ES2190277T3 - Sistema hidrofobo de resina epoxi. - Google Patents

Sistema hidrofobo de resina epoxi.

Info

Publication number
ES2190277T3
ES2190277T3 ES99959356T ES99959356T ES2190277T3 ES 2190277 T3 ES2190277 T3 ES 2190277T3 ES 99959356 T ES99959356 T ES 99959356T ES 99959356 T ES99959356 T ES 99959356T ES 2190277 T3 ES2190277 T3 ES 2190277T3
Authority
ES
Spain
Prior art keywords
weight
hydrophobo
epoxi resin
epoxi
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES99959356T
Other languages
English (en)
Inventor
Christian Beisele
Thomas Kainmuller
Qian Tang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huntsman Advanced Materials Switzerland GmbH
Original Assignee
Vantico GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vantico GmbH filed Critical Vantico GmbH
Application granted granted Critical
Publication of ES2190277T3 publication Critical patent/ES2190277T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/549—Silicon-containing compounds containing silicon in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)

Abstract

Composición que, refiriendo los porcentajes a la composición total de (a), (b), (c) y (d), contiene: (a) del 77, 0 al 97, 99 % en peso de una resina epoxi, (b) del 1, 0 al 10, 0% en peso de un polisiloxano con grupos OH terminales, (c) del 1, 0 al 10, 0 % en peso de un polisiloxano cíclico y (d) del 0, 01 al 3, 0 % en peso de un reactivo fluoralifático no iónico de carácter tensioactivo, teniendo en cuenta que la suma de los componentes (a), (b), (c) y (d) debe ser igual al 100 % en peso.
ES99959356T 1998-12-09 1999-11-29 Sistema hidrofobo de resina epoxi. Expired - Lifetime ES2190277T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH244198 1998-12-09

Publications (1)

Publication Number Publication Date
ES2190277T3 true ES2190277T3 (es) 2003-07-16

Family

ID=4233896

Family Applications (1)

Application Number Title Priority Date Filing Date
ES99959356T Expired - Lifetime ES2190277T3 (es) 1998-12-09 1999-11-29 Sistema hidrofobo de resina epoxi.

Country Status (15)

Country Link
EP (1) EP1141127B1 (es)
JP (1) JP4823419B2 (es)
KR (1) KR100659220B1 (es)
CN (1) CN1121447C (es)
AT (1) ATE232224T1 (es)
AU (1) AU767776B2 (es)
BR (1) BR9916010A (es)
CA (1) CA2351333A1 (es)
CZ (1) CZ20012031A3 (es)
DE (1) DE59904252D1 (es)
ES (1) ES2190277T3 (es)
HK (1) HK1039627B (es)
HU (1) HUP0200220A2 (es)
WO (1) WO2000034388A1 (es)
ZA (1) ZA200104729B (es)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10051051A1 (de) * 2000-10-14 2002-04-18 Bosch Gmbh Robert Silikonmodifizierte Einkomponentenvergußmasse
US6653378B2 (en) * 2000-12-18 2003-11-25 Dow Corning Corporation Silicone elastomer compositions
EP1354916A1 (de) * 2002-04-17 2003-10-22 Abb Research Ltd. Selbstheilende Epoxidharze für die Herstellung von elektrischen Isolierungen
EP1568733A1 (de) * 2004-02-20 2005-08-31 Abb Research Ltd. Füllstoff bestehend aus mit Organopolysiloxan beschichteten porösen anorganischen Füllstoffteilchen zur Verwendung in härtbaren Vergussmassen
DE102004008772A1 (de) 2004-02-23 2005-09-08 Institut für Neue Materialien Gemeinnützige GmbH Abriebbeständige und alkalibeständige Beschichtungen oder Formkörper mit Niedrigenergieoberfläche
JP4572661B2 (ja) * 2004-11-05 2010-11-04 日立化成工業株式会社 樹脂組成物、それを用いたプリプレグ、積層板および印刷配線板
EP1905046B1 (fr) 2005-07-20 2013-04-24 ALSTOM Technology Ltd Isolateur electrique et procede de fabrication.
US7745516B2 (en) * 2005-10-12 2010-06-29 E. I. Du Pont De Nemours And Company Composition of polyimide and sterically-hindered hydrophobic epoxy
JP2008037921A (ja) * 2006-08-02 2008-02-21 Meidensha Corp 絶縁性高分子材料組成物
KR100834351B1 (ko) * 2006-11-24 2008-06-02 제일모직주식회사 멀티칩 패키지　밀봉용 에폭시 수지 조성물　및 이를이용한 멀티칩 패키지
RU2466471C2 (ru) * 2008-02-12 2012-11-10 Абб Рисерч Лтд Поверхностно-модифицированная электроизоляционная система
EP2243142A1 (en) * 2008-02-12 2010-10-27 ABB Research Ltd. Surface modified electrical insulation system
JP4893720B2 (ja) * 2008-09-25 2012-03-07 パナソニック電工株式会社 熱硬化性樹脂組成物及びその製造方法
CN101445396B (zh) * 2008-12-09 2011-08-31 西安交通大学 一种瓷绝缘子表面超疏水性涂层的制备方法
EP2230267B1 (en) * 2009-03-20 2014-08-13 ABB Research Ltd. Method of producing a curable epoxy resin composition
JP5325742B2 (ja) * 2009-10-29 2013-10-23 日本ペイント株式会社 天然油脂を原料とする有機無機複合コーティング組成物
KR101763975B1 (ko) * 2010-05-07 2017-08-01 스미토모 베이클리트 컴퍼니 리미티드 회로 기판용 에폭시 수지 조성물, 프리프레그, 적층판, 수지 시트, 프린트 배선판용 적층기재, 프린트 배선판, 및 반도체 장치
WO2012029690A1 (ja) * 2010-08-31 2012-03-08 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、および積層板
WO2013029831A1 (en) * 2011-08-31 2013-03-07 Huntsman Advanced Materials (Switzerland) Gmbh Use of hydrophobic epoxide resin system for encapsulation of a instrument transformer
KR102579967B1 (ko) * 2015-06-16 2023-09-20 훈츠만 어드밴스트 머티리얼스 라이센싱 (스위처랜드) 게엠베하 에폭시 수지 조성물
CN108752749A (zh) * 2018-06-29 2018-11-06 合肥帧讯低温科技有限公司 一种拉伸强度疏水性相协调的薄膜及其制备方法
CN110722652B (zh) * 2019-10-25 2021-05-28 福建省顺昌县升升木业有限公司 一种杉木疏水改性处理方法
CN112341756B (zh) * 2020-10-12 2022-05-24 北京国电富通科技发展有限责任公司 用于机器人绝缘衣的有机硅改性环氧树脂及其制备方法
DE102020128105A1 (de) 2020-10-26 2022-04-28 Audi Aktiengesellschaft Verfahren zur Herstellung und Behandlung einer gerahmten protonenleitfähigen Membran
CN116333266A (zh) * 2023-04-12 2023-06-27 智仑超纯环氧树脂(西安)有限公司 一种防水防油的柔性环氧树脂制备方法、环氧树脂及应用

