ES2179619T3 - Transistor con efecto de campo. - Google Patents
Transistor con efecto de campo.Info
- Publication number
- ES2179619T3 ES2179619T3 ES99905363T ES99905363T ES2179619T3 ES 2179619 T3 ES2179619 T3 ES 2179619T3 ES 99905363 T ES99905363 T ES 99905363T ES 99905363 T ES99905363 T ES 99905363T ES 2179619 T3 ES2179619 T3 ES 2179619T3
- Authority
- ES
- Spain
- Prior art keywords
- electrode
- transistor
- insulator
- layer
- forms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000005669 field effect Effects 0.000 title abstract 3
- 239000012212 insulator Substances 0.000 abstract 5
- 239000004020 conductor Substances 0.000 abstract 3
- 239000004065 semiconductor Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
- 239000011810 insulating material Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 1
- 239000012811 non-conductive material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0321—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/051—Manufacture or treatment of FETs having PN junction gates
- H10D30/0516—Manufacture or treatment of FETs having PN junction gates of FETs having PN heterojunction gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/061—Manufacture or treatment of FETs having Schottky gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/63—Vertical IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6728—Vertical TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/80—FETs having rectifying junction gate electrodes
- H10D30/83—FETs having PN junction gate electrodes
- H10D30/831—Vertical FETs having PN junction gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
Landscapes
- Thin Film Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Bipolar Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Junction Field-Effect Transistors (AREA)
- Electronic Switches (AREA)
Abstract
Transistor con efecto de campo, particularmente un transistor con efecto de campo de unión (JEFT) con geometría sustancialmente vertical, en el que el transistor comprende un substrato planar (1) de material no conductor, una capa (2) de material conductor que comprende un primer electrodo incluido en el substrato (1), una capa (3a) de material aislante que forma un primer aislante que se encuentra sobre el primer electrodo (2), una capa de material conductor (4) que forma un segundo electrodo que se encuentra sobre el primer aislante (3a), otra capa (3b) de material aislante que forma un segundo aislante que se encuentra sobre el segundo electrodo (4), una capa (5) de material conductor que forma un tercer electrodo sobre el segundo aislante (3b), comprendiendo los citados primero (2) y tercer electrodos (5) respectivamente el electrodo de vaciado y el de origen del transistor o viceversa, y el citado segundo electrodo (4) el electrodo de compuerta del transistor, por lo menos los citadossegundo electrodo (4) y el citado tercer electrodo (5), y los citados primero (3a) y segundo aislante (3b) con sus respectivas capas en configuración apilada formando un escalón (6) orientado en vertical respecto al citado primer electrodo (2) y/o el mencionado substrato (1), y un material semiconductor (8) que realiza el semiconductor activo del transistor que se proporciona sobre la parte expuesta del mencionado primer electrodo (2), el mencionado segundo electrodo (4) y el mencionado tercer electrodo (5), contactando el citado semiconductor activo (8) con el electrodo de compuerta (4) directamente y formando un canal de transistor de orientación sustancialmente vertical (9) entre los citados electrodos primero (2) y tercero (5).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NO980224A NO306528B1 (no) | 1998-01-16 | 1998-01-16 | Felteffekttransistor |
