ES2117995T3 - Baño para deposito galvanico de aleaciones de plata-estaño. - Google Patents

Baño para deposito galvanico de aleaciones de plata-estaño.

Info

Publication number
ES2117995T3
ES2117995T3 ES95100167T ES95100167T ES2117995T3 ES 2117995 T3 ES2117995 T3 ES 2117995T3 ES 95100167 T ES95100167 T ES 95100167T ES 95100167 T ES95100167 T ES 95100167T ES 2117995 T3 ES2117995 T3 ES 2117995T3
Authority
ES
Spain
Prior art keywords
silver
tin
tin alloys
bath
galvanic deposit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95100167T
Other languages
English (en)
Inventor
Gunter Dr Herklotz
Thomas Frey
Wolfgang Hempel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WC Heraus GmbH and Co KG
Original Assignee
WC Heraus GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE4440176A external-priority patent/DE4440176C2/de
Application filed by WC Heraus GmbH and Co KG filed Critical WC Heraus GmbH and Co KG
Application granted granted Critical
Publication of ES2117995T3 publication Critical patent/ES2117995T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

LAS ALEACIONES PLATA-ESTAÑO SE SEPARAN SOBRE UNA VIA GALVANICA A PARTIR DE UN BAÑO LIBRE DE CIANURO, QUE SE PREPARA BAJO LA UTILIZACION DE PLATA COMO NITRATO O COMPLEJO DE DIAMMINA, ESTAÑO COMO COMPUESTO SOLUBLE DE ESTAÑO (II) O COMO ESTAÑO (IV), ACIDOS CARBOXILICOS MERCAPTO ALCANO Y ACIDOS SULFONICOS MERCAPTO ALCANO. A PARTIR DEL BAÑO SE SEPARAN LAS CAPAS REGULARES Y RESISTENTES A LA ADHERENCIA A BASE DE ALEACIONES PLATA-ESTAÑO CON UN CONTENIDO EN PLATA DE APROXIMADAMENTE 20-99 % EN PESO.
ES95100167T 1994-02-05 1995-01-07 Baño para deposito galvanico de aleaciones de plata-estaño. Expired - Lifetime ES2117995T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4403601 1994-02-05
DE4440176A DE4440176C2 (de) 1994-02-05 1994-11-10 Bad zum galvanischen Abscheiden von Silber-Zinn-Legierungen

Publications (1)

Publication Number Publication Date
ES2117995T3 true ES2117995T3 (es) 1998-09-01

Family

ID=25933579

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95100167T Expired - Lifetime ES2117995T3 (es) 1994-02-05 1995-01-07 Baño para deposito galvanico de aleaciones de plata-estaño.

Country Status (5)

