ES2156196T3 - Portador de oblea para maquina pulidora de obleas semiconductoras. - Google Patents

Portador de oblea para maquina pulidora de obleas semiconductoras.

Info

Publication number
ES2156196T3
ES2156196T3 ES95307173T ES95307173T ES2156196T3 ES 2156196 T3 ES2156196 T3 ES 2156196T3 ES 95307173 T ES95307173 T ES 95307173T ES 95307173 T ES95307173 T ES 95307173T ES 2156196 T3 ES2156196 T3 ES 2156196T3
Authority
ES
Spain
Prior art keywords
semi
wafer
polishing machine
obleas
driving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95307173T
Other languages
English (en)
Inventor
Hooman Bolandi
David Edwin Weldon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Application granted granted Critical
Publication of ES2156196T3 publication Critical patent/ES2156196T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

UNA MAQUINA PULIDORA DE PLAQUITAS DE SEMICONDUCTORES (10) QUE TIENE AL MENOS UN CONJUNTO DE ALMOHADILLAS PULIDORAS (12) Y AL MENOS UN PORTAPLAQUITAS (18) COLOCADO PARA SOPORTAR UNA PLAQUITA DE SEMICONDUCTOR CONTRA EL CONJUNTO DE ALMOHADILLAS PULIDORAS (12) QUE INCLUYE UNA JUNTA (20) QUE TIENE DOS EJES DE ROTACION QUE SE INTERSECTAN EN UN CENTRO DE ROTACION. HAY UN MANDRIL PARA LAS PLAQUITAS (32) SOPORTADO SOBRE LA JUNTA (20) ADYACENTE A LA PERIFERIA DEL MANDRIL (32) PARA CONSEGUIR MAYORES VELOCIDADES DE RETIRADA DEL MATERIAL EN EL CENTRO DE LA PLAQUITA QUE EN LA PERIFERIA DE LA PLAQUITA DURANTE EL PULIDO.
ES95307173T 1994-10-11 1995-10-11 Portador de oblea para maquina pulidora de obleas semiconductoras. Expired - Lifetime ES2156196T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/321,086 US5571044A (en) 1994-10-11 1994-10-11 Wafer holder for semiconductor wafer polishing machine

Publications (1)

Publication Number Publication Date
ES2156196T3 true ES2156196T3 (es) 2001-06-16

Family

ID=23249125

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95307173T Expired - Lifetime ES2156196T3 (es) 1994-10-11 1995-10-11 Portador de oblea para maquina pulidora de obleas semiconductoras.

Country Status (6)