| NO985472A NO306529B1 (no) | 1998-01-16 | 1998-11-23 | Transistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2179619T3 true ES2179619T3 (es) | 2003-01-16 |
Family
ID=26648813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES99905363T Expired - Lifetime ES2179619T3 (es) | 1998-01-16 | 1999-01-14 | Transistor con efecto de campo. |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US6429457B1 (es) |
| EP (1) | EP1051754B1 (es) |
| JP (1) | JP3495703B2 (es) |
| KR (1) | KR100368818B1 (es) |
| CN (1) | CN1210808C (es) |
| AT (1) | ATE222027T1 (es) |
| AU (1) | AU732134C (es) |
| CA (1) | CA2317759C (es) |
| DE (1) | DE69902441T2 (es) |
| DK (1) | DK1051754T3 (es) |
| ES (1) | ES2179619T3 (es) |
| NO (1) | NO306529B1 (es) |
| RU (1) | RU2189665C2 (es) |
| WO (1) | WO1999040631A1 (es) |
Families Citing this family (69)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6859548B2 (en) | 1996-09-25 | 2005-02-22 | Kabushiki Kaisha Toshiba | Ultrasonic picture processing method and ultrasonic picture processing apparatus |
| US6839158B2 (en) | 1997-08-28 | 2005-01-04 | E Ink Corporation | Encapsulated electrophoretic displays having a monolayer of capsules and materials and methods for making the same |
| US6842657B1 (en) | 1999-04-09 | 2005-01-11 | E Ink Corporation | Reactive formation of dielectric layers and protection of organic layers in organic semiconductor device fabrication |
| US7030412B1 (en) | 1999-05-05 | 2006-04-18 | E Ink Corporation | Minimally-patterned semiconductor devices for display applications |
| NO315728B1 (no) | 2000-03-22 | 2003-10-13 | Thin Film Electronics Asa | Multidimensjonal adresseringsarkitektur for elektroniske innretninger |
| JP2004507096A (ja) * | 2000-08-18 | 2004-03-04 | シーメンス アクチエンゲゼルシヤフト | 有機電界効果トランジスタ(ofet),該有機電界効果トランジスタの製造方法、前記有機電界効果トランジスタから形成される集積回路、及び該集積回路の使用 |
| DE10043204A1 (de) | 2000-09-01 | 2002-04-04 | Siemens Ag | Organischer Feld-Effekt-Transistor, Verfahren zur Strukturierung eines OFETs und integrierte Schaltung |
| DE10045192A1 (de) | 2000-09-13 | 2002-04-04 | Siemens Ag | Organischer Datenspeicher, RFID-Tag mit organischem Datenspeicher, Verwendung eines organischen Datenspeichers |
| DE10061297C2 (de) | 2000-12-08 | 2003-05-28 | Siemens Ag | Verfahren zur Sturkturierung eines OFETs |
| DE10061299A1 (de) | 2000-12-08 | 2002-06-27 | Siemens Ag | Vorrichtung zur Feststellung und/oder Weiterleitung zumindest eines Umwelteinflusses, Herstellungsverfahren und Verwendung dazu |
| DE10105914C1 (de) | 2001-02-09 | 2002-10-10 | Siemens Ag | Organischer Feldeffekt-Transistor mit fotostrukturiertem Gate-Dielektrikum und ein Verfahren zu dessen Erzeugung |
| US6844608B2 (en) * | 2001-05-07 | 2005-01-18 | Advanced Micro Devices, Inc. | Reversible field-programmable electric interconnects |
