ES2154013T3 - Agentes de curado para resinas epoxidicas. - Google Patents
Agentes de curado para resinas epoxidicas.Info
- Publication number
- ES2154013T3 ES2154013T3 ES97307793T ES97307793T ES2154013T3 ES 2154013 T3 ES2154013 T3 ES 2154013T3 ES 97307793 T ES97307793 T ES 97307793T ES 97307793 T ES97307793 T ES 97307793T ES 2154013 T3 ES2154013 T3 ES 2154013T3
- Authority
- ES
- Spain
- Prior art keywords
- curing agents
- substituted
- epoxidic resins
- resins
- epoxidic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 title 1
- 239000011347 resin Substances 0.000 title 1
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract 3
- 230000002411 adverse Effects 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 229910052757 nitrogen Inorganic materials 0.000 abstract 1
- 125000004433 nitrogen atom Chemical group N* 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
- C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D231/00—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings
- C07D231/02—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings
- C07D231/10—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members
- C07D231/12—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to ring carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
- C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
- C07D233/56—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
- C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
- C07D233/64—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with substituted hydrocarbon radicals attached to ring carbon atoms, e.g. histidine
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D249/00—Heterocyclic compounds containing five-membered rings having three nitrogen atoms as the only ring hetero atoms
- C07D249/02—Heterocyclic compounds containing five-membered rings having three nitrogen atoms as the only ring hetero atoms not condensed with other rings
- C07D249/08—1,2,4-Triazoles; Hydrogenated 1,2,4-triazoles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
- C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Epoxy Resins (AREA)
- Plural Heterocyclic Compounds (AREA)
Abstract
SE PRESENTAN AGENTES DE CURACION PARA RESINAS EPOXIDICAS EN QUE UN IMIDAZOL ES SUSTITUIDO EN EL ATOMO DE NITROGENO POR UN GRUPO DE CADENA LARGA. ESTO PROPORCIONA UNA MAYOR LATICIFICACION (ESTABILIDAD) A TEMPERATURA AMBIENTE SIN QUE ELLO AFECTE DE MANERA ADVERSA A LAS PROPIEDADES DE CURACION A TEMPERATURAS DE 50°C EN ADELANTE. EN PARTICULAR, AQUELLOS COMPONENTES EN QUE LA CADENA ES SUSTITUIDA POR UN GRUPO HIDROXI EN LA POSICION 2 SON LOS PREFERENTES Y SON COMPUESTOS NUEVOS.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP97307793A EP0906927B1 (en) | 1997-10-02 | 1997-10-02 | Epoxy resin curing agents |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2154013T3 true ES2154013T3 (es) | 2001-03-16 |
Family
ID=8229533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES97307793T Expired - Lifetime ES2154013T3 (es) | 1997-10-02 | 1997-10-02 | Agentes de curado para resinas epoxidicas. |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6107437A (es) |
| EP (1) | EP0906927B1 (es) |
| JP (1) | JP3469101B2 (es) |
| AT (1) | ATE198212T1 (es) |
| DE (1) | DE69703739T2 (es) |
| ES (1) | ES2154013T3 (es) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE291052T1 (de) * | 1999-07-28 | 2005-04-15 | Hexcel Corp | Reaktionsharzblattmaterialien |
| GB2409837B (en) | 2004-01-10 | 2006-09-06 | Hexcel Composites Ltd | Fibre reinforced resin assembly |
| GB0412196D0 (en) * | 2004-06-02 | 2004-07-07 | Hexcel Composites Ltd | Cure accelerators |
