ES2295637T3 - Pluralidad de capas de barrera. - Google Patents

Pluralidad de capas de barrera. Download PDF

Info

Publication number: ES2295637T3
Authority: ES; Spain
Prior art keywords: layer; layers; fluid ejection; ejection device; cover layer
Prior art date: 2003-09-17
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

ES03759379T

Other languages

English (en)

Spanish (es)

Inventor

Joe Stout

Thomas R. Strand

Jeremy H. Donaldson

Paul J. Benning

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Hewlett Packard Development Co LP

Original Assignee

Hewlett Packard Development Co LP

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2003-09-17

Filing date

2003-09-17

Publication date

2008-04-16

2003-09-17 Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP

2008-04-16 Application granted granted Critical

2008-04-16 Publication of ES2295637T3 publication Critical patent/ES2295637T3/es

2023-09-17 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

230000004888 barrier function Effects 0.000 title claims description 19
239000012530 fluid Substances 0.000 claims abstract description 41
239000000758 substrate Substances 0.000 claims abstract description 18
238000010304 firing Methods 0.000 claims abstract description 9
239000000463 material Substances 0.000 claims description 68
238000000034 method Methods 0.000 claims description 17
239000010409 thin film Substances 0.000 claims description 14
230000001681 protective effect Effects 0.000 claims description 5
239000010408 film Substances 0.000 claims description 3
238000000016 photochemical curing Methods 0.000 claims description 2
238000009736 wetting Methods 0.000 claims 2
230000006978 adaptation Effects 0.000 claims 1
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
229910052782 aluminium Inorganic materials 0.000 description 5
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
239000011248 coating agent Substances 0.000 description 5
238000000576 coating method Methods 0.000 description 5
239000004593 Epoxy Substances 0.000 description 4
230000001012 protector Effects 0.000 description 4
229910052581 Si3N4 Inorganic materials 0.000 description 3
230000015572 biosynthetic process Effects 0.000 description 3
239000004020 conductor Substances 0.000 description 3
238000004299 exfoliation Methods 0.000 description 3
239000011521 glass Substances 0.000 description 3
238000002161 passivation Methods 0.000 description 3
229920000642 polymer Polymers 0.000 description 3
239000004065 semiconductor Substances 0.000 description 3
229910052710 silicon Inorganic materials 0.000 description 3
239000010703 silicon Substances 0.000 description 3
239000000377 silicon dioxide Substances 0.000 description 3
HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
229910052715 tantalum Inorganic materials 0.000 description 3
GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
239000004952 Polyamide Substances 0.000 description 2
RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
230000002745 absorbent Effects 0.000 description 2
239000002250 absorbent Substances 0.000 description 2
239000002253 acid Substances 0.000 description 2
230000008602 contraction Effects 0.000 description 2
229910052802 copper Inorganic materials 0.000 description 2
239000010949 copper Substances 0.000 description 2
238000000708 deep reactive-ion etching Methods 0.000 description 2
230000008021 deposition Effects 0.000 description 2
-1 field oxide Substances 0.000 description 2
239000000945 filler Substances 0.000 description 2
238000003754 machining Methods 0.000 description 2
239000000203 mixture Substances 0.000 description 2
TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
229920002647 polyamide Polymers 0.000 description 2
235000012239 silicon dioxide Nutrition 0.000 description 2
239000002904 solvent Substances 0.000 description 2
239000010936 titanium Substances 0.000 description 2
229910052719 titanium Inorganic materials 0.000 description 2
230000007704 transition Effects 0.000 description 2
WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
229910052721 tungsten Inorganic materials 0.000 description 2
239000010937 tungsten Substances 0.000 description 2
238000001039 wet etching Methods 0.000 description 2
JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
229910001218 Gallium arsenide Inorganic materials 0.000 description 1
229910001069 Ti alloy Inorganic materials 0.000 description 1
239000000654 additive Substances 0.000 description 1
239000000853 adhesive Substances 0.000 description 1
230000001070 adhesive effect Effects 0.000 description 1
125000000217 alkyl group Chemical group 0.000 description 1
CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 1
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
239000011230 binding agent Substances 0.000 description 1
229910052799 carbon Inorganic materials 0.000 description 1
239000000919 ceramic Substances 0.000 description 1
BGTFCAQCKWKTRL-YDEUACAXSA-N chembl1095986 Chemical compound C1[C@@H](N)[C@@H](O)[C@H](C)O[C@H]1O[C@@H]([C@H]1C(N[C@H](C2=CC(O)=CC(O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O)=C2C=2C(O)=CC=C(C=2)[C@@H](NC(=O)[C@@H]2NC(=O)[C@@H]3C=4C=C(C(=C(O)C=4)C)OC=4C(O)=CC=C(C=4)[C@@H](N)C(=O)N[C@@H](C(=O)N3)[C@H](O)C=3C=CC(O4)=CC=3)C(=O)N1)C(O)=O)=O)C(C=C1)=CC=C1OC1=C(O[C@@H]3[C@H]([C@H](O)[C@@H](O)[C@H](CO[C@@H]5[C@H]([C@@H](O)[C@H](O)[C@@H](C)O5)O)O3)O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O[C@@H]3[C@H]([C@H](O)[C@@H](CO)O3)O)C4=CC2=C1 BGTFCAQCKWKTRL-YDEUACAXSA-N 0.000 description 1
229910052804 chromium Inorganic materials 0.000 description 1
239000011651 chromium Substances 0.000 description 1
239000002131 composite material Substances 0.000 description 1
238000005336 cracking Methods 0.000 description 1
238000004132 cross linking Methods 0.000 description 1
229910021419 crystalline silicon Inorganic materials 0.000 description 1
238000001723 curing Methods 0.000 description 1
239000003989 dielectric material Substances 0.000 description 1
KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
238000001312 dry etching Methods 0.000 description 1
230000008020 evaporation Effects 0.000 description 1
238000001704 evaporation Methods 0.000 description 1
229920002313 fluoropolymer Polymers 0.000 description 1
238000009472 formulation Methods 0.000 description 1
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
239000010931 gold Substances 0.000 description 1
239000012535 impurity Substances 0.000 description 1
239000004615 ingredient Substances 0.000 description 1
239000000155 melt Substances 0.000 description 1
229910052751 metal Inorganic materials 0.000 description 1
239000002184 metal Substances 0.000 description 1
238000004377 microelectronic Methods 0.000 description 1
229910052759 nickel Inorganic materials 0.000 description 1
150000004767 nitrides Chemical class 0.000 description 1
229910052757 nitrogen Inorganic materials 0.000 description 1
229920000620 organic polymer Polymers 0.000 description 1
229910052760 oxygen Inorganic materials 0.000 description 1
239000001301 oxygen Substances 0.000 description 1
229920002120 photoresistant polymer Polymers 0.000 description 1
229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
229920001296 polysiloxane Polymers 0.000 description 1
239000011347 resin Substances 0.000 description 1
229920005989 resin Polymers 0.000 description 1
238000005488 sandblasting Methods 0.000 description 1
HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
229910010271 silicon carbide Inorganic materials 0.000 description 1
235000015096 spirit Nutrition 0.000 description 1
230000008646 thermal stress Effects 0.000 description 1
238000012876 topography Methods 0.000 description 1
238000003631 wet chemical etching Methods 0.000 description 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
- B41J2/1634—Manufacturing processes machining laser machining