| WO2002091385A1 (en) * | 2001-05-07 | 2002-11-14 | Advanced Micro Devices, Inc. | Molecular memory cell |
| US6627944B2 (en) | 2001-05-07 | 2003-09-30 | Advanced Micro Devices, Inc. | Floating gate memory device using composite molecular material |
| EP1388179A1 (en) * | 2001-05-07 | 2004-02-11 | Advanced Micro Devices, Inc. | Switching element having memory effect |
| US6781868B2 (en) * | 2001-05-07 | 2004-08-24 | Advanced Micro Devices, Inc. | Molecular memory device |
| KR100900080B1 (ko) * | 2001-05-07 | 2009-06-01 | 어드밴스드 마이크로 디바이시즈, 인코포레이티드 | 자기 조립형 폴리머 막을 구비한 메모리 디바이스 및 그제조 방법 |
| JP4841751B2 (ja) * | 2001-06-01 | 2011-12-21 | 株式会社半導体エネルギー研究所 | 有機半導体装置及びその作製方法 |
| US6756620B2 (en) * | 2001-06-29 | 2004-06-29 | Intel Corporation | Low-voltage and interface damage-free polymer memory device |
| US6624457B2 (en) | 2001-07-20 | 2003-09-23 | Intel Corporation | Stepped structure for a multi-rank, stacked polymer memory device and method of making same |
| US6967640B2 (en) | 2001-07-27 | 2005-11-22 | E Ink Corporation | Microencapsulated electrophoretic display with integrated driver |
| US6806526B2 (en) | 2001-08-13 | 2004-10-19 | Advanced Micro Devices, Inc. | Memory device |
| US6858481B2 (en) | 2001-08-13 | 2005-02-22 | Advanced Micro Devices, Inc. | Memory device with active and passive layers |
| EP1434232B1 (en) | 2001-08-13 | 2007-09-19 | Advanced Micro Devices, Inc. | Memory cell |
| US6838720B2 (en) * | 2001-08-13 | 2005-01-04 | Advanced Micro Devices, Inc. | Memory device with active passive layers |
| US6768157B2 (en) | 2001-08-13 | 2004-07-27 | Advanced Micro Devices, Inc. | Memory device |
| DE10151036A1 (de) | 2001-10-16 | 2003-05-08 | Siemens Ag | Isolator für ein organisches Elektronikbauteil |
| DE10151440C1 (de) | 2001-10-18 | 2003-02-06 | Siemens Ag | Organisches Elektronikbauteil, Verfahren zu seiner Herstellung und seine Verwendung |
| DE10160732A1 (de) | 2001-12-11 | 2003-06-26 | Siemens Ag | Organischer Feld-Effekt-Transistor mit verschobener Schwellwertspannung und Verwendung dazu |
| JP4247377B2 (ja) * | 2001-12-28 | 2009-04-02 | 独立行政法人産業技術総合研究所 | 薄膜トランジスタ及びその製造方法 |
| KR100433407B1 (ko) * | 2002-02-06 | 2004-05-31 | 삼성광주전자 주식회사 | 업라이트형 진공청소기 |
| US6900851B2 (en) | 2002-02-08 | 2005-05-31 | E Ink Corporation | Electro-optic displays and optical systems for addressing such displays |
| US6885146B2 (en) | 2002-03-14 | 2005-04-26 | Semiconductor Energy Laboratory Co., Ltd. | Display device comprising substrates, contrast medium and barrier layers between contrast medium and each of substrates |
| DE10212640B4 (de) | 2002-03-21 | 2004-02-05 | Siemens Ag | Logische Bauteile aus organischen Feldeffekttransistoren |
| EP1367659B1 (en) * | 2002-05-21 | 2012-09-05 | Semiconductor Energy Laboratory Co., Ltd. | Organic field effect transistor |
| KR100417461B1 (ko) * | 2002-07-12 | 2004-02-05 | 주식회사 하이닉스반도체 | 반도체 소자의 제조 방법 |
| US6821811B2 (en) | 2002-08-02 | 2004-11-23 | Semiconductor Energy Laboratory Co., Ltd. | Organic thin film transistor and method of manufacturing the same, and semiconductor device having the organic thin film transistor |
| JP2005537637A (ja) | 2002-08-23 | 2005-12-08 | ジーメンス アクツィエンゲゼルシャフト | 過電圧保護用の有機構成部品および関連する回路 |
| CN100364108C (zh) * | 2002-08-28 | 2008-01-23 | 中国科学院长春应用化学研究所 | 含有有机半导体的夹心型场效应晶体管及制作方法 |
