ES2154831T3 - Soporte para datos que incorpora circuitos integrados. - Google Patents

Soporte para datos que incorpora circuitos integrados.

Info

Publication number
ES2154831T3
ES2154831T3 ES96927555T ES96927555T ES2154831T3 ES 2154831 T3 ES2154831 T3 ES 2154831T3 ES 96927555 T ES96927555 T ES 96927555T ES 96927555 T ES96927555 T ES 96927555T ES 2154831 T3 ES2154831 T3 ES 2154831T3
Authority
ES
Spain
Prior art keywords
integrated circuits
support
data
includes integrated
communication
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96927555T
Other languages
English (en)
Inventor
Yahya Haghiri-Tehrani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke+Devrient GmbH
Original Assignee
Giesecke+Devrient GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke+Devrient GmbH filed Critical Giesecke+Devrient GmbH
Application granted granted Critical
Publication of ES2154831T3 publication Critical patent/ES2154831T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Stabilization Of Oscillater, Synchronisation, Frequency Synthesizers (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Near-Field Transmission Systems (AREA)

Abstract

SE PRESENTA UN SOPORTE DE DATOS CON AL MENOS DOS CIRCUITOS INTEGRADOS INCORPORADOS, DISPUESTOS UNO SOBRE OTROS EN UN AREA PARCIAL DEL SOPORTE, EN QUE AL MENOS UNO DE LOS CIRCUITOS INTEGRADOS PUEDE COMUNICARSE CON APARATOS EXTERNOS MEDIANTE ELEMENTOS DE ACOPLAMIENTO. PARA ORGANIZAR CON LA MAXIMA SENCILLEZ POSIBLE LA COMUNICACION ENTRE LOS CIRCUITOS INTEGRADOS INCORPORADOS, ESTOS CUENTAN CON MEDIOS QUE PERMITEN UNA COMUNICACION ENTRE LOS CIRCUITOS INTEGRADOS MEDIANTE UN ACOPLAMIENTO NO GALVANICO, SIN CONTACTOS.
ES96927555T 1995-07-21 1996-07-19 Soporte para datos que incorpora circuitos integrados. Expired - Lifetime ES2154831T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19526672A DE19526672A1 (de) 1995-07-21 1995-07-21 Datenträger mit integriertem Schaltkreis

Publications (1)

Publication Number Publication Date
ES2154831T3 true ES2154831T3 (es) 2001-04-16

Family

ID=7767434

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96927555T Expired - Lifetime ES2154831T3 (es) 1995-07-21 1996-07-19 Soporte para datos que incorpora circuitos integrados.

Country Status (7)

Country Link
EP (1) EP0842494B1 (es)
AT (1) ATE199601T1 (es)
AU (1) AU6734996A (es)
DE (2) DE19526672A1 (es)
ES (1) ES2154831T3 (es)
RU (1) RU2160468C2 (es)
WO (1) WO1997004416A1 (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19922473A1 (de) * 1999-05-19 2000-11-30 Giesecke & Devrient Gmbh Chipträgermodul
FR2797075B1 (fr) * 1999-07-26 2001-10-12 Gemplus Card Int Procede de fabrication de dispositif portable a circuits integres, de type carte a puce de format reduit par rapport au format standard
EP1136941A1 (de) * 2000-03-24 2001-09-26 Infineon Technologies AG Tragbare Datenträgeranordnung
EP1152368B1 (de) 2000-05-05 2010-07-14 Infineon Technologies AG Chipkarte
DE10117994A1 (de) * 2001-04-10 2002-10-24 Orga Kartensysteme Gmbh Trägerfolie für elektronische Bauelemente zur Einlaminierung in Chipkarten
FR2831991B1 (fr) * 2001-11-07 2005-02-18 Gemplus Card Int Encapsulation localisee d'une connexion pour objet portable intelligent souple
US7303137B2 (en) * 2005-02-04 2007-12-04 Chun-Hsin Ho Dual integrated circuit card system
DE102007017133A1 (de) * 2007-04-11 2008-10-16 Giesecke & Devrient Gmbh Verfahren zum Herstellen eines kartenförmigen Datenträgers und kartenförmiger Datenträger

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2439438A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux
FR2511544A1 (fr) * 1981-08-14 1983-02-18 Dassault Electronique Module electronique pour carte de transactions automatiques et carte equipee d'un tel module
US4766516A (en) * 1987-09-24 1988-08-23 Hughes Aircraft Company Method and apparatus for securing integrated circuits from unauthorized copying and use
DE69020077T2 (de) * 1989-09-09 1995-11-09 Mitsubishi Electric Corp Integrierte Schaltungskarte.
JPH06122297A (ja) * 1992-08-31 1994-05-06 Sony Chem Corp Ｉｃカード及びその製造方法
DE4241482A1 (de) * 1992-12-09 1994-06-16 Siemens Ag Verfahren und Einrichtung zur Herstellung von IC-Karten
FR2706701B1 (fr) * 1993-06-14 1997-03-21 Apple Computer Dispositif d'isolation galvanique à optocoupleur, et modem l'incorporant.
FR2727227B1 (fr) * 1994-11-17 1996-12-20 Schlumberger Ind Sa Dispositif de securite actif a memoire electronique

Also Published As

Publication number Publication date
EP0842494A1 (de) 1998-05-20
DE59606555D1 (de) 2001-04-12
AU6734996A (en) 1997-02-18
WO1997004416A1 (de) 1997-02-06
RU2160468C2 (ru) 2000-12-10
ATE199601T1 (de) 2001-03-15
EP0842494B1 (de) 2001-03-07
DE19526672A1 (de) 1997-01-23

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