ES2155944T3 - Procedimiento para depositar un revestimiento de proteccion sobre los componentes de una tarjeta electronica. - Google Patents

Procedimiento para depositar un revestimiento de proteccion sobre los componentes de una tarjeta electronica.

Info

Publication number
ES2155944T3
ES2155944T3 ES96934933T ES96934933T ES2155944T3 ES 2155944 T3 ES2155944 T3 ES 2155944T3 ES 96934933 T ES96934933 T ES 96934933T ES 96934933 T ES96934933 T ES 96934933T ES 2155944 T3 ES2155944 T3 ES 2155944T3
Authority
ES
Spain
Prior art keywords
components
pct
coating
depositing
procedure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96934933T
Other languages
English (en)
Inventor
Christophe Dessaux
Emmanuel Moreau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giat Industries SA
Original Assignee
Giat Industries SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giat Industries SA filed Critical Giat Industries SA
Application granted granted Critical
Publication of ES2155944T3 publication Critical patent/ES2155944T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/34—Applying different liquids or other fluent materials simultaneously

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Credit Cards Or The Like (AREA)
  • Optical Fibers, Optical Fiber Cores, And Optical Fiber Bundles (AREA)
  • Container Filling Or Packaging Operations (AREA)

Abstract

PROCEDIMIENTO PARA DEPOSITAR UN REVESTIMIENTO DE PROTECCION SOBRE LOS COMPONENTES DE UNA TARJETA ELECTRONICA, ESTANDO EL REVESTIMIENTO CONSTITUIDO POR UN MATERIAL POLIMERIZABLE TAL COMO UNA RESINA, CARACTERIZADO PORQUE CONSISTE EN PREPARAR EL MATERIAL QUE CONSTITUYE EL REVESTIMIENTO A PARTIR DE UNA MEZCLA INICIAL DE AL MENOS DOS CONSTITUYENTES (A, B), Y EN AÑADIR A ESTA MEZCLA INICIAL AL MENOS UN TERCER CONSTITUYENTE (C) EN CANTIDAD VARIABLE CON EL FIN DE HACER VARIAR LA VISCOSIDAD DE LA MEZCLA INICIAL SEGUN EL TIPO DE COMPONENTE A PROTEGER DURANTE LA OPERACION DE REVESTIMIENTO DE LOS COMPONENTES (P1, P2, P3) DE LA TARJETA ELECTRONICA (CE).
ES96934933T 1995-10-25 1996-10-18 Procedimiento para depositar un revestimiento de proteccion sobre los componentes de una tarjeta electronica. Expired - Lifetime ES2155944T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9512595A FR2740608B1 (fr) 1995-10-25 1995-10-25 Procede pour deposer un revetement de protection sur les composants d'une carte electronique

Publications (1)

Publication Number Publication Date
ES2155944T3 true ES2155944T3 (es) 2001-06-01

Family

ID=9483908

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96934933T Expired - Lifetime ES2155944T3 (es) 1995-10-25 1996-10-18 Procedimiento para depositar un revestimiento de proteccion sobre los componentes de una tarjeta electronica.

Country Status (9)

Country Link
US (1) US5897913A (es)
EP (1) EP0799558B1 (es)
AT (1) ATE199807T1 (es)
CA (1) CA2203034C (es)
DE (1) DE69612082T2 (es)
DK (1) DK0799558T3 (es)
ES (1) ES2155944T3 (es)
FR (1) FR2740608B1 (es)
WO (1) WO1997016055A1 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6413883B1 (en) 1996-03-04 2002-07-02 Symetrix Corporation Method of liquid deposition by selection of liquid viscosity and other precursor properties
EP1463071A3 (en) * 2003-03-28 2007-05-16 Wataru Sugimoto Ruthenic acid nanosheet and production method thereof
DE102007029913A1 (de) 2007-06-28 2009-01-02 Robert Bosch Gmbh Elektrisches Steuergerät
US20100171889A1 (en) * 2009-01-06 2010-07-08 Joseph Pantel Weather-resistant display
JP5773412B2 (ja) * 2011-03-31 2015-09-02 Ｎｅｃエナジーデバイス株式会社 電池パックおよび電動自転車
DE102011082971A1 (de) * 2011-09-19 2013-03-21 Siemens Aktiengesellschaft Herstellen einer mit einer Leiterplatten-Schutzbeschichtung versehenen Leiterplatte
DE102017124665A1 (de) * 2017-10-23 2019-04-25 Endress+Hauser Flowtec Ag Verfahren zum Herstellen einer mit mindestens einer Lackierung versehenen Leiterplatte und Lackierkopf zur Durchführung des Verfahrens

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3440086A (en) * 1964-12-23 1969-04-22 Firestone Tire & Rubber Co Polyurethane precursor-viscosity builder and curing agent coating composition and method of coating therewith
US4317158A (en) * 1980-03-03 1982-02-23 Sprague Electric Company AC Capacitor
US4533598A (en) * 1983-11-18 1985-08-06 Caschem, Inc. Extended polyurethanes
JPH0752762B2 (ja) * 1985-01-07 1995-06-05 株式会社日立製作所 半導体樹脂パッケージ
CA1312040C (en) * 1985-12-19 1992-12-29 Joseph Victor Koleske Conformal coatings cured with actinic radiation
JPH01138220A (ja) * 1987-11-26 1989-05-31 Sumitomo Bakelite Co Ltd 液状ポリウレタン樹脂組成物
JP3189297B2 (ja) * 1991-06-13 2001-07-16 松下電器産業株式会社 プリント配線板の製造装置とそれを用いたプリント配線板の製造方法
US5330101A (en) * 1992-02-06 1994-07-19 Nordson Corporation Material changeover and anti-skin over system
FR2713396B1 (fr) * 1993-11-30 1996-02-09 Giat Ind Sa Procédé d'encapsulation de composants ou de modules électroniques et composants ou modules électroniques encapsulés par ledit procédé.

Also Published As

Publication number Publication date
EP0799558B1 (fr) 2001-03-14
EP0799558A1 (fr) 1997-10-08
FR2740608A1 (fr) 1997-04-30
CA2203034A1 (fr) 1998-04-18
US5897913A (en) 1999-04-27
DE69612082D1 (de) 2001-04-19
ATE199807T1 (de) 2001-03-15
CA2203034C (fr) 2002-01-01
WO1997016055A1 (fr) 1997-05-01
FR2740608B1 (fr) 1997-12-19
DE69612082T2 (de) 2001-07-19
DK0799558T3 (da) 2001-07-02

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