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4609692A (en) * 1984-11-28 1986-09-02 E. I. Du Pont De Nemours And Company Low temperature curing maintenance coatings comprising (a) epoxy resin (b) polyamine curing agent (c) polymer containing pendant aminoester groups and (d) organic solvent
JPS63309515A (ja) * 1987-06-12 1988-12-16 Toshiba Corp エポキシ樹脂組成物及び樹脂封止型半導体装置
JP2927817B2 (ja) * 1989-05-19 1999-07-28 日東電工株式会社 半導体装置
JP3321858B2 (ja) * 1992-11-25 2002-09-09 ジェイエスアール株式会社 熱硬化性樹脂組成物
DE19523897C2 (de) * 1995-06-30 2002-10-24 Bosch Gmbh Robert Verwendung von Silicon-modifizierten Epoxidharzen als Vergußmassen für elektrotechnische oder elektronische Bauteile
JP3592825B2 (ja) * 1996-02-07 2004-11-24 東レ・ダウコーニング・シリコーン株式会社 硬化性エポキシ樹脂組成物および電子部品
US5757541A (en) * 1997-01-15 1998-05-26 Litton Systems, Inc. Method and apparatus for an optical fiber amplifier
DE59812650D1 (de) * 1997-08-27 2005-04-21 Huntsman Adv Mat Switzerland Hydrophobes Epoxidharzsystem

Also Published As

Publication number Publication date
CA2351333A1 (en) 2000-06-15
EP1141127A1 (de) 2001-10-10
CN1121447C (zh) 2003-09-17
AU767776B2 (en) 2003-11-27
ATE232224T1 (de) 2003-02-15
CN1329642A (zh) 2002-01-02
JP2002531672A (ja) 2002-09-24
DE59904252D1 (de) 2003-03-13
EP1141127B1 (de) 2003-02-05
HK1039627A1 (en) 2002-05-03
HK1039627B (zh) 2003-07-04
HUP0200220A2 (en) 2002-05-29
ZA200104729B (en) 2002-05-03
KR20010101078A (ko) 2001-11-14
KR100659220B1 (ko) 2006-12-20
BR9916010A (pt) 2001-09-04
JP4823419B2 (ja) 2011-11-24
AU1656000A (en) 2000-06-26
CZ20012031A3 (cs) 2001-11-14
WO2000034388A1 (de) 2000-06-15

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