ES2151949T3 - Masas de colada endurecibles, a base de resina epoxi, que contienen un promotor de tenacidad del tipo nucleo/envoltura. - Google Patents

Masas de colada endurecibles, a base de resina epoxi, que contienen un promotor de tenacidad del tipo nucleo/envoltura.

Info

Publication number
ES2151949T3
ES2151949T3 ES95810765T ES95810765T ES2151949T3 ES 2151949 T3 ES2151949 T3 ES 2151949T3 ES 95810765 T ES95810765 T ES 95810765T ES 95810765 T ES95810765 T ES 95810765T ES 2151949 T3 ES2151949 T3 ES 2151949T3
Authority
ES
Spain
Prior art keywords
endurable
nucleus
promoter
epoxy resin
liquid masses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95810765T
Other languages
English (en)
Inventor
Ulrich Dr Weidmann
Robert Peter Dr Peyer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF Schweiz AG
Original Assignee
Ciba Spezialitaetenchemie Holding AG
Ciba SC Holding AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Spezialitaetenchemie Holding AG, Ciba SC Holding AG filed Critical Ciba Spezialitaetenchemie Holding AG
Application granted granted Critical
Publication of ES2151949T3 publication Critical patent/ES2151949T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/06—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L55/00—Compositions of homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C08L23/00 - C08L53/00
    • C08L55/02—ABS [Acrylonitrile-Butadiene-Styrene] polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

MASAS FLUIDAS DE EPOXIRRESINA CONTENIENDO A) UNA EPOXIRRESINA AROMATICA O CICLOALIFATICA CON MAS DE UN GRUPO EPOXI 1,2 POR TERMINO MEDIO EN LA MOLECULA, B) UN ENDURECEDOR PARA LA EPOXIRESINA EN CANTIDAD SUFICIENTE PARA QUE SE ENDUREZCA, C) UN INTERMEDIARIO DE VISCOSIDAD, Y D) U OXIDO DE ALUMINIO ESTRATIFICADO CON UN SILANO DE FORMULA (I) R{SUB,4.(N+1-SI(OR{SUP,''){SUB,N+1}, DONDE R SIGNIFICA ALQUILO DE 1 A 4 ATOMOS DE C, UN GRUPO FENILO, GLICIDILOXIPROPILO, MERCAPTOPROPILO O AMINOPROPILO, R{SUP,''} SIGNIFICA UN ALQUILO CON 1 A 12 ATOMOS DE C, Y N ES CERO O UN NUMERO DE 1 A 3. ESTAS MASAS FLUIDAS SON MUY APROPIADAS Y DE MODO VENTAJOSO PARA RECUBRIR O TAPAR PIEZAS ELECTRICAS O ELECTRONICAS.
ES95810765T 1994-12-13 1995-12-05 Masas de colada endurecibles, a base de resina epoxi, que contienen un promotor de tenacidad del tipo nucleo/envoltura. Expired - Lifetime ES2151949T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH377594 1994-12-13

Publications (1)

Publication Number Publication Date
ES2151949T3 true ES2151949T3 (es) 2001-01-16

Family

ID=4263223

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95810765T Expired - Lifetime ES2151949T3 (es) 1994-12-13 1995-12-05 Masas de colada endurecibles, a base de resina epoxi, que contienen un promotor de tenacidad del tipo nucleo/envoltura.

Country Status (5)