| US7012276B2 (en) * | 2002-09-17 | 2006-03-14 | Advanced Micro Devices, Inc. | Organic thin film Zener diodes |
| CN1186822C (zh) | 2002-09-23 | 2005-01-26 | 中国科学院长春应用化学研究所 | 有机薄膜晶体管及制备方法 |
| DE10253154A1 (de) | 2002-11-14 | 2004-05-27 | Siemens Ag | Messgerät zur Bestimmung eines Analyten in einer Flüssigkeitsprobe |
| EP1563553B1 (de) | 2002-11-19 | 2007-02-14 | PolyIC GmbH & Co. KG | Organische elektronische schaltung mit stukturierter halbleitender funktionsschicht und herstellungsverfahren dazu |
| DE10302149A1 (de) | 2003-01-21 | 2005-08-25 | Siemens Ag | Verwendung leitfähiger Carbon-black/Graphit-Mischungen für die Herstellung von low-cost Elektronik |
| US7132680B2 (en) * | 2003-06-09 | 2006-11-07 | International Business Machines Corporation | Organic field-effect transistor and method of making same based on polymerizable self-assembled monolayers |
| EP1498957A1 (de) * | 2003-07-14 | 2005-01-19 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Feldeffekttransistor und Verfahren zum Herstellen eines Feldeffekttransistors |
| DE10339036A1 (de) | 2003-08-25 | 2005-03-31 | Siemens Ag | Organisches elektronisches Bauteil mit hochaufgelöster Strukturierung und Herstellungsverfahren dazu |
| DE10340644B4 (de) | 2003-09-03 | 2010-10-07 | Polyic Gmbh & Co. Kg | Mechanische Steuerelemente für organische Polymerelektronik |
| US7659138B2 (en) * | 2003-12-26 | 2010-02-09 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing an organic semiconductor element |
| US7554121B2 (en) | 2003-12-26 | 2009-06-30 | Semiconductor Energy Laboratory Co., Ltd. | Organic semiconductor device |
| CA2585190A1 (en) * | 2004-11-10 | 2006-05-18 | Canon Kabushiki Kaisha | Amorphous oxide and field effect transistor |
| KR100911698B1 (ko) * | 2004-11-10 | 2009-08-10 | 캐논 가부시끼가이샤 | 비정질 산화물을 사용한 전계 효과 트랜지스터 |
| RU2004133958A (ru) * | 2004-11-23 | 2006-05-10 | Брон Цой (RU) | Пучковый микроэлектронный элемент |
| DE102005009820A1 (de) | 2005-03-01 | 2006-09-07 | Polyic Gmbh & Co. Kg | Elektronikbaugruppe mit organischen Logik-Schaltelementen |
| JP4667096B2 (ja) * | 2005-03-25 | 2011-04-06 | 株式会社半導体エネルギー研究所 | 有機半導体装置及びその作製方法 |
| RU2371809C1 (ru) * | 2005-09-16 | 2009-10-27 | Кэнон Кабусики Кайся | Полевой транзистор, имеющий канал, содержащий оксидный полупроводниковый материал, включающий в себя индий и цинк |
| CN101661993B (zh) * | 2008-08-28 | 2011-10-26 | 中国科学院微电子研究所 | 应用于有机电路的双金属电极结构及其制备方法 |
| GB0912034D0 (en) | 2009-07-10 | 2009-08-19 | Cambridge Entpr Ltd | Patterning |
| GB0913456D0 (en) | 2009-08-03 | 2009-09-16 | Cambridge Entpr Ltd | Printed electronic device |
| CN102779855B (zh) * | 2012-07-06 | 2015-08-12 | 哈尔滨理工大学 | 双肖特基结氧化锌半导体薄膜晶体管及制作方法 |
| US10032924B2 (en) | 2014-03-31 | 2018-07-24 | The Hong Kong University Of Science And Technology | Metal oxide thin film transistor with channel, source and drain regions respectively capped with covers of different gas permeability |
| CN104465989B (zh) * | 2014-12-26 | 2017-02-22 | 中国科学院微电子研究所 | 三端原子开关器件及其制备方法 |
| US9653493B2 (en) * | 2015-06-12 | 2017-05-16 | Eastman Kodak Company | Bottom-gate and top-gate VTFTs on common structure |
| US10504939B2 (en) | 2017-02-21 | 2019-12-10 | The Hong Kong University Of Science And Technology | Integration of silicon thin-film transistors and metal-oxide thin film transistors |
