ES2108779T3 - Paso de vidrio comprimido. - Google Patents

Paso de vidrio comprimido.

Info

Publication number
ES2108779T3
ES2108779T3 ES93109163T ES93109163T ES2108779T3 ES 2108779 T3 ES2108779 T3 ES 2108779T3 ES 93109163 T ES93109163 T ES 93109163T ES 93109163 T ES93109163 T ES 93109163T ES 2108779 T3 ES2108779 T3 ES 2108779T3
Authority
ES
Spain
Prior art keywords
glass
holes
alloys
integrated connection
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93109163T
Other languages
English (en)
Inventor
Wolfgang Dr Hornig
Walter Dipl-Ing Findl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electrovac AG
Diehl Verwaltungs Stiftung
Original Assignee
Electrovac AG
Diehl GmbH and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electrovac AG, Diehl GmbH and Co filed Critical Electrovac AG
Application granted granted Critical
Publication of ES2108779T3 publication Critical patent/ES2108779T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B5/00—Melting in furnaces; Furnaces so far as specially adapted for glass manufacture
    • C03B5/16—Special features of the melting process; Auxiliary means specially adapted for glass-melting furnaces
    • C03B5/23—Cooling the molten glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C29/00—Joining metals with the aid of glass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Glass Compositions (AREA)
  • Continuous Casting (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Insulators (AREA)
  • Insulating Bodies (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

LA INVENCION TRATA DE LA PRODUCCION DE UNOS ORIFICIOS DE PASO, EN VIDRIO PRENSADO, EN UN CUERPO METALICO. SEMEJANTES ORIFICIOS DE PASO SE EMPLEAN EN CARCASAS METALICAS PARA SEMICONDUCTORES, PARTICULARMENTE CIRCUITOS DE CONEXION INTEGRADAS. ESTOS ORIFICIOS DE PASO PUEDEN CERRARSE HERMETICAMENTE EN EL INTERIOR DE LA CARCASA FRENTE AL AMBIENTE EXTERIOR. PARA ESTE FIN SE REFUNDE UNA PERLA DE VIDRIO EN UN TALADRO DE LA CARCASA Y EL CONECTOR DE EMPALME GUIA LA CONEXION INTEGRADA HACIA EL EXTERIOR A TRAVES DEL VIDRIO. SE DETERMINA ,QUE LAS ALEACIONES DEL SISTEMA CU,AL Y MG DURANTE EL ENFRIAMIENTO Y DESPUES DEL PROCESO DE REFUNDIDO PRESENTA UN EFECTO DE DUREZA,QUE ORIGINA EL PODER PRODUCIR ORIFICIOS DE PASO EN VIDRIO PRENSADO CON ESTAS ALEACIONES, QUE PRESENTAN UNA GRAN HERMETICIDAD A ELEVADAS CARGAS TERMICAS Y/O MECANICAS. POSEEN BUENA RESISTENCIA A LA CORROSION Y AL CAMBIO DE TEMPERATURA.
ES93109163T 1992-06-18 1993-06-08 Paso de vidrio comprimido. Expired - Lifetime ES2108779T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4219953A DE4219953C2 (de) 1992-06-18 1992-06-18 Herstellung von Druckglasdurchführungen mit Fassungen aus ausscheidungshärtbaren Legierungen

Publications (1)

Publication Number Publication Date
ES2108779T3 true ES2108779T3 (es) 1998-01-01

Family

ID=6461286

Family Applications (1)

Application Number Title Priority Date Filing Date
ES93109163T Expired - Lifetime ES2108779T3 (es) 1992-06-18 1993-06-08 Paso de vidrio comprimido.

Country Status (11)

Country Link
US (1) US5633531A (es)
EP (1) EP0574797B1 (es)
JP (1) JPH06234550A (es)
KR (1) KR940005503A (es)
AT (1) ATE157815T1 (es)
AU (1) AU659017B2 (es)
CA (1) CA2098699A1 (es)
DE (2) DE4219953C2 (es)
ES (1) ES2108779T3 (es)
MY (1) MY109226A (es)
TW (1) TW235955B (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6084296A (en) * 1998-07-09 2000-07-04 Satcon Technology Corporation Low cost high power hermetic package with electrical feed-through bushings
DE19842943C2 (de) 1998-09-18 2001-09-20 Schott Glas Biokompatible Glas-Metall-Durchführungen und ihre Verwendung
DE10128301A1 (de) * 2001-06-12 2003-01-16 Siemens Ag Verfahren zur Herstellung einer gasdichten Durchführung eines Kontaktes durch eine Wandung und Einrichtuung zur Durchführung eines elektrischen Kontaktes duch eine Wandung
DE102005013661B4 (de) * 2005-03-24 2007-06-28 Eichenauer Heizelemente Gmbh & Co. Kg Heizeinsatz
DE102008042716A1 (de) 2008-10-09 2010-04-15 Cube Optics Ag Kompakter Multiplexer/Demultiplexer
DE102008042719A1 (de) 2008-10-09 2010-04-15 Cube Optics Ag Kompakter Multiplexer/Demultiplexer
DE102021122596A1 (de) * 2021-09-01 2023-03-02 Schott Ag Durchführung