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Physics & Mathematics (AREA)
Optics & Photonics (AREA)
Particle Formation And Scattering Control In Inkjet Printers (AREA)
Laminated Bodies (AREA)
Application Of Or Painting With Fluid Materials (AREA)
Coating Apparatus (AREA)

ES03759379T 2003-09-17 2003-09-17 Pluralidad de capas de barrera. Expired - Lifetime ES2295637T3 (es)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
PCT/US2003/029809 WO2005035255A1 (en)	2003-09-17	2003-09-17	Plurality of barrier layers

Publications (1)

Publication Number	Publication Date
ES2295637T3 true ES2295637T3 (es)	2008-04-16

Family

ID=34434212

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
ES03759379T Expired - Lifetime ES2295637T3 (es)	2003-09-17	2003-09-17	Pluralidad de capas de barrera.

Country Status (9)

Country	Link
EP (1)	EP1680278B1 (de)
JP (1)	JP2007528803A (de)
KR (1)	KR101012210B1 (de)
CN (1)	CN100421945C (de)
AT (1)	ATE376935T1 (de)
AU (1)	AU2003275109A1 (de)
DE (1)	DE60317247T2 (de)
ES (1)	ES2295637T3 (de)
WO (1)	WO2005035255A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4881081B2 (ja) *	2005-07-25	2012-02-22	キヤノン株式会社	液体吐出ヘッドの製造方法
US8704333B2 (en)	2007-12-19	2014-04-22	Hewlett-Packard Development Company, L.P.	Fuse chambers on a substrate
US8919938B2 (en)	2007-12-20	2014-12-30	Hewlett-Packard Development Company, L.P.	Droplet generator
US8206998B2 (en) *	2009-06-17	2012-06-26	Canon Kabushiki Kaisha	Method for manufacturing liquid discharge head
US9895885B2 (en)	2012-12-20	2018-02-20	Hewlett-Packard Development Company, L.P.	Fluid ejection device with particle tolerant layer extension
DE112012007239B4 (de)	2012-12-20	2021-11-25	Hewlett-Packard Development Co.,L.P.	Fluidausstossvorrichtung mit partikeltoleranter Schichterweiterung
CN103353708A (zh) *	2013-06-14	2013-10-16	大连理工大学	一种多层负性光刻胶模具制作方法
CN104669787B (zh) *	2013-11-28	2017-11-03	珠海赛纳打印科技股份有限公司	液体喷射装置及其制造方法
JP6333992B2 (ja)	2013-12-26	2018-05-30	大連理工大学	液体ノズルと液体噴射装置の一体成形製造方法及びその装置
CN103770468B (zh) *	2013-12-26	2016-02-03	大连理工大学	液体喷射装置及其一体成型制造方法
CN107073960B (zh) *	2014-10-30	2019-11-08	惠普发展公司，有限责任合伙企业	喷墨打印头
CN108136776B (zh) *	2015-10-30	2020-08-11	惠普发展公司，有限责任合伙企业	流体喷射设备
JP6976081B2 (ja) *	2016-06-23	2021-12-01	キヤノン株式会社	液体吐出ヘッド用デバイス

