ES2112529T3 - Instalacion de soldadura de componentes montados superficialmente. - Google Patents

Instalacion de soldadura de componentes montados superficialmente.

Info

Publication number
ES2112529T3
ES2112529T3 ES94911186T ES94911186T ES2112529T3 ES 2112529 T3 ES2112529 T3 ES 2112529T3 ES 94911186 T ES94911186 T ES 94911186T ES 94911186 T ES94911186 T ES 94911186T ES 2112529 T3 ES2112529 T3 ES 2112529T3
Authority
ES
Spain
Prior art keywords
surface mounted
mounted components
welding installation
printed circuit
tunnel furnace
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES94911186T
Other languages
English (en)
Inventor
Friedrich-Wilhelm Kuchenhart
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fredart Sondermaschinen GmbH
Original Assignee
Fredart Sondermaschinen GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fredart Sondermaschinen GmbH filed Critical Fredart Sondermaschinen GmbH
Application granted granted Critical
Publication of ES2112529T3 publication Critical patent/ES2112529T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0053—Soldering by means of radiant energy soldering by means of infrared [IR]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Nonmetallic Welding Materials (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)

Abstract

UN DISPOSITIVO DE SOLDADURA DE REFLUJO PARA DISPOSICION DE CIRCUITO IMPRESO SMD ESTA PROVISTO CON UNA DISPOSICION OPTICA PARA FUSION MONITORIZADA DEL SOLDADOR. UN HORNO DE TUNEL PUEDE SER INSTALADO POR ENCIMA DEL DISPOSITIVO DE SOLDADURA A FIN DE CALENTAR LA DISPOSICION DE CIRCUITO INTEGRADO, QUE ESTA DISPUESTO EN ETAPAS A TRAVES DEL HORNO EN TUNEL Y DEL DISPOSITIVO. UN ACCESORIO PERMITE AREAS SELECCIONADAS DE LA DISPOSICION DE CIRCUITO IMPRESO PARA QUE SEAN ENMASCARADAS TEMPORALMENTE Y PROTEGIDAS CONTRA EL CALOR RADIANTE SUMINISTRADO.
ES94911186T 1993-03-19 1994-03-17 Instalacion de soldadura de componentes montados superficialmente. Expired - Lifetime ES2112529T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9304076U DE9304076U1 (de) 1993-03-19 1993-03-19 Lötgerät für SMD-Leiterplatten

Publications (1)

Publication Number Publication Date
ES2112529T3 true ES2112529T3 (es) 1998-04-01

Family

ID=6890869

Family Applications (1)

Application Number Title Priority Date Filing Date
ES94911186T Expired - Lifetime ES2112529T3 (es) 1993-03-19 1994-03-17 Instalacion de soldadura de componentes montados superficialmente.

Country Status (9)

Country Link
US (1) US5769304A (es)
EP (1) EP0689491B1 (es)
JP (1) JPH08507902A (es)
CN (1) CN1123532A (es)
AT (1) ATE160524T1 (es)
AU (1) AU6377894A (es)
DE (2) DE9304076U1 (es)
ES (1) ES2112529T3 (es)
WO (1) WO1994021415A1 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19815827A1 (de) * 1998-04-09 1999-10-14 Univ Ilmenau Tech Vorrichtung zur Untersuchung thermischer Vorgänge an Werkstoffproben
JP2001077524A (ja) * 1999-09-03 2001-03-23 Fujitsu Ltd リフロー半田付け装置及びリフロー半田付け方法
DE10133217A1 (de) 2001-07-09 2003-01-23 Seho Systemtechnik Gmbh Verfahren und Vorrichtung zum Verlöten von elektrischen Bauteilen auf Kunststofffolie
GB2406904A (en) * 2003-10-09 2005-04-13 Asahi Chemical Ind Measuring the melting, softening or decomposition points by detecting a change in luminosity or reflectance of the sample
GB0414809D0 (en) * 2004-07-02 2004-08-04 British Nuclear Fuels Plc Analytical method
US8205784B1 (en) 2011-04-29 2012-06-26 Trane International Inc. Systems and methods for joining metal
CN103084695B (zh) * 2012-12-31 2016-02-10 北京中科同志科技有限公司 用于回流焊机的记录装置及回流焊机

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4035233A (en) * 1975-06-18 1977-07-12 General Electric Company Channel follower leakage restrictor
SU967701A1 (ru) * 1980-10-20 1982-10-23 Предприятие П/Я А-1001 Способ контрол па ного соединени
EP0209650A3 (en) * 1985-06-07 1989-07-05 Vanzetti Systems, Inc. Method and apparatus for placing and electrically connecting components on a printed circuit board
US4833303A (en) * 1987-07-10 1989-05-23 Mellen Sr Robert H Thermal distortion free viewing of a heated cavity
DE4302976A1 (de) * 1992-07-22 1994-01-27 Bosch Gmbh Robert Vorrichtung und Verfahren zum Auflöten von Bauelementen auf Platinen

Also Published As

Publication number Publication date
JPH08507902A (ja) 1996-08-20
WO1994021415A1 (de) 1994-09-29
US5769304A (en) 1998-06-23
EP0689491A1 (de) 1996-01-03
EP0689491B1 (de) 1997-11-26
ATE160524T1 (de) 1997-12-15
AU6377894A (en) 1994-10-11
DE9304076U1 (de) 1993-07-22
DE59404677D1 (de) 1998-01-08
CN1123532A (zh) 1996-05-29

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