ES219124A1 - Un procedimiento de niquelar por via quimica - Google Patents

Un procedimiento de niquelar por via quimica

Info

Publication number
ES219124A1
ES219124A1 ES0219124A ES219124A ES219124A1 ES 219124 A1 ES219124 A1 ES 219124A1 ES 0219124 A ES0219124 A ES 0219124A ES 219124 A ES219124 A ES 219124A ES 219124 A1 ES219124 A1 ES 219124A1
Authority
ES
Spain
Prior art keywords
nickel plating
chemical nickel
plating procedure
light gas
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES0219124A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GEN AM TRANSPORT
General American Transportation Corp
Original Assignee
GEN AM TRANSPORT
General American Transportation Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GEN AM TRANSPORT, General American Transportation Corp filed Critical GEN AM TRANSPORT
Publication of ES219124A1 publication Critical patent/ES219124A1/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)

Abstract

El procedimiento de niquelar por vía química un cuerpo sólido de material catalítico en el cual se sumerge dicho cuerpo en un baño acuoso caliente de niquelado químico del tipo de catión de níquel y anión de hipofosfito caracterizado por poner en contacto la superficie de dicho cuerpo sumergido con un gas ligero dispersado en dicho baño de chapeado siendo dicho gas ligero químicamente inerte con respecto a dicho baño de chapeado y teniendo un peso molecular menor de 26.
ES0219124A 1954-05-18 1954-12-20 Un procedimiento de niquelar por via quimica Expired ES219124A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US430604A US2819188A (en) 1954-05-18 1954-05-18 Processes of chemical nickel plating

Publications (1)

Publication Number Publication Date
ES219124A1 true ES219124A1 (es) 1955-04-01

Family

ID=23708272

Family Applications (1)

Application Number Title Priority Date Filing Date
ES0219124A Expired ES219124A1 (es) 1954-05-18 1954-12-20 Un procedimiento de niquelar por via quimica

Country Status (2)

Country Link
US (1) US2819188A (es)
ES (1) ES219124A1 (es)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3070982A (en) * 1957-08-07 1963-01-01 Owens Illinois Giass Company Glass shaping tools coated with nickel phosphorus alloy
US3071522A (en) * 1958-10-30 1963-01-01 Bell Telephone Labor Inc Low resistance contact for semiconductors
US3072499A (en) * 1960-12-29 1963-01-08 Texaco Inc Method of coating tin on copper surfaces
US3147154A (en) * 1961-05-25 1964-09-01 Texaco Inc Method of depositing metal-containing material onto an extended surface
US3261711A (en) * 1962-12-17 1966-07-19 Honeywell Inc Electroless plating
US3281266A (en) * 1963-04-12 1966-10-25 Honeywell Inc Electroless plating
US3382079A (en) * 1964-12-16 1968-05-07 Ibm Electroless ni-fe deposition process
US3770464A (en) * 1971-10-12 1973-11-06 Shipley Co Dry replenishment of electroless copper solutions
US3900599A (en) * 1973-07-02 1975-08-19 Rca Corp Method of electroless plating
US3930462A (en) * 1975-05-08 1976-01-06 United Technologies Corporation Slurry dip tank
US4229492A (en) * 1977-12-30 1980-10-21 Amchem Products, Inc. Control of autodeposition baths
US4357372A (en) * 1977-12-30 1982-11-02 Amchem Products, Inc. Control of autodeposition baths
US4262044A (en) * 1980-05-16 1981-04-14 Kuczma Jr John J Method for the electroless nickel plating of long bodies
DE3307901A1 (de) * 1983-03-05 1984-09-06 Degussa Ag, 6000 Frankfurt Verfahren zum einbringen von badbestandteilen in galvanische und stromlose baeder
US4554184A (en) * 1984-07-02 1985-11-19 International Business Machines Corporation Method for plating from an electroless plating bath
US4967690A (en) * 1986-02-10 1990-11-06 International Business Machines Corporation Electroless plating with bi-level control of dissolved oxygen, with specific location of chemical maintenance means
JP3985858B2 (ja) * 2001-10-17 2007-10-03 株式会社荏原製作所 めっき装置
FR3075225B1 (fr) * 2017-12-19 2020-01-10 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de metallisation d'une structure poreuse en un materiau carbone

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB370626A (en) * 1931-03-20 1932-04-14 Johnson Steel & Wire Company I Improvements relating to the plating or coating of wire
US2658841A (en) * 1950-11-08 1953-11-10 Gen Am Transport Process of chemical nickel plating and bath therefor
US2658839A (en) * 1951-04-21 1953-11-10 Gen Am Transport Process of chemical nickel plating
US2758075A (en) * 1951-10-15 1956-08-07 Du Pont Electrodeposition of tin

Also Published As

Publication number Publication date
US2819188A (en) 1958-01-07

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