ES2185161T3 - Procedimiento de fabricacion de tarjeta de chip o dispositivo electronico analogo. - Google Patents

Procedimiento de fabricacion de tarjeta de chip o dispositivo electronico analogo.

Info

Publication number
ES2185161T3
ES2185161T3 ES98917221T ES98917221T ES2185161T3 ES 2185161 T3 ES2185161 T3 ES 2185161T3 ES 98917221 T ES98917221 T ES 98917221T ES 98917221 T ES98917221 T ES 98917221T ES 2185161 T3 ES2185161 T3 ES 2185161T3
Authority
ES
Spain
Prior art keywords
electronic device
chip card
manufacturing procedure
analog electronic
card manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES98917221T
Other languages
English (en)
Inventor
Rene-Paul Blanc
Jean-Christophe Fidalgo
Philippe Patrice
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Application granted granted Critical
Publication of ES2185161T3 publication Critical patent/ES2185161T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

La invención se refiere a un procedimiento para fabricar un dispositivo electrónico, tal como una tarjeta inteligente, que comprende al menos un microcircuito (44) integrado en un soporte de tarjeta (40) y que comprende contactos de salida (46, 48) conectados a elementos de interfaz que constan de un bloque terminal (50, 52) y/o una antena, caracterizado en que las conexiones se producen depositando, por medio de una jeringa, un material conductor con baja viscosidad que permanece dúctil después de haberse aplicado. Ventajosamente, se usa una resina polimérica cargada con partículas conductoras o intrínsecamente conductoras
ES98917221T 1997-03-27 1998-03-25 Procedimiento de fabricacion de tarjeta de chip o dispositivo electronico analogo. Expired - Lifetime ES2185161T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9704093A FR2761497B1 (fr) 1997-03-27 1997-03-27 Procede de fabrication d'une carte a puce ou analogue

Publications (1)

Publication Number Publication Date
ES2185161T3 true ES2185161T3 (es) 2003-04-16

Family

ID=9505497

Family Applications (2)

Application Number Title Priority Date Filing Date
ES98917221T Expired - Lifetime ES2185161T3 (es) 1997-03-27 1998-03-25 Procedimiento de fabricacion de tarjeta de chip o dispositivo electronico analogo.
ES02015180T Expired - Lifetime ES2213726T3 (es) 1997-03-27 1998-03-25 Conexion flexible entre un microcircuito y un interfaz con o sin contacto.

Family Applications After (1)

Application Number Title Priority Date Filing Date
ES02015180T Expired - Lifetime ES2213726T3 (es) 1997-03-27 1998-03-25 Conexion flexible entre un microcircuito y un interfaz con o sin contacto.

Country Status (13)

