CON POCOS POROS. TALES CAPAS DE PALADIO PUEDEN SER SIN EMBARGO DEPOSITADAS MEDIANTE BAÑO QUIMICO LIBRE DE FORMALDEHIDO QUE CONTIENE UNA SAL DE PALADIO, UNO O VARIOS AGENTES DE FORMACION COMPLEJA NITROGENADA Y ACIDO FORMICO O DERIVADOS DE ACIDO FORMICO A UN VALOR DE PH MAYOR DE 4. ES TAMBIEN POSIBLE UN TRATAMIENTO PREVIO EN UN BAÑO DE PALADIO DE CEMENTACION.
ES94915040T 1993-05-13 1994-05-13 Procedimiento para la deposicion de capas de paladio. Expired - Lifetime ES2102224T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19934316679 DE4316679C1 (de) 1993-05-13 1993-05-13 Verfahren und Bad zur Abscheidung von Palladiumschichten sowie dessen Verwendung
DE4415211A DE4415211A1 (de) 1993-05-13 1994-04-26 Verfahren zur Abscheidung von Palladiumschichten

Publications (1)

Publication Number Publication Date
ES2102224T3 true ES2102224T3 (es) 1997-07-16

Family

ID=25926044

Family Applications (1)

Application Number Title Priority Date Filing Date
ES94915040T Expired - Lifetime ES2102224T3 (es) 1993-05-13 1994-05-13 Procedimiento para la deposicion de capas de paladio.

Country Status (6)

Country Link
EP (1) EP0698130B1 (es)
JP (1) JP2918339B2 (es)
AT (1) ATE152188T1 (es)
DE (2) DE4415211A1 (es)
ES (1) ES2102224T3 (es)
WO (1) WO1994026954A1 (es)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9425031D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Printed circuit board manufacture
GB9425030D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Silver plating
US6905587B2 (en) 1996-03-22 2005-06-14 Ronald Redline Method for enhancing the solderability of a surface
US6544397B2 (en) 1996-03-22 2003-04-08 Ronald Redline Method for enhancing the solderability of a surface
DE19631565A1 (de) * 1996-07-24 1998-01-29 Atotech Deutschland Gmbh Verfahren zum Herstellen von Palladiumkontaktbumps auf Halbleiterschaltungsträgern
USRE45842E1 (en) 1999-02-17 2016-01-12 Ronald Redline Method for enhancing the solderability of a surface
FR2799337B1 (fr) * 1999-10-05 2002-01-11 St Microelectronics Sa Procede de realisation de connexions electriques sur la surface d'un boitier semi-conducteur a gouttes de connexion electrique
DE102004033979B4 (de) * 2004-07-14 2008-04-24 Dr.-Ing. Max Schlötter GmbH & Co KG Verfahren zur Verbesserung der Lötbarkeit von Nickelüberzügen
US8349393B2 (en) 2004-07-29 2013-01-08 Enthone Inc. Silver plating in electronics manufacture
DE102004046258A1 (de) * 2004-09-23 2006-04-06 Infineon Technologies Ag Bad und Verfahren zur stromlosen Abscheidung von Palladium
JP5526440B2 (ja) * 2007-01-17 2014-06-18 奥野製薬工業株式会社 パラジウム皮膜用還元析出型無電解金めっき液を用いて形成されたプリント配線板
CN101448973B (zh) 2007-02-28 2014-06-25 小岛化学药品株式会社 无电纯钯镀敷溶液
JP4117016B1 (ja) 2007-08-15 2008-07-09 小島化学薬品株式会社 無電解パラジウムめっき液
EP2177646B1 (en) * 2008-10-17 2011-03-23 ATOTECH Deutschland GmbH Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces
DE102010011269B4 (de) 2009-11-10 2014-02-13 Ami Doduco Gmbh Verfahren zum Abscheiden einer für das Drahtbonden geeigneten Palladiumschicht auf Leiterbahnen einer Schaltungsträgerplatte und Verwendung eines Palladiumbades in dem Verfahren
EP2535929A1 (en) * 2011-06-14 2012-12-19 Atotech Deutschland GmbH Wire bondable surface for microelectronic devices
DE102011082537A1 (de) * 2011-09-12 2013-03-14 Robert Bosch Gmbh Leiterplatte und elektrische Bauteile zum Einsatz in aggressiver Umgebung und Verfahren zur Herstellung einer solchen Leiterplatte
EP2581470B1 (en) * 2011-10-12 2016-09-28 ATOTECH Deutschland GmbH Electroless palladium plating bath composition
CN103290399B (zh) * 2013-06-19 2015-09-30 广东东硕科技有限公司 一种使用复合稳定剂的化学镀钯液
EP3129526B1 (en) * 2014-04-10 2019-08-07 ATOTECH Deutschland GmbH Plating bath composition and method for electroless plating of palladium
US20170321327A1 (en) * 2014-12-17 2017-11-09 Atotech Deutschland Gmbh Plating bath composition and method for electroless plating of palladium
WO2016097083A2 (en) * 2014-12-17 2016-06-23 Atotech Deutschland Gmbh Plating bath composition and method for electroless plating of palladium
SG11202103872PA (en) 2018-11-06 2021-05-28 Atotech Deutschland Gmbh Electroless nickel plating solution
JP7407644B2 (ja) * 2020-04-03 2024-01-04 上村工業株式会社 パラジウムめっき液及びめっき方法
EP3960898A1 (en) 2020-08-31 2022-03-02 Atotech Deutschland GmbH & Co. KG Compostion for depositing a palladium coating on a substrate
EP4215642A1 (en) 2022-01-25 2023-07-26 Atotech Deutschland GmbH & Co. KG Compostion for depositing a palladium coating on an activated copper-coated substrate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3790128T (es) * 1986-03-04 1988-03-31
US5203911A (en) * 1991-06-24 1993-04-20 Shipley Company Inc. Controlled electroless plating

Also Published As

Publication number Publication date
DE59402540D1 (de) 1997-05-28
DE4415211A1 (de) 1994-12-08
WO1994026954A1 (de) 1994-11-24
EP0698130B1 (de) 1997-04-23
JP2918339B2 (ja) 1999-07-12
EP0698130A1 (de) 1996-02-28
JPH10511738A (ja) 1998-11-10
ATE152188T1 (de) 1997-05-15

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