ES2556543A1 - Process for the elaboration of a gluten-free stuffed wafer from an extruded/expanded rice-based cookie. (Machine-translation by Google Translate, not legally binding) - Google Patents

Abstract

Process for the preparation of a gluten-free filled wafer suitable for celiacs, covered with a chocolate bath made from extruded/expanded rice-based biscuits, comprising the steps of: mixing in a mixer the raw materials used in the base biscuit, mainly constituted for an ingredient with a high proportion of starch such as corn starch, potato, cassava, sorghum or rice flour, with the addition of ingredients that contribute to the final appearance of the base biscuit, protein sources such as milk powder, cheese whey powders or simple sugars such as sucrose or glucose, salt and dyes, as well as other ingredients to modify the expansion such as calcium carbonate, baking powder (sodium bicarbonate and some acidic agent such as calcium monoacid phosphate) or some dietary fiber; elaborating in an extruder the cookies that constitute the substrate with which the wafer is formed using a head with inserts that allows to obtain tapes of expanded material; adjust the thickness of the ribbons of expanded material in a laminator and cut to form cookies; place the cookies in a single plane in a vibratory distributor without them being covered and delivered to a conveyor belt, baked and then cooled on a belt; transport the cookies to the cookie feeder; nourish in a continuous and orderly way the cookies covered with chocolate, and once covered goes through a cooling tunnel; after the cooling stage the wafer bathed is transported to the packaging line where the process is finished. (Machine-translation by Google Translate, not legally binding)

Description

PROCESS FOR THE DEVELOPMENT OF A GLUTEN-FREE STUFFED WAFFLE FROM EXTRUDED COOKIE EXPRESSED RICE BASED

Field of this Invention:

The present invention relates to a gluten-free wafer suitable for coeliacs and its preparation obtained from an extruded rice cracker of low moisture content, of organoleptic qualities similar to a conventional wafer.

Background of the Invention:

The wafer is a product made with a dough consisting mainly of flour

15 wheat bread, starches and water obtained by heating, at high temperature, between two metal plates or in appropriate molds that allow to achieve a low density, crunchy and low humidity cookie. The dough may be added with salt, sugars, milk, fat, eggs, flavorings and dyes.

20 Through extrusion it is possible to obtain an expanded low density cookie starting from rice flour and using ingredients such as salt, sugar, powdered milk. ele.

The present invention relates to a process and product obtained by it, which

25 allows to obtain a wafer filled with chocolate and gluten-free in its composition, which would be suitable for coeliacs.

The problem with making a gluten-free wafer is that the traditional technology for wafer cookie assembly is not prepared to work with ingredients such as

30 rice flour (gluten free). This problem could be solved using an extrusion process with which it is possible to achieve the characteristics required for this type of product with low density, with crunch and with low humidity.

Brief description of the figures

35 Figure 1 shows the process of making an extruded rice cracker Figure 2 shows the process of making the filling Figure 3 shows the wafer assembly and plating process

Detailed description of the invention:

Each stage is detailed below:

1.-Manufacture of the extruded rice cracker:

As mentioned in the introduction, the main problem in obtaining a gluten-free product, and that retains the characteristics required for a wafer, is to obtain a crunchy cookie of low density and with low humidity.

5 In the market, the technology used to make the wafer biscuit starts from a liquid dough that is applied on a mold where the product is cooked by pressure and heating at temperatures above 200 oC. This process is designed to work with fluid and protein-containing doughs that come mainly from wheat flour, a source of gluten. If wheat flour is replaced by rice flour, no

10 it is possible to get a crispy product, the cookie is rubbery and asymmetrical.

Another existing technology to make rice-based biscuits, gluten-free, is by high temperature expansion. This technology is based on the grain of whole and / or broken rice that is moistened to a humidity of between 15 and 18% and subsequently cooked in a 15 mold, where the rice is subjected to pressure and temperatures above 250 oC and for a period of time between 8 and 10 seconds. With this technology a cookie of uniform dimensions but with inadequate organoleptic characteristics is achieved. The cookie is hard and gummy texture. As the results obtained by the previous technologies could not achieve the organoleptic result required for the cookie,

20 worked on the extrusion-forming process where a product with the required organoleptic characteristics and that allowed to prepare a gluten-free wafer was achieved. The process is described below.

