ES2135124T3 - Dispositivo para el tratamiento de un substrato, particularmente para la perforacion de papel. - Google Patents

Dispositivo para el tratamiento de un substrato, particularmente para la perforacion de papel.

Info

Publication number
ES2135124T3
ES2135124T3 ES96103798T ES96103798T ES2135124T3 ES 2135124 T3 ES2135124 T3 ES 2135124T3 ES 96103798 T ES96103798 T ES 96103798T ES 96103798 T ES96103798 T ES 96103798T ES 2135124 T3 ES2135124 T3 ES 2135124T3
Authority
ES
Spain
Prior art keywords
mirror
laser
paper
substrate
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96103798T
Other languages
English (en)
Inventor
Lutz Dr Langhans
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carl Baasel Lasertechnik GmbH and Co KG
Original Assignee
Carl Baasel Lasertechnik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Baasel Lasertechnik GmbH and Co KG filed Critical Carl Baasel Lasertechnik GmbH and Co KG
Application granted granted Critical
Publication of ES2135124T3 publication Critical patent/ES2135124T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24C—MACHINES FOR MAKING CIGARS OR CIGARETTES
    • A24C5/00—Making cigarettes; Making tipping materials for, or attaching filters or mouthpieces to, cigars or cigarettes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multi-focusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Of Cigar And Cigarette Tobacco (AREA)
  • Paper (AREA)

Abstract

EN UN APARATO PARA PERFORACION DE BANDAS DE PAPEL DE CIGARRILLO SE DISPONE EN LA VIA DE RADIACION DE UN RAYO LASER DERIVADO DE UN ESPEJO (12) GIRATORIO UNA SERIE DE ELEMENTOS (28) OPTICOS COLOCADOS UNO JUNTO A OTRO. CADA UNO DE LOS ELEMENTOS OPTICOS ABARCA UN ELEMENTO (DOE) OPTICO DE DIFRACCION (24'';24'''';24'''''') Y UNA LENTE (18'';18'''';18'''''') COLECTORA. SOBRE LA SUPERFICIE DEL (DOE) INCIDE UN HAZ DE RAYOS LASER PARALELOS, Y EL (DOE) SUMINISTRA UNO O MULTIPLES HACES DE RAYOS CON UNA CONFIGURACION DESEADA. LAS LENTES COLECTORAS GENERAN POR ELLO EN EL PLANO DE LA BANDA (20) DE PAPEL DE CIGARRILLOS UNA O MULTIPLES MANCHAS DE COMBUSTION, POR EJEMPLO DOS O CUATRO PUNTOS (22A, 22B) ALTERNADOS UNO CONTRA OTRO O UN FOCO ANULAR, DE TAL MODO QUE NO SOLAMENTE PUEDA CONFIGURARSE UNA MICROPERFORACION A TRAVES DE LOS PUNTOS DE COMBUSTION INDIVIDUALES, SINO TAMBIEN PUEDAN CONFIGURARSE MACROPERFORACIONES DE TAL MODO, QUE LA ZONA DE PERFORACION COMPLETA SE IMPULSE SOLO CON ENERGIA EN LA ZONA PERIMETRICA DE LA MACROPERFORACION.
ES96103798T 1995-03-28 1996-03-11 Dispositivo para el tratamiento de un substrato, particularmente para la perforacion de papel. Expired - Lifetime ES2135124T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19511393A DE19511393B4 (de) 1995-03-28 1995-03-28 Gerät zur Substratbehandlung, insbesondere zum Perforieren von Papier

Publications (1)

Publication Number Publication Date
ES2135124T3 true ES2135124T3 (es) 1999-10-16

Family

ID=7757978

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96103798T Expired - Lifetime ES2135124T3 (es) 1995-03-28 1996-03-11 Dispositivo para el tratamiento de un substrato, particularmente para la perforacion de papel.

Country Status (7)

Country Link
US (1) US5684617A (es)
EP (1) EP0734809B1 (es)
JP (1) JPH08276288A (es)
KR (1) KR960033328A (es)
AT (1) ATE181268T1 (es)
DE (1) DE19511393B4 (es)
ES (1) ES2135124T3 (es)

