ES2531431T3 - Estructura de interconexión basada en nanotubos de carbono redirigidos - Google Patents

Estructura de interconexión basada en nanotubos de carbono redirigidos Download PDF

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Publication number
ES2531431T3
ES2531431T3 ES10807619.1T ES10807619T ES2531431T3 ES 2531431 T3 ES2531431 T3 ES 2531431T3 ES 10807619 T ES10807619 T ES 10807619T ES 2531431 T3 ES2531431 T3 ES 2531431T3
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ES
Spain
Prior art keywords
beams
cnt
carbon nanotubes
structure based
interconnection structure
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Active
Application number
ES10807619.1T
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English (en)
Inventor
Jean Dijon
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Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/44—Conductive materials thereof
    • H10W20/4462—Carbon or carbon-containing materials, e.g. graphene
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
    • H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/0554—Manufacture or treatment of conductive parts of the interconnections of nanotubes or nanowires
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/842—Manufacture, treatment, or detection of nanostructure for carbon nanotubes or fullerenes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Carbon And Carbon Compounds (AREA)

Abstract

Dispositivo electrónico que comprende conexiones eléctricas que se extienden según al menos dos direcciones distintas, estando dichas conexiones realizadas por medio de haces de nanotubos de carbono (CNT) (8), de los que al menos dos haces de CNT incluyen una parte (8a) cuyo eje está dirigido según una primera dirección, y una parte (8b) cuyo eje está redirigido según una segunda dirección, caracterizado porque la conexión entre los haces de CNT está garantizada mediante superposición sucesiva de los extremos de dichos al menos dos haces de manera a formar una pista de conexión (4), incluyendo al menos uno de dichos haces de CNT una parte (8a) dentro de un orificio metalizado.

Description

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Claims (1)

  1. imagen1
ES10807619.1T 2010-02-11 2010-12-17 Estructura de interconexión basada en nanotubos de carbono redirigidos Active ES2531431T3 (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1050986 2010-02-11
FR1050986A FR2956243B1 (fr) 2010-02-11 2010-02-11 Structure d'interconnexion a base de nanotubes de carbone rediriges
PCT/FR2010/052792 WO2011098679A1 (fr) 2010-02-11 2010-12-17 Structure d'interconnexion a base de nanotubes de carbone rediriges

Publications (1)

Publication Number Publication Date
ES2531431T3 true ES2531431T3 (es) 2015-03-16

Family

ID=42667917

Family Applications (1)

Application Number Title Priority Date Filing Date
ES10807619.1T Active ES2531431T3 (es) 2010-02-11 2010-12-17 Estructura de interconexión basada en nanotubos de carbono redirigidos

Country Status (8)

Country Link
US (2) US20120292103A1 (es)
EP (1) EP2534678B1 (es)
JP (1) JP5699164B2 (es)
KR (1) KR101721060B1 (es)
CN (1) CN102725839A (es)
ES (1) ES2531431T3 (es)
FR (1) FR2956243B1 (es)
WO (1) WO2011098679A1 (es)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9096784B2 (en) 2010-07-23 2015-08-04 International Business Machines Corporation Method and system for allignment of graphite nanofibers for enhanced thermal interface material performance
US9257359B2 (en) * 2011-07-22 2016-02-09 International Business Machines Corporation System and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3D chip stacks
US9245813B2 (en) 2013-01-30 2016-01-26 International Business Machines Corporation Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance
US9090004B2 (en) 2013-02-06 2015-07-28 International Business Machines Corporation Composites comprised of aligned carbon fibers in chain-aligned polymer binder
US9082744B2 (en) 2013-07-08 2015-07-14 International Business Machines Corporation Method for aligning carbon nanotubes containing magnetic nanoparticles in a thermosetting polymer using a magnetic field

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4212258B2 (ja) * 2001-05-02 2009-01-21 富士通株式会社 集積回路装置及び集積回路装置製造方法
US20100244262A1 (en) * 2003-06-30 2010-09-30 Fujitsu Limited Deposition method and a deposition apparatus of fine particles, a forming method and a forming apparatus of carbon nanotubes, and a semiconductor device and a manufacturing method of the same
US7129097B2 (en) * 2004-07-29 2006-10-31 International Business Machines Corporation Integrated circuit chip utilizing oriented carbon nanotube conductive layers
JP5028744B2 (ja) * 2005-02-15 2012-09-19 富士通株式会社 カーボンナノチューブの形成方法および電子デバイスの製造方法
JP4481853B2 (ja) * 2005-03-18 2010-06-16 富士通株式会社 カーボンナノチューブデバイスの製造方法
CN100591613C (zh) * 2006-08-11 2010-02-24 清华大学 碳纳米管复合材料及其制造方法
JP2009032819A (ja) * 2007-07-25 2009-02-12 Fujitsu Ltd 電子装置の製造方法及びそれを用いた電子装置
US20090294966A1 (en) * 2008-05-27 2009-12-03 Unidym, Inc. Carbon nanotubes as interconnects in integrated circuits and method of fabrication
FR2933106B1 (fr) * 2008-06-27 2010-12-24 Commissariat Energie Atomique Procede d'obtention de tapis de nanotubes de carbone sur substat conducteur ou semi-conducteur
CN101562148B (zh) * 2009-04-24 2011-08-24 北京大学 一种用碳纳米管实现上下两层导电材料垂直互连的方法

Also Published As

Publication number Publication date
CN102725839A (zh) 2012-10-10
WO2011098679A1 (fr) 2011-08-18
JP5699164B2 (ja) 2015-04-08
FR2956243B1 (fr) 2013-10-25
US9165825B2 (en) 2015-10-20
KR20120113766A (ko) 2012-10-15
KR101721060B1 (ko) 2017-04-10
FR2956243A1 (fr) 2011-08-12
EP2534678B1 (fr) 2015-02-11
US20140338189A1 (en) 2014-11-20
JP2013520002A (ja) 2013-05-30
EP2534678A1 (fr) 2012-12-19
US20120292103A1 (en) 2012-11-22

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