Country Link
US (2) US6468835B1 (es)
EP (2) EP0970438B1 (es)
JP (1) JP3430339B2 (es)
KR (1) KR100568042B1 (es)
CN (1) CN1183485C (es)
AU (1) AU735162B2 (es)
BR (2) BR9808425A (es)
CA (1) CA2283696C (es)
DE (2) DE69808605T2 (es)
ES (2) ES2185161T3 (es)
FR (1) FR2761497B1 (es)
RU (1) RU2196356C2 (es)
WO (1) WO1998044452A1 (es)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000014679A1 (de) * 1998-09-03 2000-03-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur kontaktierung eines schaltungschips
FR2797076B1 (fr) * 1999-07-30 2003-11-28 Gemplus Card Int Procede de fabrication d4une carte a puce a contact
US6147662A (en) * 1999-09-10 2000-11-14 Moore North America, Inc. Radio frequency identification tags and labels
FR2799306B1 (fr) * 1999-10-04 2003-09-19 Gemplus Card Int Procede d'isolation de puce de circuit integre par depot de matiere sur la face active
FR2800198B1 (fr) * 1999-10-26 2002-03-29 Gemplus Card Int Procede de protection de puces de circuit integre par aspiration sous vide
EP1234275B1 (de) * 1999-12-02 2004-03-31 Infineon Technologies AG Chipkartenmodul mit anisotrop leitfähiger trägerfolie
UA59498C2 (uk) * 1999-12-07 2003-09-15 Інфінеон Текнолоджіс Аг Етикетка для товарів, спосіб її виготовлення та спосіб безконтактної ідентифікації товарів
FR2802684B1 (fr) * 1999-12-15 2003-11-28 Gemplus Card Int Dispositif a puce de circuit integre jetable et procede de fabrication d'un tel procede
FR2817373B1 (fr) * 2000-11-30 2003-02-07 D Vito Antoine Orazio Procede de fabrication d'objets portables de type cartes sans contact
JP4666296B2 (ja) * 2001-01-31 2011-04-06 トッパン・フォームズ株式会社 Ｉｃチップを実装したアンテナの形成方法
EP1415270B1 (en) * 2001-07-31 2016-08-03 Quotainne Enterprises LLC Data carrier comprising an array of contacts
FR2841023B1 (fr) * 2002-06-14 2005-10-21 Store Electronic Systems Techn Antenne pour etiquette electronique
AU2003263432A1 (en) * 2002-09-17 2004-04-08 Axalto Sa Hybrid card
JP4056348B2 (ja) * 2002-10-07 2008-03-05 株式会社ルネサステクノロジ 集積回路チップモジュールおよび携帯電話機
FR2847365B1 (fr) * 2002-11-15 2005-03-11 Gemplus Card Int Connexion/raccordement simultane par un percage d'adhesif d'encartage
WO2004057528A1 (fr) * 2002-12-20 2004-07-08 Nagraid Sa Transpondeur electronique realise par depot d'encre conductrice
FR2853115B1 (fr) * 2003-03-28 2005-05-06 A S K Procede de fabrication d'antenne de carte a puce sur un support thermoplastique et carte a puce obtenue par ledit procede
US6857552B2 (en) * 2003-04-17 2005-02-22 Intercard Limited Method and apparatus for making smart card solder contacts
FR2861201B1 (fr) * 2003-10-17 2006-01-27 Oberthur Card Syst Sa Procede de fabrication d'une carte a double interface, et carte a microcircuit ainsi obtenue.
US7243421B2 (en) * 2003-10-29 2007-07-17 Conductive Inkjet Technology Limited Electrical connection of components
US7768405B2 (en) * 2003-12-12 2010-08-03 Semiconductor Energy Laboratory Co., Ltd Semiconductor device and manufacturing method thereof
US7508305B2 (en) 2003-12-26 2009-03-24 Semiconductor Energy Laboratory Co., Ltd. Packing material, tag, certificate, paper money, and securities
WO2006024980A1 (en) * 2004-08-31 2006-03-09 Koninklijke Philips Electronics N.V. Method of manufacturing an rfid antenna
TWI241003B (en) * 2004-10-28 2005-10-01 Advanced Semiconductor Eng Method and device for cavity-down package
US7225537B2 (en) * 2005-01-27 2007-06-05 Cardxx, Inc. Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces
US8119458B2 (en) 2005-02-01 2012-02-21 Nagraid S.A. Placement method of an electronic module on a substrate
US7785932B2 (en) * 2005-02-01 2010-08-31 Nagraid S.A. Placement method of an electronic module on a substrate and device produced by said method
FR2882174B1 (fr) * 2005-02-11 2007-09-07 Smart Packaging Solutions Sps Procede de fabrication d'un dispositif microelectronique a fonctionnement sans contact notamment pour passeport electronique
