ES218906A1 - Un sistema de electrodos que comprende al menos un miembro semiconductor - Google Patents

Un sistema de electrodos que comprende al menos un miembro semiconductor

Info

Publication number
ES218906A1
ES218906A1 ES0218906A ES218906A ES218906A1 ES 218906 A1 ES218906 A1 ES 218906A1 ES 0218906 A ES0218906 A ES 0218906A ES 218906 A ES218906 A ES 218906A ES 218906 A1 ES218906 A1 ES 218906A1
Authority
ES
Spain
Prior art keywords
semi
semiconductor member
conductor device
conductors
envelope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES0218906A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of ES218906A1 publication Critical patent/ES218906A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Resistance Heating (AREA)
  • Led Device Packages (AREA)

Abstract

Sistema de electrónicos que comprende por lo menos un miembro semiconductor más en particular un diodo a cristal o un transmisor alojado en una válvula impermeable a los gases en cuya pared están sellados conductores eléctricos caracterizado por el hecho de que el espacio en el interior de la envoltura posee por lo menos dos partes de las cuales aquella que rodea al miembro semiconductor tiene una resistencia específica inferior al flujo térmico que la parte que está contigua al sello de los de los conductores.
ES0218906A 1953-12-12 1954-12-09 Un sistema de electrodos que comprende al menos un miembro semiconductor Expired ES218906A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL183554 1953-12-12

Publications (1)

Publication Number Publication Date
ES218906A1 true ES218906A1 (es) 1955-12-16

Family

ID=19750636

Family Applications (1)

Application Number Title Priority Date Filing Date
ES0218906A Expired ES218906A1 (es) 1953-12-12 1954-12-09 Un sistema de electrodos que comprende al menos un miembro semiconductor

Country Status (8)

Country Link
US (1) US2877392A (es)
BE (1) BE534031A (es)
CH (1) CH329187A (es)
DE (1) DE1033783B (es)
ES (1) ES218906A1 (es)
FR (1) FR1115837A (es)
GB (1) GB800574A (es)
NL (1) NL87748C (es)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL236678A (es) * 1958-03-04 1900-01-01
US2937110A (en) * 1958-07-17 1960-05-17 Westinghouse Electric Corp Protective treatment for semiconductor devices
US2985806A (en) * 1958-12-24 1961-05-23 Philco Corp Semiconductor fabrication
DE1184017B (de) * 1961-03-10 1964-12-23 Intermetall Verfahren zum Herstellen von die pn-UEbergaenge in Halbleiteranordnungen schuetzenden UEberzuegen aus Silikonharz
US3181229A (en) * 1962-01-08 1965-05-04 Mallory & Co Inc P R Hermetically sealed semiconductor device and method for producing it
NL295904A (es) * 1962-07-27 1900-01-01
US3284678A (en) * 1962-11-09 1966-11-08 Philco Corp Semiconductor encapsulating and reinforcing materials utilizing boron nitride
DE1244963B (de) * 1963-01-09 1967-07-20 Siemens Ag Mit einer Kunststoffhuelle umgossenes oder umpresstes Halbleiterventil
US3243670A (en) * 1963-09-30 1966-03-29 Int Standard Electric Corp Mountings for semiconductor devices
US4042955A (en) * 1973-06-22 1977-08-16 Nippondenso Co., Ltd. Resin-sealed electrical device
FR2348550A1 (fr) * 1976-04-16 1977-11-10 Saunier Duval Procede d'isolation electrique d'une thermistance
US4214885A (en) * 1978-03-01 1980-07-29 Hideo Nishi Method for producing miniature lamps
JPS59198740A (ja) * 1983-04-25 1984-11-10 Mitsubishi Electric Corp 樹脂封止形半導体複合素子
DE8909244U1 (de) * 1989-07-31 1989-11-02 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE307647C (es) *
US756676A (en) * 1902-11-10 1904-04-05 Internat Wireless Telegraph Company Wave-responsive device.
US1782129A (en) * 1924-12-26 1930-11-18 Andre Henri Georges Unilateral conductor for rectifying alternating current
US2406405A (en) * 1941-05-19 1946-08-27 Sperry Gyroscope Co Inc Coaxial condenser crystal and method of making same
BE454977A (es) * 1943-04-05
US2697805A (en) * 1949-02-05 1954-12-21 Sylvania Electric Prod Point contact rectifier
US2699594A (en) * 1952-02-27 1955-01-18 Sylvania Electric Prod Method of assembling semiconductor units

Also Published As

Publication number Publication date
DE1033783B (de) 1958-07-10
GB800574A (en) 1958-08-27
FR1115837A (fr) 1956-04-30
CH329187A (de) 1958-04-15
US2877392A (en) 1959-03-10
BE534031A (es)
NL87748C (es)

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