ES2114943T3 - Uso de placas de zona de fresnel para tratamiento de material. - Google Patents

Uso de placas de zona de fresnel para tratamiento de material.

Info

Publication number
ES2114943T3
ES2114943T3 ES92915314T ES92915314T ES2114943T3 ES 2114943 T3 ES2114943 T3 ES 2114943T3 ES 92915314 T ES92915314 T ES 92915314T ES 92915314 T ES92915314 T ES 92915314T ES 2114943 T3 ES2114943 T3 ES 2114943T3
Authority
ES
Spain
Prior art keywords
fzp
fresnel zone
workpiece
hole
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92915314T
Other languages
English (en)
Inventor
Bruce G Macdonald
Robert O Hunter Jr
Adlai H Smith
Clark C Guest
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Litel Instruments Inc
Original Assignee
Litel Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Litel Instruments Inc filed Critical Litel Instruments Inc
Application granted granted Critical
Publication of ES2114943T3 publication Critical patent/ES2114943T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Liquid Crystal (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Polymerisation Methods In General (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)

Abstract

EL APARATO PARA FRESAR Y TRABAJAR MATERIALES INCLUYE UN LASER DE LUZ DIFUNDIDA Y UN SISTEMA DE PLACAS ANILLADAS EN ZONA FRESNEL (FZP) DISPUESTO EN PARALELO A LA PIEZA DE TRABAJO, CON DONDE LA DISTANCIA ENTRE EL FZP Y LA PIEZA DE TRABAJO ES LA DISTANCIA FOCAL DEL FZP. PARA CADA AGUJERO A FORMAR EN LA PIEZA DE TRABAJO, SE FORMA UNA ZONA FRESNEL CORRESPONDIENTE SOBRE EL FZP. CADA ZONA FRESNEL SE PUEDE MODELAR CENTRANDOLA DIRECTAMENTE SOBRE EL LUGAR DESEADO PARA EL AGUJERO O EN LOS MODELOS DE ALTA DENSIDAD SE PUEDE FORMAR DE FORMA DESCENTRADA RESPECTO AL AGUJERO EN DONDE LA DEFLEXION SE CONSIGUE MEDIANTE LA FORMACION DE ARCOS CIRCULARES MAS PEQUEÑOS EN EL LUGAR DE LA ZONA FRESNEL OPUESTA A LA DIRECCION DE DEFLEXION DESEADA. HAY TAMBIEN UN EXPLORADOR DE HACES PARA OBTENER UNA ILUMINACION MAS UNIFORME DEL FZP POR PARTE DEL HAZ LASERICO. CON LA EXPLORACION SE ELIMINA LA FALTA DE UNIFORMIDAD DE LA INTENSIDAD. EL MECANISMO DE ALINEACION HACE USO DE UN LASER DE HELIO Y NEON, CUYO HAZ SE PROYECTA SOBRE UNA RETICULA EN RELIEVE SUPERFICIAL QUE HAY SOBRE LA PIEZA DE TRABAJO. LA LUZ REFLEJADA DESDE LA RETICULA EN RELIEVE SUPERFICIAL SE FILTRA PARA CREAR FRANJAS DE INTERFERENCIA QUE, CUANDO SE ENCUENTRAN ALINEADAS, PROPORCIONAN UNA INTENSIDAD MAXIMA DE LUZ QUE SE PROYECTA A TRAVES DE UNA RETICULA DE TRANSMISION SOBRE LA PLACA ANILLADA EN ZONA FRESNEL.
ES92915314T 1992-07-01 1992-07-01 Uso de placas de zona de fresnel para tratamiento de material. Expired - Lifetime ES2114943T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1992/005555 WO1994001240A1 (en) 1992-07-01 1992-07-01 Use of fresnel zone plates for material processing

Publications (1)

Publication Number Publication Date
ES2114943T3 true ES2114943T3 (es) 1998-06-16

Family

ID=22231213

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92915314T Expired - Lifetime ES2114943T3 (es) 1992-07-01 1992-07-01 Uso de placas de zona de fresnel para tratamiento de material.

Country Status (7)

Country Link
EP (1) EP0648154B1 (es)
JP (1) JPH08504132A (es)
AT (1) ATE163381T1 (es)
DE (1) DE69224536T2 (es)
DK (1) DK0648154T3 (es)
ES (1) ES2114943T3 (es)
WO (1) WO1994001240A1 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9601049D0 (en) 1996-01-18 1996-03-20 Xaar Ltd Methods of and apparatus for forming nozzles
FR2748412B1 (fr) * 1996-05-07 1998-06-19 Solaic Sa Procede de decoupe d'une plaque en matiere plastique
GB9922082D0 (en) * 1999-09-17 1999-11-17 Isis Innovation Laser apparatus for use in material processing
CN110303244B (zh) * 2019-07-25 2020-11-27 中国工程物理研究院激光聚变研究中心 一种快速制备表面周期结构方法
CN113345619B (zh) * 2021-06-16 2022-07-12 中国工程物理研究院激光聚变研究中心 一维x射线折射闪耀波带片
JP7671649B2 (ja) * 2021-08-02 2025-05-02 株式会社Ｓｃｒｅｅｎホールディングス 光検出装置、および、光照射装置
JP2023021574A (ja) * 2021-08-02 2023-02-14 株式会社Ｓｃｒｅｅｎホールディングス 光照射装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5223693A (en) * 1990-04-28 1993-06-29 Mitsubishi Denki Kabushiki Kaisha Optical machining apparatus

Also Published As

Publication number Publication date
DE69224536D1 (de) 1998-04-02
EP0648154A1 (en) 1995-04-19
ATE163381T1 (de) 1998-03-15
DK0648154T3 (da) 1998-09-23
WO1994001240A1 (en) 1994-01-20
JPH08504132A (ja) 1996-05-07
EP0648154B1 (en) 1998-02-25
DE69224536T2 (de) 1998-09-10

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