ES2342720T3 - Procedimiento de desprendimiento parcial de una capa conductiva. - Google Patents
Procedimiento de desprendimiento parcial de una capa conductiva. Download PDFInfo
- Publication number
- ES2342720T3 ES2342720T3 ES05700523T ES05700523T ES2342720T3 ES 2342720 T3 ES2342720 T3 ES 2342720T3 ES 05700523 T ES05700523 T ES 05700523T ES 05700523 T ES05700523 T ES 05700523T ES 2342720 T3 ES2342720 T3 ES 2342720T3
- Authority
- ES
- Spain
- Prior art keywords
- conductive layer
- substrate
- laser beam
- removal
- zones
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910052802 copper Inorganic materials 0.000 claims abstract description 3
- 239000010949 copper Substances 0.000 claims abstract description 3
- 230000005484 gravity Effects 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 6
- 230000006378 damage Effects 0.000 description 4
- 230000035508 accumulation Effects 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005352 clarification Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/062—Means for thermal insulation, e.g. for protection of parts
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102004006414A DE102004006414B4 (de) | 2004-02-09 | 2004-02-09 | Verfahren zum partiellen Lösen einer leitfähigen Schicht |
| DE102004006414 | 2004-02-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2342720T3 true ES2342720T3 (es) | 2010-07-13 |
Family
ID=34801834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES05700523T Expired - Lifetime ES2342720T3 (es) | 2004-02-09 | 2005-01-07 | Procedimiento de desprendimiento parcial de una capa conductiva. |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1716730B1 (de) |
| AT (1) | ATE461606T1 (de) |
| DE (2) | DE102004006414B4 (de) |
| ES (1) | ES2342720T3 (de) |
| SI (1) | SI1716730T1 (de) |
| WO (1) | WO2005076678A1 (de) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010019407B4 (de) * | 2010-05-04 | 2013-06-27 | Lpkf Laser & Electronics Ag | Verfahren zum Einbringen elektrischer Isolierungen in Leiterplatten |
| DE102010019406B4 (de) * | 2010-05-04 | 2012-06-21 | Lpkf Laser & Electronics Ag | Verfahren zum partiellen Lösen einer definierten Fläche einer leitfähigen Schicht |
| DE102011005678B4 (de) | 2011-03-17 | 2018-06-07 | Bayerische Motoren Werke Aktiengesellschaft | Vorrichtung und Verfahren zum Aufspalten eines Endlos-Faserrovings |
| CN103769749B (zh) * | 2013-12-30 | 2016-10-19 | 德中（天津）技术发展有限公司 | 一种在覆金属箔绝缘基板上制作导电图案的方法 |
| CN113692131B (zh) * | 2021-08-30 | 2024-11-12 | 德中（天津）技术发展股份有限公司 | 一种用激光加工电镀孔抗镀及导电图案的制电路板方法 |
| CN113727538A (zh) * | 2021-08-30 | 2021-11-30 | 德中（天津）技术发展股份有限公司 | 一种只电镀加厚并可焊性处理孔后激光制导电图案的制造电路板方法 |
| CN113727541A (zh) * | 2021-08-30 | 2021-11-30 | 德中（天津）技术发展股份有限公司 | 一种选择性电镀孔，激光制导电图案的电路板生产方法 |
| CN113727540A (zh) * | 2021-08-30 | 2021-11-30 | 德中（天津）技术发展股份有限公司 | 选择性电镀孔、焊盘，激光制导电图案的制造电路板方法 |
| CN113709983B (zh) * | 2021-08-30 | 2024-03-22 | 德中（天津）技术发展股份有限公司 | 一种用激光加工电镀孔、焊盘抗镀及导电图案的制电路板方法 |
| CN113709982A (zh) * | 2021-08-30 | 2021-11-26 | 德中（天津）技术发展股份有限公司 | 一种用激光加工电镀孔掩膜和导电图案的制电路板方法 |
| CN113709984B (zh) * | 2021-08-30 | 2024-08-27 | 德中（天津）技术发展股份有限公司 | 一种用激光加工电镀孔、焊盘抗镀及抗蚀图案的制电路板方法 |
| CN113766767B (zh) * | 2021-08-30 | 2025-02-25 | 德中（天津）技术发展股份有限公司 | 一种用激光加工电镀孔及抗蚀图案的制电路板方法 |
| CN113747673B (zh) * | 2021-08-30 | 2024-10-25 | 德中（天津）技术发展股份有限公司 | 一种用激光分别加工电镀孔、线路掩膜和导电图案的制电路板方法 |
| CN113709986A (zh) * | 2021-08-30 | 2021-11-26 | 德中（天津）技术发展股份有限公司 | 只电镀孔后激光制抗镀图案和导电图案的制电路板方法 |
| DE102021210324A1 (de) | 2021-09-17 | 2023-03-23 | Robert Bosch Gesellschaft mit beschränkter Haftung | Schweißverfahren und Schweißvorrichtung zum Laserschweißen einer flexiblen Folie an ein Substrat |
| CN115302095A (zh) * | 2022-07-26 | 2022-11-08 | 德中（天津）技术发展股份有限公司 | 一种用激光去除电镀工艺导线的方法 |
| DE102023136336B3 (de) * | 2023-12-21 | 2025-06-05 | Lpkf Laser & Electronics Se | Verfahren zum Entfernen von Bereichen einer auf einem Substrat aufgebrachten Schicht |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3214315A (en) * | 1962-03-28 | 1965-10-26 | Burton Solomon | Method for forming stamped electrical circuits |
| JP3153682B2 (ja) * | 1993-08-26 | 2001-04-09 | 松下電工株式会社 | 回路板の製造方法 |
| JP3159841B2 (ja) * | 1993-08-26 | 2001-04-23 | ポリプラスチックス株式会社 | レーザーによる回路形成方法及び導電回路形成部品 |
| TW284907B (en) * | 1995-06-07 | 1996-09-01 | Cauldron Lp | Removal of material by polarized irradiation and back side application for radiation |
| US6203952B1 (en) * | 1999-01-14 | 2001-03-20 | 3M Innovative Properties Company | Imaged article on polymeric substrate |
| JP4928687B2 (ja) * | 2001-08-02 | 2012-05-09 | 独立行政法人科学技術振興機構 | 超短パルスレーザーを用いた表面剥離洗浄方法とその装置 |
| TW558743B (en) * | 2001-08-22 | 2003-10-21 | Semiconductor Energy Lab | Peeling method and method of manufacturing semiconductor device |
-
2004
- 2004-02-09 DE DE102004006414A patent/DE102004006414B4/de not_active Expired - Fee Related
-
2005
- 2005-01-07 SI SI200531024T patent/SI1716730T1/sl unknown
- 2005-01-07 AT AT05700523T patent/ATE461606T1/de active
- 2005-01-07 WO PCT/DE2005/000010 patent/WO2005076678A1/de not_active Ceased
- 2005-01-07 EP EP05700523A patent/EP1716730B1/de not_active Expired - Lifetime
- 2005-01-07 DE DE502005009227T patent/DE502005009227D1/de not_active Expired - Lifetime
- 2005-01-07 ES ES05700523T patent/ES2342720T3/es not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE102004006414B4 (de) | 2008-08-21 |
| EP1716730A1 (de) | 2006-11-02 |
| SI1716730T1 (sl) | 2010-07-30 |
| DE102004006414A1 (de) | 2005-08-25 |
| DE502005009227D1 (de) | 2010-04-29 |
| ATE461606T1 (de) | 2010-04-15 |
| EP1716730B1 (de) | 2010-03-17 |
| WO2005076678A1 (de) | 2005-08-18 |
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