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4719477A (en)	1986-01-17	1988-01-12	Hewlett-Packard Company	Integrated thermal ink jet printhead and method of manufacture
US5317346A (en)	1992-03-04	1994-05-31	Hewlett-Packard Company	Compound ink feed slot
JP3069247B2 (ja) *	1994-07-29	2000-07-24	アルプス電気株式会社	サーマルヘッド
US6162589A (en) *	1998-03-02	2000-12-19	Hewlett-Packard Company	Direct imaging polymer fluid jet orifice
CN1116985C (zh) *	1998-06-30	2003-08-06	财团法人工业技术研究院	喷墨印头晶片的制造方法
TW369485B (en) *	1998-07-28	1999-09-11	Ind Tech Res Inst	Monolithic producing method for chip of ink-jet printing head

2003
- 2003-09-17 KR KR1020067004418A patent/KR101012210B1/ko not_active Expired - Fee Related
- 2003-09-17 AT AT03759379T patent/ATE376935T1/de not_active IP Right Cessation
- 2003-09-17 ES ES03759379T patent/ES2295637T3/es not_active Expired - Lifetime
- 2003-09-17 DE DE60317247T patent/DE60317247T2/de not_active Expired - Lifetime
- 2003-09-17 JP JP2005509543A patent/JP2007528803A/ja active Pending
- 2003-09-17 AU AU2003275109A patent/AU2003275109A1/en not_active Abandoned
- 2003-09-17 EP EP03759379A patent/EP1680278B1/de not_active Expired - Lifetime
- 2003-09-17 WO PCT/US2003/029809 patent/WO2005035255A1/en not_active Ceased
- 2003-09-17 CN CNB038270722A patent/CN100421945C/zh not_active Expired - Lifetime

Also Published As

Publication number	Publication date
CN1839046A (zh)	2006-09-27
DE60317247D1 (de)	2007-12-13
AU2003275109A1 (en)	2005-04-27
CN100421945C (zh)	2008-10-01
DE60317247T2 (de)	2008-08-07
EP1680278B1 (de)	2007-10-31
KR101012210B1 (ko)	2011-02-08
WO2005035255A1 (en)	2005-04-21
EP1680278A1 (de)	2006-07-19
JP2007528803A (ja)	2007-10-18
ATE376935T1 (de)	2007-11-15
KR20060081706A (ko)	2006-07-13

Publication	Publication Date	Title
US6739519B2 (en)	2004-05-25	Plurality of barrier layers
ES2295637T3 (es)	2008-04-16	Pluralidad de capas de barrera.
JP5179510B2 (ja)	2013-04-10	液体チャンバが改善された液滴排出装置
US5686224A (en)	1997-11-11	Ink jet print head having channel structures integrally formed therein
JP4095368B2 (ja)	2008-06-04	インクジェット記録ヘッドの作成方法
TWI236430B (en)	2005-07-21	Method for manufacturing an ink jet head
US8778200B2 (en)	2014-07-15	Method for manufacturing liquid discharge head
TW200924985A (en)	2009-06-16	Print head die slot ribs
CN101224662A (zh)	2008-07-23	喷墨打印头及其制造方法
JP5693068B2 (ja)	2015-04-01	液体吐出ヘッド及びその製造方法
CN101316713B (zh)	2011-03-30	液体排出头的制造方法
KR101235808B1 (ko)	2013-02-21	잉크젯 프린트헤드 및 그 제조방법
US8191998B2 (en)	2012-06-05	Liquid ejecting head
TWI289511B (en)	2007-11-11	Method of manufacturing liquid discharge head, and liquid discharge head
JP7134825B2 (ja)	2022-09-12	微細構造体の製造方法及び液体吐出ヘッドの製造方法
KR100560720B1 (ko)	2006-03-13	광경화성 수지 조성물을 사용한 잉크젯 프린트 헤드의제조방법
US8104872B2 (en)	2012-01-31	Inkjet printhead and method of manufacturing the same
US7278709B2 (en)	2007-10-09	Photo-curable resin composition, method of patterning the same, and ink jet head and method of fabricating the same
US20100128091A1 (en)	2010-05-27	Inkjet printhead and method of manufacturing the same
JP2017193166A (ja)	2017-10-26	液体吐出ヘッドの製造方法
JP2014094529A (ja)	2014-05-22	インクジェット記録ヘッドおよびその製造方法
US8434850B2 (en)	2013-05-07	Liquid discharge head and manufacturing method of the same
US7735961B2 (en)	2010-06-15	Liquid discharge head and method of producing the same
JP4769367B2 (ja)	2011-09-07	液体吐出ヘッドおよびその製造方法
JP2003276203A (ja)	2003-09-30	インクジェット記録ヘッド、インクカセット、記録装置、及びインクジェット記録ヘッドの製造方法