Manufacture of the extruded rice cracker

25 The cookie is made with a mixture of ingredients with a high proportion of starchy products such as rice flour and others, is expanded in a single or double screw extruder using linear inserts to form a thin tape which is cut to the desired size, ordered On a flat surface. Said formulation is indicated in the

30 table 1:

TABLE I

Ingredients

%

Rice flour

90-95

Skim milk powder

4-6

Salt

0.5 -2

Sugar

0.5 -2

The raw material used to make the cookies is previously mixed in a

35 high efficiency horizontal mixer 1 which is powered by pneumatic transport. The raw materials used in the base biscuit consist mainly of an ingredient with a high proportion of starch such as corn starch, potato, cassava, sorghum

or rice flour, with the addition of ingredients that contribute to the final appearance of the base cookie, protein sources such as milk powder, whey cheese powder or simple sugars

40 as sucrose or glucose, salt, and dyes. Other ingredients may also be incorporated to modify the expansion such as calcium carbonate, baking powder (sodium bicarbonate and some acidic agent such as calcium mono acid phosphate) or some food fiber. All these ingredients must be gluten free.

The cookies that constitute the basis for the wafer, are made in a

5 extruder 2 (double screw or single screw) using a head with inserts that allows get ribbons of expanded material. The ribbons of expanded material leave the extruder with a linear speed between 10 and 30 m / min, preferably between 15 and 25 m / min. The Expanded material tapes have a width between 20 and 60 mm, preferably between 40 and 50 mm and a thickness between 3 and 10 mm, preferably between 6 and 8 mm. The density

10 apparent of the extruded material is in the range 0.08 to 0.13 g / cm 3 preferably 0.100.11 g / cm 3 which is achieved with process temperatures in the extruder greater than 140 °

C.

Using a laminator / cutter 3 the thickness of the expanded material belts is adjusted

15 which are obtained from extruder 2, also achieving a more uniform and flat surface for the subsequent application of the cover. At the time of cutting the ribbons of expanded material, the product has a humidity for example between 5 and 15%, preferably between 8 and 12% and a temperature for example between 50 and 95 ° e, preferably between 70 and 85 ° e, which give it the flexibility that cutting allows without

20 generation of fine powders.

The cookies obtained with the laminator / cutter 3 are between 4 and 5 cm wide and 5 and 10 cm long, preferably between 4.4 and 4.6 cm wide and 8 to 8.2 cm long. The cut cookies are placed in a vibrating distributor 4 formed, for example, by 1 to 6 trays, preferably between 2 and 4 vibrating trays, which allow all cookies to be placed in a single plane without them being lit. The cookies are then derived to a tape or mesh where the surface occupied by the cookies in the transport is between 20 and 50% of the total superticia. The speed of the belt is related to the production of the extruder which causes the speed to vary

30 linear.

The cookies are delivered to a conveyor belt with a speed between 5 and 20 m / min, preferably between 18 and 14 mI min that delivers them to the oven.

35 Baking 5 constitutes the drying operation, it must be done in a very short time following the speeds of the equipment that precedes it. This operation must be carried out in a direct flame oven to achieve high thermal transfer capacity. The residence time in the oven is between 2 and 5 minutes with a belt speed between 8 and 20 m / min but preferably between 10 and 14 m / min. At the exit of the oven is

40 a cooling transport 6 in which the cookie is cooled to a temperature close to room temperature. The residence time is between 10 and 20 minutes, preferably between 12 and 15 minutes then passing to feeder 7. The final humidity of the cookie, prior to feeder 7, is between 2 and 6%, preferably between 3 and 4%. Value that allows us to reach a water activity between 0.30 and 0.40, preferably between

45 0.32 and 0.36 which is suitable for obtaining a crispy product.