JP2008537215A (ja) * 2005-03-23 2008-09-11 カードエックスエックス インコーポレイテッド 高品質外面を有する等方性熱硬化接着材料を使用して集積電子機器を備えた最新スマートカードを製造する方法。
JP4839668B2 (ja) * 2005-04-28 2011-12-21 凸版印刷株式会社 非接触ｉｃタグの製造方法
KR100842320B1 (ko) 2006-11-06 2008-06-30 아시아나아이디티 주식회사 금속 부착형 태그 안테나
WO2011053182A1 (ru) * 2009-11-02 2011-05-05 Leontiev Vladimir Vasilievich Устройство накопления и обработки информации (унои)
EP2463809A1 (fr) * 2010-12-07 2012-06-13 NagraID S.A. Carte électronique à contact électrique comprenant une unité électronique et/ou une antenne
US20130234330A1 (en) * 2012-03-08 2013-09-12 Infineon Technologies Ag Semiconductor Packages and Methods of Formation Thereof
US9122968B2 (en) 2012-04-03 2015-09-01 X-Card Holdings, Llc Information carrying card comprising a cross-linked polymer composition, and method of making the same
US9594999B2 (en) 2012-04-03 2017-03-14 X-Card Holdings, Llc Information carrying card comprising crosslinked polymer composition, and method of making the same
DE102012211546B4 (de) * 2012-07-03 2017-02-16 Morpho Cards Gmbh Chipkarte mit bei Raumtemperatur pastenförmiger oder flüssiger Kontaktierung
CN105190651B (zh) 2013-03-15 2019-06-04 X卡控股有限公司 用于制作信息携带卡的芯层的方法以及结果产品
EP2892012A1 (fr) * 2014-01-06 2015-07-08 Gemalto SA Module électronique, son procédé de fabrication, et dispositif électronique comprenant un tel module
US20150286921A1 (en) * 2014-04-03 2015-10-08 Infineon Technologies Ag Chip card substrate and method of forming a chip card substrate
ITTO20150230A1 (it) 2015-04-24 2016-10-24 St Microelectronics Srl Procedimento per produrre componenti elettronici, componente e prodotto informatico corrispondenti
US9741633B2 (en) 2015-06-02 2017-08-22 Samsung Electronics Co., Ltd. Semiconductor package including barrier members and method of manufacturing the same
US9449912B1 (en) 2015-06-11 2016-09-20 Stmicroelectronics Pte Ltd Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of forming
US11361204B2 (en) 2018-03-07 2022-06-14 X-Card Holdings, Llc Metal card
US10438895B1 (en) * 2018-06-08 2019-10-08 American Semiconductor, Inc. Flexible micro-module
CN112652880B (zh) * 2019-12-12 2024-03-19 友达光电股份有限公司 天线装置及其制造方法
TWI726815B (zh) * 2019-12-12 2021-05-01 友達光電股份有限公司 天線裝置及其製造方法
US12220897B2 (en) 2022-10-20 2025-02-11 X-Card Holdings, Llc Core layer for information carrying card, resulting information carrying card, and methods of making the same
US12528279B2 (en) 2022-10-20 2026-01-20 X-Card Holdings, Llc Core layer for information carrying card, resulting information carrying card, and methods of making the same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2624284B1 (fr) * 1987-12-03 1991-08-16 Sgs Thomson Microelectronics Carte comportant un composant electronique
US5108819A (en) * 1990-02-14 1992-04-28 Eli Lilly And Company Thin film electrical component
RU2076394C1 (ru) * 1991-06-26 1997-03-27 Минский радиотехнический институт Электропроводящая клеевая композиция для монтажа кристаллов интегральных микросхем
DE4325458A1 (de) * 1993-07-29 1995-02-09 Orga Bond Technik Gmbh Trägerelement für einen IC-Baustein
RU2047932C1 (ru) * 1993-10-21 1995-11-10 Тукмачев Владимир Алексеевич Способ изготовления полупроводниковых приборов
FR2716555B1 (fr) * 1994-02-24 1996-05-15 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
FR2730576B1 (fr) * 1995-02-15 1997-04-04 Gemplus Card Int Procede de fabrication de cartes electroniques et cartes obtenues par un tel procede
JP2785846B2 (ja) * 1995-04-10 1998-08-13 ソニー株式会社 プリント基板回路
AT1470U1 (de) * 1995-08-01 1997-05-26 Austria Card Laminierte karte und verfahren zu ihrer herstellung
DE19529640A1 (de) * 1995-08-11 1997-02-13 Giesecke & Devrient Gmbh Spulenelement für einen Datenträger mit integriertem Schaltkreis und nichtberührender Kopplung

