ES2132124T3 - Soluciones de aceleracion basicas para galvanoplastia directa. - Google Patents
Soluciones de aceleracion basicas para galvanoplastia directa.Info
- Publication number
- ES2132124T3 ES2132124T3 ES92913993T ES92913993T ES2132124T3 ES 2132124 T3 ES2132124 T3 ES 2132124T3 ES 92913993 T ES92913993 T ES 92913993T ES 92913993 T ES92913993 T ES 92913993T ES 2132124 T3 ES2132124 T3 ES 2132124T3
- Authority
- ES
- Spain
- Prior art keywords
- direct
- galvanoplasty
- solutions
- basic acceleration
- acceleration solutions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001133 acceleration Effects 0.000 title 1
- 239000000243 solution Substances 0.000 abstract 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 229910001431 copper ion Inorganic materials 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Paints Or Removers (AREA)
- Pyridine Compounds (AREA)
- Indole Compounds (AREA)
- Electrolytic Production Of Metals (AREA)
- Transceivers (AREA)
- Mobile Radio Communication Systems (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
Abstract
SE PRESENTAN Y REIVINDICAN NUEVAS SOLUCIONES ACELERADORAS ACUOSAS Y METODOS PARA SU USO EN CONEXION CON UNA GALVANOPLASTIA DIRECTA DE MATERIALES BASICOS DIELECTRICOS. LAS SOLUCIONES ACELERADORAS SON SOLUCIONES ACUOSAS LIGERAMENTE BASICAS QUE INCLUYEN CONCENTRACIONES DILUIDAS DE IONES DE COBRE.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US71818691A | 1991-06-20 | 1991-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2132124T3 true ES2132124T3 (es) | 1999-08-16 |
Family
ID=24885150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES92913993T Expired - Lifetime ES2132124T3 (es) | 1991-06-20 | 1992-06-17 | Soluciones de aceleracion basicas para galvanoplastia directa. |
Country Status (10)
| Country | Link |
|---|---|
| EP (1) | EP0590046B1 (es) |
| JP (1) | JP3143707B2 (es) |
| KR (1) | KR100295144B1 (es) |
| AT (1) | ATE179761T1 (es) |
| AU (1) | AU659857B2 (es) |
| DE (1) | DE69229115T2 (es) |
| DK (1) | DK0590046T3 (es) |
| ES (1) | ES2132124T3 (es) |
| GR (1) | GR3030770T3 (es) |
| WO (1) | WO1993000456A1 (es) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1054081B1 (en) | 1993-03-18 | 2006-02-01 | ATOTECH Deutschland GmbH | Composition and process for treating a surface coated with a self-accelerating and replenishing non-formaldehyde immersion coating |
| EP0905285B1 (en) * | 1997-02-03 | 2000-12-27 | Okuno Chemical Industries Co., Ltd. | Method for electroplating nonconductive material |
| SG107593A1 (en) * | 2002-06-04 | 2004-12-29 | Agency Science Tech & Res | Method for electroless metalisation of polymer substrate |
| JP5072059B2 (ja) * | 2005-10-25 | 2012-11-14 | 住友軽金属工業株式会社 | 銅管または銅合金管内面の洗浄方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3011920A (en) * | 1959-06-08 | 1961-12-05 | Shipley Co | Method of electroless deposition on a substrate and catalyst solution therefor |
| US3340164A (en) * | 1963-12-26 | 1967-09-05 | Sperry Rand Corp | Method of copper plating anodized aluminum |
| US3793038A (en) * | 1973-01-02 | 1974-02-19 | Crown City Plating Co | Process for electroless plating |
| US4311551A (en) * | 1979-04-12 | 1982-01-19 | Philip A. Hunt Chemical Corp. | Composition and method for etching copper substrates |
| SU921124A1 (ru) * | 1979-06-19 | 1982-04-15 | Институт Физико-Химических Основ Переработки Минерального Сырья Со Ан Ссср | Способ металлизации отверстий печатных плат |
| US5071517A (en) * | 1989-11-21 | 1991-12-10 | Solution Technology Systems | Method for directly electroplating a dielectric substrate and plated substrate so produced |
-
1992
- 1992-06-17 AU AU22280/92A patent/AU659857B2/en not_active Ceased
- 1992-06-17 EP EP92913993A patent/EP0590046B1/en not_active Expired - Lifetime
- 1992-06-17 ES ES92913993T patent/ES2132124T3/es not_active Expired - Lifetime
- 1992-06-17 JP JP05501547A patent/JP3143707B2/ja not_active Expired - Lifetime
- 1992-06-17 DE DE69229115T patent/DE69229115T2/de not_active Expired - Lifetime
- 1992-06-17 WO PCT/US1992/005084 patent/WO1993000456A1/en not_active Ceased
- 1992-06-17 KR KR1019930703990A patent/KR100295144B1/ko not_active Expired - Fee Related
- 1992-06-17 AT AT92913993T patent/ATE179761T1/de not_active IP Right Cessation
- 1992-06-17 DK DK92913993T patent/DK0590046T3/da active
-
1999
- 1999-07-14 GR GR990401855T patent/GR3030770T3/el unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06510568A (ja) | 1994-11-24 |
| DE69229115D1 (de) | 1999-06-10 |
| AU659857B2 (en) | 1995-06-01 |
| KR940701463A (ko) | 1994-05-28 |
| JP3143707B2 (ja) | 2001-03-07 |
| ATE179761T1 (de) | 1999-05-15 |
| EP0590046A1 (en) | 1994-04-06 |
| EP0590046B1 (en) | 1999-05-06 |
| GR3030770T3 (en) | 1999-11-30 |
| KR100295144B1 (ko) | 2001-09-17 |
| DK0590046T3 (da) | 1999-11-01 |
| WO1993000456A1 (en) | 1993-01-07 |
| AU2228092A (en) | 1993-01-25 |
| DE69229115T2 (de) | 1999-10-14 |
| EP0590046A4 (en) | 1995-07-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG2A | Definitive protection |
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