P201 530988

Example ND 1, extruded cookie:

An extruded biscuit based on rice flour (93%), milk powder (3%), salt (2%) and sugar (2%) was prepared under the following process conditions of the extruder:

• Flow of dry ingredients: 300 kg / h 5 • Water added to the extruder: 20 kg / h

•

Screw speed: 200 rpm

•

Working temperatures: 160; 130; 130; 100; 70; 30 'C

The extruder outlet belts resulted in a speed of 22 m / min speed, with a width of 45 mm, thickness of 8 mm, apparent density of 0.11 g / cm3 and 9.5% humidity. By using the laminator the thickness was reduced to 7 mm.

The tapes were cut into cookies 8 cm long by 4.5 cm wide by 0.7 cm thick by the cutter and ordered by the distributor to avoid overlapping units.

The cookies are delivered by a conveyor belt at a speed of 12 m / min to the direct flame oven with a temperature of 180 oC at a speed of 12 m / min with 3 minutes of residence time in which the initial humidity of 15, 5% bh is reduced

20 to 4% bh, with a water activity (aw) of 0.36.

Under these process conditions cookies are observed without deformation and with a crispy texture

25 Filling manufacturing:

The filling is made with a mixture of high proportion of sugars and / or liquid and solid fat material that results in a low moisture value and low water activity (aw), which is essential to maintain the crocance of the product throughout of the shelf life.

In addition to the base ingredients, other ingredients are added to give texture, color and flavor, such as soy lecithin, milk powder and / or its derivatives, starches, flavorings, salt, citric acid, dextrin malt, in the proportion indicated in table 11.

The formulation is of the utmost importance since it is necessary to obtain an adequate balance

35 of ingredients to reach a water activity (aw) between 0.40 and 0.50, preferably between 0.45 and 0.48 which is the one required to obtain a crispy product.

TA BLA 11

Ingredients

%

Refined sugar

40-50

Sunflower oil

25-30

Hydrogenated vegetable oil

5 -10

Milk powder

5 -8

Cornstarch

6-8

Yogurt powder

1-3

Malto dextrin Lecithin Anhydrous citric acid Salt Essence

2 -4.5 0.1-0.3 0.1 -0.5 0.3 -0 .6 0.3

The fatty raw materials used for the filling process are mixed in a preparation tank 8 which is fed with liquid oil by a pump system and weighed in the tank 8. At this stage the oil is heated to a temperature between 40 and 80

5 cC, preferably between 60 and 65 cC. When the liquid oil reaches the desired temperature, the hydrogenated vegetable oil is added, which has a melting point between 35 and 55 cC, preferably between 40 and 45 cC, this mixture is kept stirred until it reaches the final temperature between 55 and 70 cC, preferably between 60 and 65 cC. At this stage it is important to completely melt solid fat.

10 Once the fat mixture is prepared, it is passed to a homogenization tank 9 that has a paddle stirrer and maintains the temperature between 35 and 50 cc, preferably between 40 and 45 ce, where the rest of the previously weighed ingredients are added , in the following order: sugar, milk powder, starch, yogurt powder, malt

15 dextrin, citric acid, salt, essence. Stirring is maintained until a homogeneous mixture is obtained for 30 to 60 minutes, preferably between 40 and 45 minutes. At this stage it is important to achieve a uniform and lump-free mixture in order to obtain a correct dispersion of the ingredients.

At the end of homogenization, once the desired temperature has been reached, soy lecithin is added and mixed for 20 minutes.

Once the mixing stage of all the ingredients is completed, the mixture is refined in a vertical ball mill 10 with a production capacity

25 between 150 to 200 kg / hour, rotation speed of the rotor of the mill of 300 rpm, working temperature between 40 and 55 cc, preferably between 40 and 44 cc where the final objective is to achieve a product whose particle size does not exceed 50 microns, preferably between 30 and 40 microns, in order to achieve a creamy and smooth texture on the palate.

30 Once the required granulometry has been reached, the product is stored in storage tank 11 at a controlled temperature between 30 and 40 ce, preferably 35 ce. for later use in the wafer assembly line.

35 Example No. 2, filling:

Filler was prepared based on:

40 TABLE 111

I Ingredients

Sunflower oil

30

Hydrogenated vegetable oil

7

Milk powder

6

Cornstarch

6

Yogurt powder

2

Malto dextrin

3

Lecithin

0.2

Anhydrous citric acid

0.2

Salt

0.3

Essence

0.3

The process conditions are:

• Preparation of fat mixture: 5 Mixing temperature 63 ce

•

Ingredient mixing tank: Mixing temperature 42 oC Mixing time 40 min.