Also Published As

Publication number Publication date
EP1260938A1 (fr) 2002-11-27
US6468835B1 (en) 2002-10-22
BRPI9808425A8 (pt) 2018-06-19
CN1183485C (zh) 2005-01-05
DE69808605D1 (de) 2002-11-14
JP3430339B2 (ja) 2003-07-28
HK1028834A1 (en) 2001-03-02
US20030020182A1 (en) 2003-01-30
EP0970438B1 (fr) 2002-10-09
JP2000513125A (ja) 2000-10-03
FR2761497B1 (fr) 1999-06-18
DE69820684T2 (de) 2004-09-30
EP1260938B1 (fr) 2003-12-17
ES2213726T3 (es) 2004-09-01
DE69820684D1 (de) 2004-01-29
FR2761497A1 (fr) 1998-10-02
CN1257598A (zh) 2000-06-21
WO1998044452A1 (fr) 1998-10-08
AU7050498A (en) 1998-10-22
BR9808425A (pt) 2000-05-23
AU735162B2 (en) 2001-07-05
EP0970438A1 (fr) 2000-01-12
KR20010005637A (ko) 2001-01-15
CA2283696C (fr) 2004-01-27
KR100568042B1 (ko) 2006-04-07
CA2283696A1 (fr) 1998-10-08
US6943437B2 (en) 2005-09-13
RU2196356C2 (ru) 2003-01-10
DE69808605T2 (de) 2003-06-26

Similar Documents

Publication Publication Date Title
ES2185161T3 (es) Procedimiento de fabricacion de tarjeta de chip o dispositivo electronico analogo.
ATE118632T1 (de) Elektronisches modul mit einer integrierten schaltung für ein kleines tragbares objekt, z.b. eine karte oder ein schlüssel und herstellungsverfahren für solche module.
US6027028A (en) Connector formed as a sleeve pushed over a standard chip card
BR9711030A (pt) CartÆo de chip processo para produ-Æo de um cartÆo de chip e chip semicondutor para uso em um cartÆo de chip
ATE229204T1 (de) Verfahren zur herstellung von kontaktlosen karten
ATE206835T1 (de) Chipkarte
ATE71770T1 (de) Verfahren zur herstellung elektronischer module, insbesondere fuer informationskarten.
DE59504284D1 (de) Trägerelement für integrierten schaltkreis
ES2177107T3 (es) Tarjeta de chip equipada con una etiqueta de garantia.
DE602006012184D1 (de) Hybrides leitfähiges Beschichtungsverfahren zur elektrischen Brückenverbindung von RFID-Einzelchips mit einer Verbundantenne
TW373196B (en) A micromagnetic device for power processing applications and method of manufacture therefor
ATE281674T1 (de) Chipkarte und verfahren zur herstellung einer chipkarte
EP0821407A3 (en) Semiconductor devices having protruding contacts and method for making the same
TW346673B (en) Method and apparatus for programming anti-fuses using internally generated programming voltage
EP0697732A3 (en) Driving circuit module
TWI267092B (en) Anisotropic conductive sheet
EP1526476A3 (de) Minichipkarte sowie Verfahren zu ihrer Herstellung
AU5631199A (en) Contactless card comprising inhibiting means
EP0721209A3 (en) Method of testing semiconductor devices and conductive adhesive thereby used
EP1115086A3 (en) Non-contact type IC card and process for manufacturing same
ATE376254T1 (de) Integrierte schaltungsanordnung, elektronisches modul für chipkarte, das die anordnung benutzt, und verfahren zu deren herstellung
WO2003012930A3 (en) Electric contact and contact element of silicone for fixing an antenna to a circuit card
WO2001027871A3 (de) Verfahren zur herstellung kontaktloser chipkarten sowie zur herstellung von elektrischen einheiten, bestehend aus chips mit kontaktelementen
EP0917420A3 (de) Elektronischer Apparat, insbesondere Telefonapparat und Verfahren zu seiner Herstellung
JP2002533915A (ja) チップと完全に包囲された接続手段と、を有するデータ保持器