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EP0656241B1 (en) 1993-06-04 1998-12-23 Seiko Epson Corporation Apparatus and method for laser machining
US6037564A (en) * 1998-03-31 2000-03-14 Matsushita Electric Industrial Co., Ltd. Method for scanning a beam and an apparatus therefor
DE19840926B4 (de) * 1998-09-08 2013-07-11 Hell Gravure Systems Gmbh & Co. Kg Anordnung zur Materialbearbeitung mittels Laserstrahlen und deren Verwendung
DE19846368C1 (de) * 1998-10-08 2000-04-13 Univ Stuttgart Strahlwerkzeuge Vorrichtung zum Schneiden, Schweißen, Bohren oder Abtragen eines Werkstückes mittels eines Laserstrahles
JP4218209B2 (ja) * 1999-03-05 2009-02-04 三菱電機株式会社 レーザ加工装置
JP3346374B2 (ja) * 1999-06-23 2002-11-18 住友電気工業株式会社 レーザ穴開け加工装置
DE19937267A1 (de) * 1999-08-06 2001-02-15 Baasel Carl Lasertech Vorrichtung zur Behandlung eines Substrates mittels Laserstrahlung
DE19954161C1 (de) * 1999-11-10 2001-08-09 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Perforieren von bogen- oder bahnenförmigem Papiermaterial
DE10041020A1 (de) * 2000-08-22 2002-03-07 Topack Verpacktech Gmbh Einrichtung und Verfahren zur Erzeugung wenigstens einer Schwächungslinie an einem flächigen Verpackungsmaterial und Verpackungsmaterial
ES2286002T3 (es) * 2000-09-27 2007-12-01 Eberhard Kertscher Procedimiento para la fabricacion continua de tubos de riego por goteo.
DE10120923A1 (de) 2001-04-30 2002-10-31 Hauni Maschinenbau Ag Vorrichtung zum Perforieren von stabförmigen Gegenständen insbesondere der Tabak verarbeitenden Industrie
DE10128043A1 (de) * 2001-06-08 2002-12-12 Topack Verpacktech Gmbh Verfahren und Einrichtung zum Bearbeiten eines Füllmaterials eines Produkts der tabakverarbeitenden Industrie und Verfahren und System zur Sicherstellung der Echtheit von Produkten der tabakverarbeitenden Industrie
DE10141731A1 (de) * 2001-08-25 2003-03-13 Bosch Gmbh Robert Vorrichtung und Verfahren zum Erzeugen von Löchern in Werkstücken mittels mindestens eines Laserstrahls
JP3925169B2 (ja) * 2001-11-26 2007-06-06 株式会社デンソー レーザー光による材料の同時一括溶融方法及び装置
US6945922B2 (en) * 2001-11-30 2005-09-20 Kimberly-Clark Worldwide, Inc. System for cutting a moving web in the cross direction to form sheets of a given length at high web speeds
DE10225387B4 (de) * 2002-06-07 2007-09-20 Mlt Micro Laser Technology Gmbh Vorrichtung zur Substratbehandlung mittels Laserstrahlung
US7094193B2 (en) * 2003-08-28 2006-08-22 Philip Morris Usa Inc. High speed laser perforation of cigarette tipping paper
GB0328370D0 (en) * 2003-12-05 2004-01-14 Southampton Photonics Ltd Apparatus for providing optical radiation
DE102004001327B4 (de) * 2004-01-08 2006-06-14 Werner Grosse Verfahren und Vorrichtung zur Laserperforation von breiten Warenbahnen
DE202004013136U1 (de) * 2004-03-11 2005-07-21 Kuka Schweissanlagen Gmbh Modulare Lichtwellenoptik
WO2006018016A2 (de) 2004-08-18 2006-02-23 Arctos Showlasertechnik E. Kfm Laservorrichtungen zur erzeugung von laserstrahlen
EP1993781A4 (en) 2006-02-03 2016-11-09 Semiconductor Energy Lab Co Ltd MANUFACTURING METHOD FOR MEMORY ELEMENT, LASER RADIATION APPARATUS AND LASER RADIATION METHOD
JP5178022B2 (ja) * 2006-02-03 2013-04-10 株式会社半導体エネルギー研究所 記憶素子の作製方法
US8580700B2 (en) * 2006-02-17 2013-11-12 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US7532378B2 (en) * 2006-02-21 2009-05-12 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus, method of laser irradiation, and method for manufacturing semiconductor device
DE102006013929A1 (de) 2006-03-21 2007-09-27 Hauni Maschinenbau Ag Perforationsvorrichtung der tabakverarbeitenden Industrie zum Perforieren einer Umhüllung eines stabförmigen Artikels
US20080023458A1 (en) * 2006-07-28 2008-01-31 Canon Kabushiki Kaisha Sheet boring apparatus and image forming apparatus
US20080047939A1 (en) * 2006-08-25 2008-02-28 Stefan Hummelt Process and apparatus for joining at least two elements
JP2008114248A (ja) * 2006-11-02 2008-05-22 Sumitomo Heavy Ind Ltd レーザ加工方法及びレーザ加工装置
AT505283B1 (de) * 2007-02-05 2008-12-15 Starlinger & Co Gmbh Verfahren zum herstellen von bahnabschnitten aus flexiblem bahnmaterial sowie zum herstellen von verpackungsbehältern
DE102010028469B4 (de) 2010-04-30 2012-05-31 Rofin-Baasel Lasertech Gmbh & Co. Kg Vorrichtung zum Einbringen von voneinander in einer Längsrichtung beabstandeten Nuten oder Schlitzen in eine in diese Längsrichtung bewegte Materialbahn mit einem Laserstrahl
DE102010062071A1 (de) * 2010-11-26 2012-05-31 Rofin-Baasel Lasertech Gmbh & Co. Kg Vorrichtung zum Einbringen von voneinander in einer Längsrichtung beabstandeten Vertiefungen oder Öffnungen in eine in diese Längsrichtung bewegte Materialbahn
US9283638B2 (en) * 2011-11-25 2016-03-15 Rofin-Baasel Lasertech Gmbh & Co. Kg Device for forming longitudinally spaced grooves or slits into a material web with a focused laser beam
PL2902149T3 (pl) * 2012-10-29 2017-09-29 Japan Tobacco, Inc. Laserowy perforator
CN105150275B (zh) * 2013-03-25 2017-01-04 兰如林 适用在布料、皮料以及革料上的打孔机
US11247428B2 (en) * 2016-11-07 2022-02-15 Marstonmap, Llc Apparatus and method for producing microperforated patches and labels applicable to modified atmosphere packaging
WO2018216108A1 (ja) * 2017-05-23 2018-11-29 堺ディスプレイプロダクト株式会社 素子基板の製造方法およびレーザクリーニング装置
CN107297574B (zh) * 2017-06-23 2019-01-04 奔腾激光(温州)有限公司 一种激光切割机切割头调焦方法
CA3131506A1 (en) 2018-02-26 2019-08-29 David PAUWELS Methods for preparing cannabis hurd fiber, purified cannabis hurd fiber, and articles containing the purified cannabis hurd fiber
JP7295728B2 (ja) * 2019-07-11 2023-06-21 日本電信電話株式会社 レーザー光走査装置及びレーザー光走査方法
WO2021031136A1 (zh) * 2019-08-21 2021-02-25 南京智晟达自动化科技有限公司 一种在线式烟支打孔机、控制系统及其控制方法
CN112269222B (zh) * 2020-10-30 2022-02-11 青岛海泰新光科技股份有限公司 组合式多面体棱镜及光束分束装置
DE102020131405A1 (de) 2020-11-26 2022-06-02 LANG LASER - System GmbH Vorrichtung zur Materialbearbeitung mit Mehrfachapplikation
CN113523577A (zh) * 2021-07-09 2021-10-22 济南森峰激光科技股份有限公司 基于转镜的perc电池片高速激光开槽方法、装置及perc电池片
CN114654108B (zh) * 2022-04-09 2023-06-23 法特迪精密科技（苏州）有限公司 Mems探针硅片切割装置

