ES254803A1 - Method of making printed circuits - Google Patents
Method of making printed circuitsInfo
- Publication number
- ES254803A1 ES254803A1 ES0254803A ES254803A ES254803A1 ES 254803 A1 ES254803 A1 ES 254803A1 ES 0254803 A ES0254803 A ES 0254803A ES 254803 A ES254803 A ES 254803A ES 254803 A1 ES254803 A1 ES 254803A1
- Authority
- ES
- Spain
- Prior art keywords
- metal
- specifications
- phenol
- titanium
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 6
- 239000002184 metal Substances 0.000 abstract 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 abstract 3
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 abstract 3
- 239000000203 mixture Substances 0.000 abstract 3
- 239000002245 particle Substances 0.000 abstract 3
- 229920001568 phenolic resin Polymers 0.000 abstract 3
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- 229920000459 Nitrile rubber Polymers 0.000 abstract 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 2
- 229910021626 Tin(II) chloride Inorganic materials 0.000 abstract 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 239000004411 aluminium Substances 0.000 abstract 2
- 229910052782 aluminium Inorganic materials 0.000 abstract 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 2
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 abstract 2
- 229920002301 cellulose acetate Polymers 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 238000000151 deposition Methods 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 abstract 2
- 239000011521 glass Substances 0.000 abstract 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 abstract 2
- 239000007788 liquid Substances 0.000 abstract 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 abstract 2
- 229920000647 polyepoxide Polymers 0.000 abstract 2
- 229910052703 rhodium Inorganic materials 0.000 abstract 2
- 239000010948 rhodium Substances 0.000 abstract 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 229910052709 silver Inorganic materials 0.000 abstract 2
- 239000004332 silver Substances 0.000 abstract 2
- 239000001119 stannous chloride Substances 0.000 abstract 2
- 235000011150 stannous chloride Nutrition 0.000 abstract 2
- JZLWSRCQCPAUDP-UHFFFAOYSA-N 1,3,5-triazine-2,4,6-triamine;urea Chemical compound NC(N)=O.NC1=NC(N)=NC(N)=N1 JZLWSRCQCPAUDP-UHFFFAOYSA-N 0.000 abstract 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical class [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract 1
- 229920000084 Gum arabic Polymers 0.000 abstract 1
- 241000978776 Senegalia senegal Species 0.000 abstract 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 abstract 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 abstract 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 abstract 1
- 239000000205 acacia gum Substances 0.000 abstract 1
- 235000010489 acacia gum Nutrition 0.000 abstract 1
- 230000004913 activation Effects 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 239000004927 clay Substances 0.000 abstract 1
- 229910052570 clay Inorganic materials 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000010941 cobalt Substances 0.000 abstract 1
- 229910017052 cobalt Inorganic materials 0.000 abstract 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 abstract 1
- 229920001577 copolymer Polymers 0.000 abstract 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 abstract 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 abstract 1
- 229940112669 cuprous oxide Drugs 0.000 abstract 1
- 238000000354 decomposition reaction Methods 0.000 abstract 1
- 229920001971 elastomer Polymers 0.000 abstract 1
- 238000004070 electrodeposition Methods 0.000 abstract 1
- 239000004744 fabric Substances 0.000 abstract 1
- 235000013312 flour Nutrition 0.000 abstract 1
- 239000004312 hexamethylene tetramine Substances 0.000 abstract 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 abstract 1
- 238000007654 immersion Methods 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 239000004922 lacquer Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000001465 metallisation Methods 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 229960004011 methenamine Drugs 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical class [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 abstract 1
- 229910021653 sulphate ion Inorganic materials 0.000 abstract 1
- 239000010936 titanium Substances 0.000 abstract 1
- 229910052719 titanium Inorganic materials 0.000 abstract 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 abstract 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 abstract 1
- YONPGGFAJWQGJC-UHFFFAOYSA-K titanium(iii) chloride Chemical compound Cl[Ti](Cl)Cl YONPGGFAJWQGJC-UHFFFAOYSA-K 0.000 abstract 1
- 239000002023 wood Substances 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
- 239000011701 zinc Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Chemically Coating (AREA)
Abstract