| AR063177A1 (es) | 2007-05-23 | 2008-12-30 | Mi Llc | Uso de emulsiones epoxicas inversas para la estabilizacion de perforaciones de pozos |
| JP5336485B2 (ja) | 2007-08-02 | 2013-11-06 | ダウ グローバル テクノロジーズ エルエルシー | 熱硬化性ポリマーの性能を向上させるための両親媒性ブロックコポリマーおよび無機ナノフィラー |
| EP2176355A1 (en) | 2007-08-02 | 2010-04-21 | Dow Global Technologies Inc. | Thermoset dampener material |
| JP2011509339A (ja) | 2008-01-08 | 2011-03-24 | ダウ グローバル テクノロジーズ エルエルシー | 複合材料用の高Tgエポキシ系 |
| KR20160007668A (ko) | 2008-04-14 | 2016-01-20 | 블루 큐브 아이피 엘엘씨 | 분말 피복 분야에 유용한 에폭시-이미다졸 촉매 |
| JP5624054B2 (ja) | 2008-12-16 | 2014-11-12 | ダウ グローバル テクノロジーズ エルエルシー | 電気積層板の製造に有用な均質ビスマレイミド−トリアジン−エポキシ組成物 |
| US8262895B2 (en) | 2010-03-15 | 2012-09-11 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| US8268157B2 (en) | 2010-03-15 | 2012-09-18 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| US20110220512A1 (en) * | 2010-03-15 | 2011-09-15 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| US20140150970A1 (en) | 2010-11-19 | 2014-06-05 | Ppg Industries Ohio, Inc. | Structural adhesive compositions |
| EP2562223A1 (de) * | 2011-08-26 | 2013-02-27 | Sika Technology AG | Zweikomponentige Zusammensetzung auf Basis von silanfunktionellen Polymeren |
| US9677370B2 (en) | 2013-06-06 | 2017-06-13 | Halliburton Energy Services, Inc. | Deformable plug and seal well system |
| US10738583B2 (en) | 2016-08-21 | 2020-08-11 | Battelle Memorial Institute | Multi-component solid epoxy proppant binder resins |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL6504681A (es) * | 1965-04-13 | 1965-06-25 | ||
| US4066625A (en) * | 1967-05-02 | 1978-01-03 | Amicon Corporation | Unitary curable resin compositions |
| FR1566468A (es) * | 1968-03-04 | 1969-05-09 | ||
| US3920678A (en) * | 1968-03-15 | 1975-11-18 | Rhein Chemie Rheinau Gmbh | Process for producing 4,5,6,7-tetrahydro benzimidazoles |
| US3923571A (en) * | 1970-12-27 | 1975-12-02 | Nissan Motor | Method of using an epoxy-resin-imidazole solder mixture |
| DE3211301A1 (de) * | 1982-03-26 | 1983-09-29 | Bayer Ag, 5090 Leverkusen | Cyclische amidine, verfahren zu ihrer herstellung und die verwendung cyclischer amidine als katalysatoren fuer die haertung von epoxidharzen |
| JP2533781B2 (ja) * | 1987-10-30 | 1996-09-11 | 油化シエルエポキシ株式会社 | 常温液状の非結晶性イミダゾ―ル誘導体組成物 |
| US5169473A (en) * | 1990-05-21 | 1992-12-08 | The Dow Chemical Company | Latent catalysts, epoxy compositions incorporating same, and coating, impregnating and bonding methods employing the compositions |
| KR930010077A (ko) * | 1991-11-22 | 1993-06-22 | 알베르투스 빌헬무스 요 아네스 째스트 라텐 | 에폭시 이미다졸 첨가물 및 에폭시 수지 조성물 |
| JPH08176521A (ja) * | 1994-12-26 | 1996-07-09 | Showa Denko Kk | 導電性接着剤 |
-
1997
- 1997-10-02 DE DE69703739T patent/DE69703739T2/de not_active Expired - Lifetime
- 1997-10-02 AT AT97307793T patent/ATE198212T1/de active
- 1997-10-02 ES ES97307793T patent/ES2154013T3/es not_active Expired - Lifetime
- 1997-10-02 EP EP97307793A patent/EP0906927B1/en not_active Expired - Lifetime
-
1998
- 1998-09-28 US US09/162,074 patent/US6107437A/en not_active Expired - Lifetime
- 1998-10-01 JP JP28000998A patent/JP3469101B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP3469101B2 (ja) | 2003-11-25 |
| US6107437A (en) | 2000-08-22 |
| JPH11171978A (ja) | 1999-06-29 |
| EP0906927B1 (en) | 2000-12-20 |
| DE69703739D1 (de) | 2001-01-25 |
| DE69703739T2 (de) | 2001-06-13 |
| ATE198212T1 (de) | 2001-01-15 |
| EP0906927A1 (en) | 1999-04-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG2A | Definitive protection |
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