ES2171088T3 - Procedimiento para producir un sustrato exento de plomo. - Google Patents

Procedimiento para producir un sustrato exento de plomo.

Info

Publication number
ES2171088T3
ES2171088T3 ES99927895T ES99927895T ES2171088T3 ES 2171088 T3 ES2171088 T3 ES 2171088T3 ES 99927895 T ES99927895 T ES 99927895T ES 99927895 T ES99927895 T ES 99927895T ES 2171088 T3 ES2171088 T3 ES 2171088T3
Authority
ES
Spain
Prior art keywords
alloy
layer
individual layers
silver
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES99927895T
Other languages
English (en)
Inventor
Heinz Forderer
Thomas Frey
Gunter Herklotz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WC Heraus GmbH and Co KG
Original Assignee
WC Heraus GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19850526A external-priority patent/DE19850526C2/de
Application filed by WC Heraus GmbH and Co KG filed Critical WC Heraus GmbH and Co KG
Application granted granted Critical
Publication of ES2171088T3 publication Critical patent/ES2171088T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Laminated Bodies (AREA)
  • Contacts (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Procedimiento para producir un sustrato exento de plomo con un cuerpo base de cobre o de una aleación de cobre, una capa de soldadura, aplicada sobre al menos una parte del cuerpo base, a base de metales del grupo del oro, aleación de oro, plata, aleación de plata, paladio y aleación de paladio y con una única capa intermedia de níquel o aleación de níquel, dispuesta entre el cuerpo base y esta capa de soldadura, estando formada la capa de soldadura por al menos dos capas individuales de distinto metal y siendo electrodepositadas la capa intermedia y las capas individuales, caracterizado porque una de las dos capas individuales superiores está formada por plata o aleación de plata y porque la otra de las dos capas individuales superiores está formada por oro o aleación de oro, estando formada la capa individual superior con un espesor de capa en el intervalo de 0,3 m a2,5m.
ES99927895T 1998-06-10 1999-06-07 Procedimiento para producir un sustrato exento de plomo. Expired - Lifetime ES2171088T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19825805 1998-06-10
DE19850526A DE19850526C2 (de) 1998-11-03 1998-11-03 Substrat mit metallischer Beschichtung und seine Verwendung

Publications (1)

Publication Number Publication Date
ES2171088T3 true ES2171088T3 (es) 2002-08-16

Family

ID=26046713

Family Applications (1)

Application Number Title Priority Date Filing Date
ES99927895T Expired - Lifetime ES2171088T3 (es) 1998-06-10 1999-06-07 Procedimiento para producir un sustrato exento de plomo.

Country Status (9)

Country Link
US (1) US6352634B1 (es)
EP (1) EP1047523B1 (es)
JP (1) JP3730120B2 (es)
CA (1) CA2293628A1 (es)
DE (1) DE59900741D1 (es)
ES (1) ES2171088T3 (es)
MY (1) MY118571A (es)
PT (1) PT1047523E (es)
WO (1) WO1999064198A1 (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG107600A1 (en) * 2002-06-27 2004-12-29 Agency Science Tech & Res Multilayer substrate metallization for ic interconnection
WO2004064154A1 (en) * 2003-01-16 2004-07-29 Matsushita Electric Industrial Co., Ltd. Lead frame for a semiconductor device
JP2005314749A (ja) * 2004-04-28 2005-11-10 Shinei Hitec:Kk 電子部品及びその表面処理方法
JP4820616B2 (ja) 2005-10-20 2011-11-24 パナソニック株式会社 リードフレーム
DE102006023998B4 (de) 2006-05-22 2009-02-19 Infineon Technologies Ag Elektronische Schaltungsanordnung und Verfahren zur Herstellung einer solchen
DE102007048299A1 (de) * 2007-10-08 2009-04-09 Behr Gmbh & Co. Kg Mehrschichtlot
CN104364660B (zh) * 2012-06-06 2018-09-21 恩普乐股份有限公司 电触头和电气部件用插座
US8822036B1 (en) * 2013-03-06 2014-09-02 Ut-Battelle, Llc Sintered silver joints via controlled topography of electronic packaging subcomponents
JP2014182976A (ja) * 2013-03-21 2014-09-29 Enplas Corp 電気接触子及び電気部品用ソケット
CN112659677B (zh) * 2020-12-24 2022-09-16 林雅烈 用于制造饰品的金属材料、其制备方法及首饰制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4529667A (en) * 1983-04-06 1985-07-16 The Furukawa Electric Company, Ltd. Silver-coated electric composite materials
JPH0714962A (ja) * 1993-04-28 1995-01-17 Mitsubishi Shindoh Co Ltd リードフレーム材およびリードフレーム
US5360991A (en) * 1993-07-29 1994-11-01 At&T Bell Laboratories Integrated circuit devices with solderable lead frame
US5436082A (en) 1993-12-27 1995-07-25 National Semiconductor Corporation Protective coating combination for lead frames
KR100275381B1 (ko) * 1998-04-18 2000-12-15 이중구 반도체 패키지용 리드프레임 및 리드프레임도금방법

Also Published As

Publication number Publication date
MY118571A (en) 2004-12-31
WO1999064198A1 (de) 1999-12-16
EP1047523A1 (de) 2000-11-02
JP2002517327A (ja) 2002-06-18
US6352634B1 (en) 2002-03-05
DE59900741D1 (de) 2002-02-28
EP1047523B1 (de) 2002-01-09
JP3730120B2 (ja) 2005-12-21
PT1047523E (pt) 2002-06-28
CA2293628A1 (en) 1999-12-16

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