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DE2754104C2 (de) * 1977-12-05 1987-01-15 Hauni-Werke Körber & Co KG, 2050 Hamburg Vorrichtung zum Herstellen einer Zone gewünschter Luftdurchlässigkeit in einem Hüllmaterialstreifen für stabförmige Artikel der tabakverarbeitenden Industrie
DE2918283C2 (de) * 1979-05-07 1983-04-21 Carl Baasel, Lasertechnik KG, 8000 München Gerät zur Substratbehandlung mit einem Drehspiegel od. dgl.
JP3101636B2 (ja) * 1991-11-21 2000-10-23 日本たばこ産業株式会社 帯状シートの穿孔装置
JP2658809B2 (ja) * 1992-08-27 1997-09-30 三菱電機株式会社 レーザ加工装置
EP0656241B1 (en) * 1993-06-04 1998-12-23 Seiko Epson Corporation Apparatus and method for laser machining

Also Published As

Publication number Publication date
EP0734809B1 (de) 1999-06-16
KR960033328A (ko) 1996-10-22
DE19511393A1 (de) 1996-10-02
DE19511393B4 (de) 2005-08-25
JPH08276288A (ja) 1996-10-22
US5684617A (en) 1997-11-04
ATE181268T1 (de) 1999-07-15
EP0734809A1 (de) 1996-10-02

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