Country Link
EP (1) EP0717073B1 (es)
JP (1) JPH08231827A (es)
CA (1) CA2164915A1 (es)
DE (1) DE59508782D1 (es)
ES (1) ES2151949T3 (es)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4798848B2 (ja) * 1999-03-16 2011-10-19 ハンツマン アドバンスト マテリアルズ （スイッツァランド） ゲーエムベーハー 特別な性質の組合せを有する硬化性組成物
JP4568940B2 (ja) * 1999-04-13 2010-10-27 日立化成工業株式会社 封止用エポキシ樹脂組成物及び電子部品装置
US6664318B1 (en) 1999-12-20 2003-12-16 3M Innovative Properties Company Encapsulant compositions with thermal shock resistance
PL363757A1 (en) * 2000-11-29 2004-11-29 Vantico Ag Filled epoxy resin system having high mechanical strength values
JP4771445B2 (ja) * 2001-07-11 2011-09-14 日本化薬株式会社 電子部品用絶縁樹脂組成物及び接着シート
US7056978B2 (en) * 2002-11-06 2006-06-06 National Starch And Chemical Investment Holding Corporation Toughened epoxy-anhydride no-flow underfill encapsulant
DE502004007350D1 (de) * 2003-09-29 2008-07-24 Bosch Gmbh Robert Härtbares Reaktionsharzsystem
CA2577681C (en) * 2004-08-18 2013-10-08 Kaneka Corporation Epoxy resin composition for semiconductor sealing agents and epoxy resin molding material
KR100689086B1 (ko) * 2005-12-30 2007-03-02 주식회사 케이씨씨 멤브레인형 액화 천연가스선 저장탱크에 단열 판넬 부착용에폭시 수지 조성물
WO2008105189A1 (ja) 2007-02-28 2008-09-04 Kaneka Corporation ゴム状重合体粒子分散熱硬化性樹脂組成物、及びその製造方法
KR100914821B1 (ko) * 2007-11-28 2009-09-02 주식회사 케이씨씨 반도체 소자의 실장에 사용되는 에폭시 수지 조성물
CN102212330A (zh) * 2010-04-07 2011-10-12 深圳市诚德来实业有限公司 一种中空纤维膜端封用环氧树脂胶及其制备和应用方法
DE102010015398A1 (de) * 2010-04-19 2011-10-20 Siemens Aktiengesellschaft Isolationsverbundmaterial zur elektrischen Isolation, Verfahren zur Herstellung und Verwendung desselben
DE102010019723A1 (de) * 2010-05-07 2011-11-10 Siemens Aktiengesellschaft Elektroisolationssystem für eine elektrische Hochspannungsrotationsmaschine
WO2013139390A1 (en) * 2012-03-21 2013-09-26 Abb Research Ltd. Curable epoxy resin composition
MX2017012200A (es) 2015-03-26 2017-12-15 Huntsman Adv Mat Licensing Switzerland Gmbh Composicion de resina epoxi para la preparacion de articulos para exteriores, y los articulos obtenidos de la misma.
CA2990505C (en) * 2015-07-02 2023-09-26 Huntsman Advanced Materials (Switzerland) Gmbh A thermosetting epoxy resin composition for the preparation of outdoor articles, and the articles obtained therefrom
US20200277473A1 (en) * 2017-09-20 2020-09-03 Arlanxeo Deutschland Gmbh Vulcanizable HNBR composition with high thermal conductivity
CN116635229B (zh) * 2020-12-25 2026-03-10 株式会社钟化 固化性树脂组合物及粘接剂

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4529755A (en) * 1982-10-23 1985-07-16 Denki Kagaku Kogyo Kabushiki Kaisha Epoxy resin composition for encapsulating semiconductor
JPS6377927A (ja) * 1986-09-19 1988-04-08 Fujitsu Ltd 半導体封止用成形材料
DE59006274D1 (de) * 1989-04-07 1994-08-04 Asea Brown Boveri Elektrischer Isolator.
JPH03237152A (ja) * 1990-02-15 1991-10-23 Meidensha Corp アルミナ充填樹脂硬化物
JPH0455463A (ja) * 1990-06-26 1992-02-24 Meidensha Corp エポキシ樹脂組成物の製造法

Also Published As

Publication number Publication date
EP0717073A3 (de) 1996-11-20
JPH08231827A (ja) 1996-09-10
EP0717073A2 (de) 1996-06-19
DE59508782D1 (de) 2000-11-16
EP0717073B1 (de) 2000-10-11
CA2164915A1 (en) 1996-06-14

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