| CN109037347A (zh) * | 2018-07-28 | 2018-12-18 | 张玉英 | 一种具有三明治结构的钛酸铋薄膜晶体管及制备方法 |
| KR102551995B1 (ko) * | 2018-11-16 | 2023-07-06 | 엘지디스플레이 주식회사 | 수직 구조 트랜지스터 및 전자장치 |
| KR102580260B1 (ko) | 2021-10-12 | 2023-09-19 | 성균관대학교산학협력단 | 수직 성장한 결정립을 가지는 활성층을 포함하는 스페이스-프리 수직 전계 효과 트랜지스터 |
| CN117810269A (zh) * | 2021-11-15 | 2024-04-02 | 武汉华星光电半导体显示技术有限公司 | 薄膜晶体管、电子装置及其制备方法及显示装置 |
| CN119545863B (zh) * | 2023-08-24 | 2025-11-21 | 上海交通大学 | 一种短沟道场效应晶体管、其制备方法及电子器件 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US4587540A (en) * | 1982-04-05 | 1986-05-06 | International Business Machines Corporation | Vertical MESFET with mesa step defining gate length |
| JPS59208783A (ja) * | 1983-05-12 | 1984-11-27 | Seiko Instr & Electronics Ltd | 薄膜トランジスタ |
| US4677451A (en) * | 1985-05-24 | 1987-06-30 | Hughes Aircraft Company | Vertical channel field effect transistor |
| US4735918A (en) * | 1985-05-24 | 1988-04-05 | Hughes Aircraft Company | Vertical channel field effect transistor |
| SU1482479A1 (ru) * | 1986-01-31 | 1996-11-27 | Институт прикладной физики АН СССР | Полевой вертикальный транзистор |
| US4903089A (en) * | 1988-02-02 | 1990-02-20 | Massachusetts Institute Of Technology | Vertical transistor device fabricated with semiconductor regrowth |
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-
1998
- 1998-11-23 NO NO985472A patent/NO306529B1/no not_active Application Discontinuation
-
1999
- 1999-01-14 RU RU2000121548/28A patent/RU2189665C2/ru not_active IP Right Cessation
- 1999-01-14 US US09/380,611 patent/US6429457B1/en not_active Expired - Fee Related
- 1999-01-14 DE DE69902441T patent/DE69902441T2/de not_active Expired - Fee Related
- 1999-01-14 ES ES99905363T patent/ES2179619T3/es not_active Expired - Lifetime
- 1999-01-14 CN CNB998039977A patent/CN1210808C/zh not_active Expired - Fee Related
- 1999-01-14 AU AU25520/99A patent/AU732134C/en not_active Ceased
- 1999-01-14 AT AT99905363T patent/ATE222027T1/de not_active IP Right Cessation
- 1999-01-14 CA CA002317759A patent/CA2317759C/en not_active Expired - Fee Related
- 1999-01-14 KR KR10-2000-7007821A patent/KR100368818B1/ko not_active Expired - Fee Related
- 1999-01-14 WO PCT/NO1999/000013 patent/WO1999040631A1/en not_active Ceased
- 1999-01-14 DK DK99905363T patent/DK1051754T3/da active
- 1999-01-14 EP EP99905363A patent/EP1051754B1/en not_active Expired - Lifetime
- 1999-01-14 JP JP2000530947A patent/JP3495703B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO1999040631A1 (en) | 1999-08-12 |
| JP3495703B2 (ja) | 2004-02-09 |
| CN1210808C (zh) | 2005-07-13 |
| AU732134B2 (en) | 2001-04-12 |
| DE69902441T2 (de) | 2003-04-17 |
| US6429457B1 (en) | 2002-08-06 |
| ATE222027T1 (de) | 2002-08-15 |
| DE69902441D1 (de) | 2002-09-12 |
| JP2002503035A (ja) | 2002-01-29 |
| NO306529B1 (no) | 1999-11-15 |
| DK1051754T3 (da) | 2002-09-02 |
| NO985472L (no) | 1999-07-19 |
| EP1051754B1 (en) | 2002-08-07 |
| RU2189665C2 (ru) | 2002-09-20 |
| KR20010034186A (ko) | 2001-04-25 |
| KR100368818B1 (ko) | 2003-01-24 |
| CA2317759A1 (en) | 1999-08-12 |
| AU2552099A (en) | 1999-08-23 |
| CA2317759C (en) | 2004-06-22 |
| NO985472D0 (no) | 1998-11-23 |
| EP1051754A1 (en) | 2000-11-15 |
| CN1293825A (zh) | 2001-05-02 |
| AU732134C (en) | 2001-11-22 |
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