ES2144209T3 - Metodo de soldadura mejorada por reflujo en horno. - Google Patents

Metodo de soldadura mejorada por reflujo en horno.

Info

Publication number
ES2144209T3
ES2144209T3 ES96305757T ES96305757T ES2144209T3 ES 2144209 T3 ES2144209 T3 ES 2144209T3 ES 96305757 T ES96305757 T ES 96305757T ES 96305757 T ES96305757 T ES 96305757T ES 2144209 T3 ES2144209 T3 ES 2144209T3
Authority
ES
Spain
Prior art keywords
printed circuit
corrective
openings
circuit board
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96305757T
Other languages
English (en)
Inventor
Andrew Zachary Glovatsky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ford Motor Co
Original Assignee
Ford Motor Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ford Motor Co filed Critical Ford Motor Co
Application granted granted Critical
Publication of ES2144209T3 publication Critical patent/ES2144209T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/087—Using a reactive gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

METODO DE SOLDADURA POR REFLUJO EFICAZMENTE DE UNO O MAS DISPOSITIVOS (11) PARA UNA TARJETA DE CIRCUITO IMPRESO (12) CON UN HORNO DE CALENTAMIENTO POR CONVECCION (13), CADA DISPOSITIVO (11) TIENE UNA PLURALIDAD DE PATILLAS DE CONEXION ELECTRONICA PARA FIJACION EN LA PLACA (15) QUE ESTAN PARA SER SOLDADAS DENTRO DE LAS APERTURAS DE UNION RESPECTIVAS (17) DE LA TARJETA DE CIRCUITO IMPRESO (12) PARA CONEXION ELECTRONICA, EL METODO COMPRENDE: (I)COLOCACION DE UNA PASTA DE SOLDAR EN CADA UN A DE LAS ABERTURAS (17); (II) ENSAMBLAJE DEL DISPOSITIVO (11) EN LA TARJETA DE CIRCUITO IMPRESO (12) POR POSICIONAMIENTO DE LA PLACA (28) DEL DISPOSITIVO (11) A LO LARGO, PERO ESPACIADOS EN RELACION, LA TARJETA DE CIRCUITO IMPRESO (12) PARA DEFINIR UN ESPACIO PLANO (30) ENTRE ELLOS, CON LAS PATILLAS (15) INTRODUCIENDOSE EN LAS ABERTURAS (17) Y DENTRO DE LA PASTA DE SOLDAR PARA FORMAR ASI UN CONJUNTO; Y (III)PASAR EL CONJUNTO POR EL HORNO DE CALENTAMIENTO POR CONVECCION (13) DURAMENTE DURANTE UN PERIODO DE TIMEPOR PARA DERRETIR LA PASTA DE SOLDAR Y FORMAR UNA CONEXION VALIDA HASTA QUITARLO DEL CALENTAMIENTO CORRECTIVO, DICHO PASO ES SACADO POR EL USO DE CARACTERISTICAS DE LOCALIZACION DEL CALENTAMIENTO CORRECTIVO QUE GUIA EL FLUJO DE CALOR CORRECTIVO ENTRE LA PLACA Y LA TARJETA PARA MEJORAR EL CALENTAMIENTO CORRECTIVO DE LA PASTA DE SOLDAR DESDE AMBOS LADOS DE LA TARJETA.
ES96305757T 1995-09-01 1996-08-05 Metodo de soldadura mejorada por reflujo en horno. Expired - Lifetime ES2144209T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/522,890 US5577657A (en) 1995-09-01 1995-09-01 Method of improved oven reflow soldering

Publications (1)

Publication Number Publication Date
ES2144209T3 true ES2144209T3 (es) 2000-06-01

Family

ID=24082796

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96305757T Expired - Lifetime ES2144209T3 (es) 1995-09-01 1996-08-05 Metodo de soldadura mejorada por reflujo en horno.

Country Status (5)

Country Link
US (1) US5577657A (es)
EP (1) EP0762812B1 (es)
JP (1) JPH09130034A (es)
DE (1) DE69607545T2 (es)
ES (1) ES2144209T3 (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6139336A (en) * 1996-11-14 2000-10-31 Berg Technology, Inc. High density connector having a ball type of contact surface
US6267288B1 (en) * 1999-10-18 2001-07-31 Henry Chung Pallet for combined surface mount and wave solder manufacture of printed ciruits
US6642485B2 (en) * 2001-12-03 2003-11-04 Visteon Global Technologies, Inc. System and method for mounting electronic components onto flexible substrates
US6794616B1 (en) * 2003-04-09 2004-09-21 Visteon Global Technologies, Inc. Solder reflow oven
US9216469B2 (en) * 2013-10-18 2015-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Indirect printing bumping method for solder ball deposition
CN108336624B (zh) * 2018-03-22 2024-01-26 深圳捷创电子科技有限公司 一种连接器的焊接工艺
CN116685077B (zh) * 2023-07-28 2023-11-14 深圳市首航新能源股份有限公司 一种制造电路板的方法及电路板
CN117381096A (zh) * 2023-11-22 2024-01-12 广州创龙电子科技有限公司 一种btb连接器维修方法
CN118198817A (zh) * 2024-03-22 2024-06-14 信光能源科技(安徽)有限公司 电连接器在电路板上的焊接方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3926360A (en) * 1974-05-28 1975-12-16 Burroughs Corp Method of attaching a flexible printed circuit board to a rigid printed circuit board
FR2578099B1 (fr) * 1985-02-26 1987-12-04 Eurofarad Substrat monolithique pour composant electronique de puissance, et procede pour sa fabrication
JPH0773790B2 (ja) * 1985-10-11 1995-08-09 ソニー株式会社 リフロー半田付装置
US4771929A (en) * 1987-02-20 1988-09-20 Hollis Automation, Inc. Focused convection reflow soldering method and apparatus
JPH0763839B2 (ja) * 1989-10-06 1995-07-12 日立テクノエンジニアリング株式会社 リフローはんだ付け装置
US5309545A (en) * 1990-08-27 1994-05-03 Sierra Research And Technology, Inc. Combined radiative and convective rework system
US5129573A (en) * 1991-10-25 1992-07-14 Compaq Computer Corporation Method for attaching through-hole devices to a circuit board using solder paste
US5263599A (en) * 1992-03-03 1993-11-23 Sklar Jeffrey S Infant nursing device
US5419481A (en) * 1993-09-21 1995-05-30 Air-Vac Engineering Company, Inc. Process and apparatus for attaching/deataching land grid array components

Also Published As

Publication number Publication date
DE69607545D1 (de) 2000-05-11
JPH09130034A (ja) 1997-05-16
EP0762812A2 (en) 1997-03-12
EP0762812B1 (en) 2000-04-05
DE69607545T2 (de) 2000-08-24
US5577657A (en) 1996-11-26
EP0762812A3 (en) 1998-03-11

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