Country Link
US (1) US5514261A (es)
EP (1) EP0666342B1 (es)
JP (1) JPH07252684A (es)
CA (1) CA2141090A1 (es)
ES (1) ES2117995T3 (es)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3301707B2 (ja) * 1997-01-20 2002-07-15 ディップソール株式会社 錫−銀合金酸性電気めっき浴
DE19752329A1 (de) * 1997-11-26 1999-05-27 Stolberger Metallwerke Gmbh Verfahren zur Herstellung eines metallischen Verbundbands
US6210556B1 (en) 1998-02-12 2001-04-03 Learonal, Inc. Electrolyte and tin-silver electroplating process
JP3352422B2 (ja) 1999-02-10 2002-12-03 セントラル硝子株式会社 銀被膜形成用薬液および銀被膜形成方法
JP3433291B2 (ja) * 1999-09-27 2003-08-04 石原薬品株式会社 スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品
JP3266242B2 (ja) * 1999-10-12 2002-03-18 理研電線株式会社 錫めっき線の熱酸化黄変防止法
DE10014852A1 (de) * 2000-03-24 2001-09-27 Enthone Omi Deutschland Gmbh Verfahren zur Abscheidung einer Silber-Zinn-Legierung
US6491806B1 (en) * 2000-04-27 2002-12-10 Intel Corporation Electroplating bath composition
US7628903B1 (en) 2000-05-02 2009-12-08 Ishihara Chemical Co., Ltd. Silver and silver alloy plating bath
US6924044B2 (en) 2001-08-14 2005-08-02 Snag, Llc Tin-silver coatings
US7122108B2 (en) 2001-10-24 2006-10-17 Shipley Company, L.L.C. Tin-silver electrolyte
TW500836B (en) * 2001-11-13 2002-09-01 Jung-Huei Chen Low-lead-content plating process
DE10158227A1 (de) * 2001-11-15 2003-06-05 Siemens Ag Elektrolysebad zum galvanischen Abscheiden von Silber-Zinn-Legierungen
US20070037005A1 (en) * 2003-04-11 2007-02-15 Rohm And Haas Electronic Materials Llc Tin-silver electrolyte
DE102005055742A1 (de) * 2005-11-23 2007-05-24 Robert Bosch Gmbh Verfahren zum Herstellen einer kontaktgeeigneten Schicht auf einem Metallelement
US20070158199A1 (en) * 2005-12-30 2007-07-12 Haight Scott M Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps
US20080308300A1 (en) * 2007-06-18 2008-12-18 Conti Mark A Method of manufacturing electrically conductive strips
EP2085502A1 (en) * 2008-01-29 2009-08-05 Enthone, Incorporated Electrolyte composition and method for the deposition of a tin-zinc alloy
DE102011088211A1 (de) * 2011-12-12 2013-06-13 Robert Bosch Gmbh Kontaktelement und Verfahren zu seiner Herstellung
US9663667B2 (en) 2013-01-22 2017-05-30 Andre Reiss Electroless silvering ink
US9512529B2 (en) 2013-06-04 2016-12-06 Rohm And Haas Electronic Materials Llc Electroplating baths of silver and tin alloys
CN108517516B (zh) * 2018-05-29 2020-10-23 电子科技大学 一种化学镀银液及其制备方法
DE102018126174B3 (de) * 2018-10-22 2019-08-29 Umicore Galvanotechnik Gmbh Thermisch stabile Silberlegierungsschichten, Verfahren zur Abscheidung und Verwendung
US11242609B2 (en) * 2019-10-15 2022-02-08 Rohm and Hass Electronic Materials LLC Acidic aqueous silver-nickel alloy electroplating compositions and methods
US11434577B2 (en) * 2019-10-17 2022-09-06 Rohm And Haas Electronic Materials Llc Acid aqueous binary silver-bismuth alloy electroplating compositions and methods
KR20230041962A (ko) * 2020-07-22 2023-03-27 미쓰비시 마테리알 가부시키가이샤 커넥터용 단자재
JP7119267B2 (ja) * 2020-07-22 2022-08-17 三菱マテリアル株式会社 コネクタ用端子材
JP7353249B2 (ja) * 2020-08-19 2023-09-29 Ｅｅｊａ株式会社 シアン系電解銀合金めっき液

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE718252C (de) * 1939-06-01 1942-03-07 Degussa Verfahren zur Erzeugung schwefelwasserstoffbestaendiger galvanischer Silberueberzuege
DE849787C (de) * 1949-11-15 1952-09-18 Forsch Verfahren zur Herstellung harter galvanischer Silber- und Goldueberzuege
NL267282A (es) * 1960-04-12
CH494284A (fr) * 1968-11-28 1970-07-31 Sel Rex Corp Procédé pour le dépôt électrolytique d'un alliage d'or avec au moins un autre métal commun et bain aqueux de placage pour la mise en oeuvre de ce procédé
US4246077A (en) * 1975-03-12 1981-01-20 Technic, Inc. Non-cyanide bright silver electroplating bath therefor, silver compounds and method of making silver compounds
JPS54141346A (en) * 1978-04-26 1979-11-02 Matsushita Electric Ind Co Ltd Silver-copper alloy plating method
JPS5512111A (en) * 1978-07-11 1980-01-28 Chugoku Toryo Kk Seaweed-feeding coating composition
US4399006A (en) * 1978-08-29 1983-08-16 Learonal, Inc. Silver plating
BR8001854A (pt) * 1979-04-04 1980-11-18 Engelhard Min & Chem Banho de revestimento de prata ou liga da mesma e respectivo processo de estabilizacao
US4248375A (en) * 1979-08-30 1981-02-03 Honeywell Inc. Clock thermostat apparatus having means for reducing the setback temperature when the normal temperature selection is turned down
JPS574715A (en) * 1980-06-12 1982-01-11 Matsushita Electric Works Ltd Extrusion type granulator for synthetic resin molding material
JPS5782492A (en) * 1980-11-11 1982-05-22 Seiko Instr & Electronics Ltd Copper-tin alloy plating bath
US4412965A (en) * 1981-09-08 1983-11-01 The Goodyear Tire & Rubber Company Method of making an air spring
US4582576A (en) * 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
JPH0751630B2 (ja) * 1989-06-20 1995-06-05 住友精化株式会社 硬化性組成物
JP2676547B2 (ja) * 1989-03-29 1997-11-17 株式会社大和化成研究所 中性すず又はすず―鉛合金電気めっき浴

Also Published As

Publication number Publication date
US5514261A (en) 1996-05-07
CA2141090A1 (en) 1995-08-06
EP0666342B1 (de) 1998-05-06
EP0666342A1 (de) 1995-08-09
JPH07252684A (ja) 1995-10-03

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