ES2107247T3 - Red polimera interpenetrante de alilo-epoxi. - Google Patents

Red polimera interpenetrante de alilo-epoxi.

Info

Publication number
ES2107247T3
ES2107247T3 ES94926176T ES94926176T ES2107247T3 ES 2107247 T3 ES2107247 T3 ES 2107247T3 ES 94926176 T ES94926176 T ES 94926176T ES 94926176 T ES94926176 T ES 94926176T ES 2107247 T3 ES2107247 T3 ES 2107247T3
Authority
ES
Spain
Prior art keywords
epoxy
compounds
epoxy resin
network forming
interpenetrating polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES94926176T
Other languages
English (en)
Inventor
Jan Andre Jozef Schutyser
Antonius Johannes Wilhel Buser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Akzo Nobel NV
Original Assignee
Akzo Nobel NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akzo Nobel NV filed Critical Akzo Nobel NV
Application granted granted Critical
Publication of ES2107247T3 publication Critical patent/ES2107247T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2363/00—Epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Compounds (AREA)
  • Laminated Bodies (AREA)
  • Graft Or Block Polymers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

LA INVENCION SE REFIERE A UNA RED POLIMERICA DE INTERPENETRACION (IPN) COMPUESTA DE (1) COMPUESTOS FORMADORES DE UNA RED EPOXI QUE CONTIENEN: (A) COMPUESTOS EPOXI POLIFUNCIONALES (RESINA EPOXI); (B) COMPUESTOS DE HIDROXILO AROMATICO POLIFUNCIONALES; (2) COMPUESTOS FORMADORES DE UNA RED DE ALILO; EN DONDE LA RELACION EN PESO (1):(2) ES DE 95:5 A 40:60, Y LOS COMPUESTOS FORMADORES DE UNA RED EPOXI (1A) Y (1B) SE ENCUENTRAN EN UNA RELACION NO ESTEQUIOMETRICA ENTRE SI, TAL QUE EL PORCENTAJE DE ESTEQUIOMETRIA ES DE UN 10 A UN 80%. EL PORCENTAJE DE ESTEQUIOMETRIA SE DEFINE COMO 100 % VECES EL COCIENTE DEL NUMERO DE EQUIVALENTES HIDROXILO Y EL NUMERO DE EQUIVALENTES EPOXI, A SABER, EQ. OH/EQ. EPOXI X 100 %. TALES IPN SON ESPECIALMENTE ADECUADAS PARA SU USO EN LA INDUSTRIA DE LA ELECTRONICA Y PRESENTAN UN ALTO Y FAVORABLE TG Y UN BAJO TCE. ESTO TAMBIEN SE DA EN EL CASO DE PORCENTAJES RELATIVAMENTE ALTOS DE RESINA EPOXI QUE PROPORCIONAN UNA RESISTENCIA OPTIMA A PELARSE. LA RESINA EPOXI SE BASA PREFERENTEMENTE EN EL ETER DIGLICIDILO DE BISFENOL-A, MIENTRAS QUE EL COMPUESTO DE ALILO ES CIANURATO DE TRIALILO (TAC) O ISOCIANURATO DE TRIALILO (TAIC).
ES94926176T 1993-08-23 1994-08-10 Red polimera interpenetrante de alilo-epoxi. Expired - Lifetime ES2107247T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9301456 1993-08-23

Publications (1)

Publication Number Publication Date
ES2107247T3 true ES2107247T3 (es) 1997-11-16

Family

ID=19862789

Family Applications (1)

Application Number Title Priority Date Filing Date
ES94926176T Expired - Lifetime ES2107247T3 (es) 1993-08-23 1994-08-10 Red polimera interpenetrante de alilo-epoxi.

Country Status (11)