Exemplified viscous adhesive compositions which are applied to insulating bases prior to deposition of metal coatings thereon in the production of printed circuits (see Group II) comprise (1) and (2) phenol-formaldehyde, polyvinyl butyral, powdered cuprous oxide or zinc dust, powdered silica, diethyl carbonate and ethanol and (3) epoxy modified phenol-aldehyde, butadiene-acrylonitrile, aluminium powder, hexamethylene tetramine, diethyl carbonate and diacetone alcohol. Specifications 674,630, 924,049 and U.S.A. Specifications 2,534,374 and 2,758,953 are referred to.ALSO:In a process of forming a printed circuit, selected areas of an insulating base are coated with a viscous liquid composition containing an adhesive component and particles which act as such, or after activation, as sites for the decomposition of, and deposition of metal from, a currentless metal deposition bath, and the base then immersed in such a bath to deposit metal on the said selected areas. The insulating base may be of ceramic, rubber, phenol-formaldehyde impregnated material, melamine-urea, vinyl acetate-chloride copolymer, cellulose acetate, epoxy resin, glass cloth or epoxy-coated glass. Specified viscous liquid compositions contain phenolformaldehyde or phenol-aldehyde/epoxy resin together with polyvinyl butyral or butadiene acrylonitrile alternatively, they may be based on cellulose acetate lacquer or gum arabic. Specified active particles are of titanium, aluminium, copper, iron, cobalt, zinc, titanium oxide, copper oxides, stannous chloride, stannous fluoroborate, stannous sulphate or titanium trichloride. Particles which may be activated (successively in stannous chloride and titanium chloride) are of silica, clay, alumina or wood flour. Metals which may be currentlessly deposited are copper, nickel, silver and rhodium. A suitable bath contains copper sulphate, sodium hydroxide, Rochelle salts and formaldehyde. After the metal is deposited, the structure may be heated and the circuit then built up e.g. with silver and rhodium by electrodeposition, or by immersion in molten metal or alloy. Specifications 674,630, 924,049 and U.S.A. Specifications 2,534,374 and 2,758,953 are referred to.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US78570359A | 1959-01-08 | 1959-01-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES254803A1 true ES254803A1 (en) | 1960-05-01 |
Family
ID=25136361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES0254803A Expired ES254803A1 (en) | 1959-01-08 | 1960-01-07 | Method of making printed circuits |
Country Status (8)
| Country | Link |
|---|---|
| AT (1) | AT238283B (en) |
| BE (1) | BE586392A (en) |
| CH (1) | CH381293A (en) |
| DE (1) | DE1176731B (en) |
| DK (1) | DK98445C (en) |
| ES (1) | ES254803A1 (en) |
| FR (1) | FR1237098A (en) |
| GB (1) | GB938365A (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1665374B1 (en) * | 1966-06-28 | 1971-09-09 | Photocircuits Corp | BASE MATERIAL MADE OF INSULATING MATERIAL FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARDS |
| DE2131205C3 (en) * | 1971-06-23 | 1981-07-30 | International Electronic Research Corp., Burbank, Calif. | Process for the production of a printed circuit with a metal core |
| FR2397469A1 (en) * | 1977-02-22 | 1979-02-09 | Panoduz Anstalt | PROCEDURE FOR DEPOSING A LAYER OF CONDUCTIVE METAL ON AN INSULATING SUPPORT |
| DE2950239A1 (en) | 1978-12-14 | 1980-06-26 | British Aerospace | PROTECTIVE COVER FOR EROSION HAZARDOUS PARTS AND METHOD FOR THE PRODUCTION |
| GB2038101B (en) * | 1978-12-19 | 1983-02-09 | Standard Telephones Cables Ltd | Printed circuits |
| DE3733002A1 (en) * | 1986-09-30 | 1988-04-07 | Wilde Membran Impuls Tech | Electroconductive pattern metallised additively |
| WO1988002592A1 (en) * | 1986-09-30 | 1988-04-07 | Wilde Membran Impulstechnik Gmbh | Electrically conductive structure with applied metallization |
| US5227223A (en) * | 1989-12-21 | 1993-07-13 | Monsanto Company | Fabricating metal articles from printed images |
| USD337524S (en) | 1991-06-25 | 1993-07-20 | Colgate-Palmolive Company | Bottle |
| TW218430B (en) * | 1992-01-30 | 1994-01-01 | Motorola Inc | |
| DE10241137B4 (en) * | 2002-09-03 | 2008-05-15 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Process for the metallization of plastics |
| GB201212407D0 (en) * | 2012-07-12 | 2012-08-22 | Intrinsiq Materials Ltd | Composition for forming a seed layer |
| WO2020075152A2 (en) * | 2018-10-11 | 2020-04-16 | Shell Oil Company | A composition and uses thereof |
-
1959
- 1959-07-24 GB GB2549759A patent/GB938365A/en not_active Expired
- 1959-10-07 FR FR806952A patent/FR1237098A/en not_active Expired
-
1960
- 1960-01-05 AT AT4360A patent/AT238283B/en active
- 1960-01-05 CH CH4460A patent/CH381293A/en unknown
- 1960-01-07 ES ES0254803A patent/ES254803A1/en not_active Expired
- 1960-01-07 DE DE1960P0024203 patent/DE1176731B/en active Pending
- 1960-01-07 DK DK5260A patent/DK98445C/en active
- 1960-01-08 BE BE586392A patent/BE586392A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE1176731B (en) | 1964-08-27 |
| CH381293A (en) | 1964-08-31 |
| GB938365A (en) | 1963-10-02 |
| BE586392A (en) | 1960-07-08 |
| DK98445C (en) | 1964-04-13 |
| FR1237098A (en) | 1960-07-22 |
| AT238283B (en) | 1965-02-10 |
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