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3685005A (en) * 1969-07-22 1972-08-15 Bunker Ramo Hermetically sealed connector
FR2119863B1 (es) * 1970-12-30 1974-07-05 Radiotechnique Compelec
US4128697A (en) * 1977-04-22 1978-12-05 Corning Glass Works Hermetic glass-metal compression seal
US4142918A (en) * 1978-01-23 1979-03-06 Bell Telephone Laboratories, Incorporated Method for making fine-grained Cu-Ni-Sn alloys
US4309507A (en) * 1981-02-23 1982-01-05 Motorola, Inc. Glass and hermetic seal
US4349635A (en) * 1981-10-26 1982-09-14 Motorola, Inc. Lower temperature glass and hermetic seal means and method
JPS59117144A (ja) * 1982-12-23 1984-07-06 Toshiba Corp リ−ドフレ−ムおよびその製造方法
US4524238A (en) * 1982-12-29 1985-06-18 Olin Corporation Semiconductor packages
EP0163510B1 (en) * 1984-05-28 1989-03-29 Koto Electric Co. Ltd. Hermetically sealable package for electronic component
DE3587085T2 (de) * 1984-09-19 1993-09-16 Olin Corp Hermetisch verschlossenes halbleitergehaeuse.
US4805009A (en) * 1985-03-11 1989-02-14 Olin Corporation Hermetically sealed semiconductor package
US4678358A (en) * 1985-07-15 1987-07-07 National Semiconductor Corporation Glass compression seals using low temperature glass
WO1988005254A1 (en) * 1987-01-12 1988-07-14 Olin Corporation Process for producing formable and high strength leadframes in semiconductor packages
US5047371A (en) * 1988-09-02 1991-09-10 Olin Corporation Glass/ceramic sealing system

Also Published As

Publication number Publication date
DE4219953C2 (de) 1996-05-30
US5633531A (en) 1997-05-27
AU659017B2 (en) 1995-05-04
AU4120393A (en) 1993-12-23
DE59307237D1 (de) 1997-10-09
TW235955B (es) 1994-12-11
EP0574797B1 (de) 1997-09-03
ATE157815T1 (de) 1997-09-15
EP0574797A2 (de) 1993-12-22
CA2098699A1 (en) 1993-12-19
KR940005503A (ko) 1994-03-21
JPH06234550A (ja) 1994-08-23
EP0574797A3 (de) 1994-01-05
DE4219953A1 (de) 1994-01-05
MY109226A (en) 1996-12-31

Similar Documents

Publication Publication Date Title
ES2108779T3 (es) Paso de vidrio comprimido.
ES2009353A6 (es) Una aleacion para componentes de instalacines de abastecimiento de agua potable.
BR0111559B1 (pt) métodos de fabricação de um sistema de resfriamento de forno, e, sistema de resfriamento de forno.
ES2003843A4 (es) Proyectil perforante con nucleo duro y guia ductil y su procedimientode fabricacion.
IT8220358A0 (it) Lega di magnesio per getti ad elevate proprieta' meccaniche contenente ittrio e neodimio.
EP0478247A3 (en) Alkoxybenzotriazole compositions and the use thereof as copper and copper alloy corrosion inhibitors
ES2116449T3 (es) Procedimiento de descontaminacion de tierras contaminadas con metales.
IT8249051A0 (it) Procedimento e composizione per il raffreddamento rapido di metalli dopo il loro trattamento termico
GB1061709A (en) Method of attaching fins or sheets to tubes and apparatus comprising tubes fitted with or to fins or sheets
ES8502167A1 (es) Un metodo de fabricar un producto forjado a base de una aleacion de niquel-cromo-molibdeno de alto indice elastico y resistente a la corrosion.
JPS57134294A (en) Aluminum alloy solder joint for heat exchanger
GB2017761A (en) A method for brazing aluminium or an aluminium alloy to a ferrous or cuprous alloy
SE8301650D0 (sv) Sett for framstellning av ett med atminstone en flens forsett kokillror av koppar eller kopparlegering
ES2080984T3 (es) Cuerpos macizos a base de un material ceramico superconductor para altas temperaturas, en los que se han formado contactos con conductores metalicos, asi como procedimiento para su produccion.
GB1065030A (en) A method of reducing corrosion of metals due to flow of liquids thereover
FR2394032A1 (fr) Nouveaux panneaux solaires et leur procede de fabrication
Lahiri et al. Pitting of Lubricating Oil Cooler Tube Due to Localised Dezincification
ATE84322T1 (de) Korrosionsinhibitoren fuer kupfer und kupferlegierungen.
ATE30073T1 (de) Kupfer-aluminium-rohrverbindungen.
PE20040824A1 (es) Montaje y metodo para abrir y cerrar el agujero de colada de un reactor de fundicion
Harrison Nickel--Titanium--Copper Shape Memory Alloys
SU1524537A1 (ru) Ингибитор коррозии металлов
FR2343212A1 (fr) Tuyere a double chambre de refroidissement
IT1177191B (it) Procedimento di pressofusione per metalli leggerei e loro leghe
JPS56110893A (en) Method of preventing corrosion of inner surface of condenser tube for heat exchanger

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 574797

Country of ref document: ES