Country Link
EP (1) EP0715636B1 (es)
JP (1) JPH09501724A (es)
KR (1) KR960703955A (es)
CN (1) CN1131955A (es)
AT (1) ATE158317T1 (es)
CA (1) CA2170033A1 (es)
DE (1) DE69405766T2 (es)
DK (1) DK0715636T3 (es)
ES (1) ES2107247T3 (es)
GR (1) GR3025317T3 (es)
WO (1) WO1995006075A1 (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2199390A1 (en) * 1994-09-08 1996-03-14 Jan Andre Jozef Schutyser Allyl-containing epoxy resin composition comprising a copolymer of an ethylenically unsaturated anhydride and a vinyl compound
US6613839B1 (en) 1997-01-21 2003-09-02 The Dow Chemical Company Polyepoxide, catalyst/cure inhibitor complex and anhydride
US20040101689A1 (en) 2002-11-26 2004-05-27 Ludovic Valette Hardener composition for epoxy resins
CN106832224A (zh) 2009-06-22 2017-06-13 蓝立方知识产权有限责任公司 环氧树脂的硬化剂组合物
JP5579642B2 (ja) * 2011-03-14 2014-08-27 住友ベークライト株式会社 積層板の製造方法
KR101907713B1 (ko) * 2011-03-14 2018-10-12 스미토모 베이클리트 컴퍼니 리미티드 빌드업용 프리프레그
JP5547678B2 (ja) * 2011-03-14 2014-07-16 住友ベークライト株式会社 積層板の製造方法
SG11201501745VA (en) * 2012-09-07 2015-04-29 Dow Global Technologies Llc Toughened epoxy resin formulations

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5210157A (en) * 1989-08-15 1993-05-11 Akzo N.V. Interpenetrating network of ring-containing allyl polymers and epoxy resin, and a laminate prepared therefrom
JPH04108860A (ja) * 1990-08-28 1992-04-09 Matsushita Electric Works Ltd 熱硬化性樹脂組成物
JP2823704B2 (ja) * 1990-12-14 1998-11-11 住友ベークライト株式会社 半導体封止用樹脂組成物

Also Published As

Publication number Publication date
DE69405766T2 (de) 1998-02-26
KR960703955A (ko) 1996-08-31
CA2170033A1 (en) 1995-03-02
EP0715636B1 (en) 1997-09-17
CN1131955A (zh) 1996-09-25
DE69405766D1 (en) 1997-10-23
WO1995006075A1 (en) 1995-03-02
JPH09501724A (ja) 1997-02-18
EP0715636A1 (en) 1996-06-12
DK0715636T3 (da) 1998-04-27
ATE158317T1 (de) 1997-10-15
GR3025317T3 (en) 1998-02-27

Similar Documents

Publication Publication Date Title
AU5252493A (en) Photosensitive compositions
NO855004L (no) Herbar beleggblanding og epoksyharpiksaddukt som er anvendelig deri.
DK0715636T3 (da) Allyl-epoxy-IPN
BR9611391A (pt) Dispersões aquosas de revestimento em pó
ES8506775A1 (es) Un metodo de fabricar una composicion de polimero
DE3472564D1 (en) Epoxy compositions containing substituted diamine hardeners
EP0228277A3 (en) Moisture resistant, wet winding epoxy resin system containing aromatic diamines
EP0637595A4 (en) POLYMER PRODUCTION PROCESS.
DK0413386T3 (da) Interpenetrerende netværk af ringholdige allylpolymerer og epoxyharpiks, og et laminat fremstillet deraf
EP0383178A3 (en) Curable dielectric polyphenylene ether-polyepoxide compositions
AU628214B2 (en) Advanced epoxy resin composition and process therefor
EP0315418A3 (en) Adhesive resin compositions and laminates utilizing same
TW340133B (en) Room-temperature stable, one-component, flexible epoxy adhesives
EP0249262A3 (en) Thermoplastic polymer composition having thermosetting processing characteristics
CA2038215A1 (en) Poly(aryl ether sulfone) compositions
TW200516126A (en) Adhesive composition for semiconductor devices, coverlay films, adhesive sheets and copper-clad polyimide films using the composition
Goldsmith et al. On graphs with equal edge-connectivity and minimum degree
MY131084A (en) Epoxy resin compositions for use in electrical laminates.
MX9700164A (es) Composiciones cataliticas y recubrimientos fabricados a partir de las mismas.
MY101044A (en) Non-sintering epoxy resins prepared from triglycidyl ethers and epihalohyhdrins
ES8704979A1 (es) Un procedimiento para preparar una dispersion no acuosa de resina epoxidica
EP0244119A3 (en) Epoxy resins prepared from trisphenols and dicyclopentadiene
GB1525580A (en) Photocrosslinkable compositions
ATE150053T1 (de) Halogenfreie harzmischung, ein diese harzmischung enthaltendes, selbstverlöschendes prepreg sowie dessen verwendung
CA2013295A1 (en) Polyglycidyl polyether resins

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 715636

Country of ref document: ES