Country Link
US (1) US5571044A (es)
EP (1) EP0706854B1 (es)
JP (1) JPH08203850A (es)
AT (1) ATE200999T1 (es)
DE (1) DE69520863T2 (es)
ES (1) ES2156196T3 (es)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6244946B1 (en) 1997-04-08 2001-06-12 Lam Research Corporation Polishing head with removable subcarrier
US6425812B1 (en) 1997-04-08 2002-07-30 Lam Research Corporation Polishing head for chemical mechanical polishing using linear planarization technology
US6110025A (en) * 1997-05-07 2000-08-29 Obsidian, Inc. Containment ring for substrate carrier apparatus
US6116990A (en) * 1997-07-25 2000-09-12 Applied Materials, Inc. Adjustable low profile gimbal system for chemical mechanical polishing
US6080040A (en) * 1997-11-05 2000-06-27 Aplex Group Wafer carrier head with inflatable bladder and attack angle control for polishing
US5989104A (en) * 1998-01-12 1999-11-23 Speedfam-Ipec Corporation Workpiece carrier with monopiece pressure plate and low gimbal point
US5985094A (en) * 1998-05-12 1999-11-16 Speedfam-Ipec Corporation Semiconductor wafer carrier
US6106379A (en) * 1998-05-12 2000-08-22 Speedfam-Ipec Corporation Semiconductor wafer carrier with automatic ring extension
US6186907B1 (en) * 1998-06-10 2001-02-13 Jay Woodward Selectively positionable golf tee
US6273100B1 (en) 1998-08-27 2001-08-14 Micron Technology, Inc. Surface cleaning apparatus and method
US6136710A (en) * 1998-10-19 2000-10-24 Chartered Semiconductor Manufacturing, Ltd. Chemical mechanical polishing apparatus with improved substrate carrier head and method of use
WO2001056742A1 (en) * 2000-01-31 2001-08-09 Shin-Etsu Handotai Co., Ltd. Polishing device and method
US6375549B1 (en) 2000-03-17 2002-04-23 Motorola, Inc. Polishing head for wafer, and method for polishing
US6666756B1 (en) 2000-03-31 2003-12-23 Lam Research Corporation Wafer carrier head assembly
US6540592B1 (en) 2000-06-29 2003-04-01 Speedfam-Ipec Corporation Carrier head with reduced moment wear ring
US6447380B1 (en) 2000-06-30 2002-09-10 Lam Research Corporation Polishing apparatus and substrate retainer ring providing continuous slurry distribution
US6808443B2 (en) * 2000-07-01 2004-10-26 Lam Research Corporation Projected gimbal point drive
US6419567B1 (en) 2000-08-14 2002-07-16 Semiconductor 300 Gmbh & Co. Kg Retaining ring for chemical-mechanical polishing (CMP) head, polishing apparatus, slurry cycle system, and method
US6755723B1 (en) 2000-09-29 2004-06-29 Lam Research Corporation Polishing head assembly
US6910949B1 (en) 2001-04-25 2005-06-28 Lam Research Corporation Spherical cap-shaped polishing head in a chemical mechanical polishing apparatus for semiconductor wafers
US7223307B2 (en) * 2004-01-21 2007-05-29 3M Innovative Properties Company Disc coater
US6935938B1 (en) 2004-03-31 2005-08-30 Lam Research Corporation Multiple-conditioning member device for chemical mechanical planarization conditioning

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2383131A (en) * 1942-12-01 1945-08-21 C P Goerz American Optical Com Apparatus for polishing optical flats
US2573668A (en) * 1949-02-23 1951-10-30 Shuron Optacal Company Inc Lens chuck
DE1907060A1 (de) * 1969-02-12 1970-09-03 Metabowerke Kg Bandschleifmaschine
US4627169A (en) * 1986-01-27 1986-12-09 Westinghouse Electric Corp. Remote center compliance device
US4811522A (en) * 1987-03-23 1989-03-14 Gill Jr Gerald L Counterbalanced polishing apparatus
JPH079896B2 (ja) * 1988-10-06 1995-02-01 信越半導体株式会社 研磨装置
EP0517594B1 (fr) * 1991-06-06 1995-12-13 Commissariat A L'energie Atomique Machine de polissage à bande microabrasive tendue et à tête support de plaquette perfectionnée
FR2677276B1 (fr) * 1991-06-06 1995-12-01 Commissariat Energie Atomique Machine de polissage a table porte-echantillon perfectionnee.
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US5193316A (en) * 1991-10-29 1993-03-16 Texas Instruments Incorporated Semiconductor wafer polishing using a hydrostatic medium
US5205082A (en) * 1991-12-20 1993-04-27 Cybeq Systems, Inc. Wafer polisher head having floating retainer ring
US5287663A (en) * 1992-01-21 1994-02-22 National Semiconductor Corporation Polishing pad and method for polishing semiconductor wafers
US5329732A (en) * 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus
US5476414A (en) * 1992-09-24 1995-12-19 Ebara Corporation Polishing apparatus
US5329734A (en) * 1993-04-30 1994-07-19 Motorola, Inc. Polishing pads used to chemical-mechanical polish a semiconductor substrate

Also Published As

Publication number Publication date
ATE200999T1 (de) 2001-05-15
JPH08203850A (ja) 1996-08-09
DE69520863D1 (de) 2001-06-13
EP0706854A1 (en) 1996-04-17
EP0706854B1 (en) 2001-05-09
US5571044A (en) 1996-11-05
DE69520863T2 (de) 2001-09-13

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