•

Ball Mill: Working capacity 150 kg / h Working speed 300 rpm Working temperature 42 C

15 Maximum particle size 35 microns Under these process conditions, a creamy characteristic filler was obtained, with a water activity of 0.48.

Armed and bathed in wafers

The cookies that are obtained in the extrusion stage are 4.5 cm wide by 8 cm long and 0.7 cm thick. These are placed in the cookie feeder 12, which has the function of continuously and orderly feeding the units that will make up the wafer sandwich. This machine has 8 cookie feed channels and must

25 work at a rate between 20 and 40 cookies / minute per channel, preferably 30 to 36 cookies / minute per channel, to maintain an adequate distribution in the next stage of sandwich forming.

In the wafer sandwich maker 13 the feeder 12 cookies enter.

The equipment receives the cookies in an aligned manner and automatically doses alternately the filling from the filling manufacturing line at a rate that is half of the cookie feeder, between 10 and 20 dosages / minute per channel, preferably between 15 and 18 dosages / minute per channel. The amount of filling to be dosed by sandwich should be between 5 and 10 g, preferably between 6 and 7 g, at a dosing temperature

Between 20 and 30 oC, preferably 23 to 27 oC, which is the appropriate temperature to obtain a good distribution of the filling in the form. Once the filling application is completed, machine 2 automatically applies the second cookie on the filling and leaves the sandwich that passes to the bathing stage.

Wafer bath 14 receives the sandwich at a rate of 15 to 18 units / min. per channel which are automatically coated whose melting point must be between 30 and 45 cC, preferably between 34 and 40 cC. At this stage the product must be coated 5 completely over the entire surface for which a coverage dosage is necessary of chocolate between 6 and 12 g / unit, preferably 8 to 9 g / unit. This dosage is achieved by regulating the feed rate of the bath between 2 and 3 kg / minute and at a conveyor belt speed between 1.8 to 2.2 meters / minutes. At the exit of the bath, the Wafer superficially has a temperature between 34 and 40 cc and must be cooled to

10 solidify the bathroom.

The coated wafer passes through a cooling tunnel 15 which must be at a temperature between 5 and 15 cc, preferably between 8 and 10 cc for 4 minutes, which is the appropriate residence time for the wafer surface to be below 20 cc and it

15 completely solidify the chocolate bath.

After the cooling stage 151a bathed wafer is finished, it is transported to the packaging line 16 where the process is completed.

20 Example No., Armed and plated with wafer:

Wafers were made from cookies and filling made according to the process described in the previous points. The following process conditions were worked:

25 Cookie feeding: 32 cookies / minute per channel

Sandwich Forming: Fill dosage: 6 g / unit Filling temperature: 25 cc

30 Rhythm: 16 sandwich / minute per channel

Wafer bath: Bath temperature: 37 cc Transport belt speed: 1.9 m / min. Bath feed rate: 2.3 kg / min.

35 Cooler: Residence time: 4 min. Tunnel temperature: 8 ce Product surface temperature: 18 ce

40 Under these conditions a product was obtained with 9 9 of chocolate bath that allowed to completely cover the surface of the product.

Claims (35)

 REIVIND ICATIONS 1. Process for the preparation of a gluten-free filled wafer suitable for celiacs, covered with chocolate bath from extruded / expanded rice-based biscuit, 5 includes the steps of: Mix in a mixer the raw materials used in the base cookie consisting mainly of an ingredient with a high proportion of starch such as corn starch, potato, cassava, sorghum or rice flour, with the addition of ingredients that contribute to the final aspect of the base cookie, protein sources like 10 milk powder, whey cheese powder or simple sugars such as sucrose or glucose, salt, and dyes, as well as other ingredients to modify the expansion such as calcium carbonate, baking powder (baking soda and some acidic agent such as phosphate mono calcium acid) or some food fiber; elaborate in an extruder the cookies that constitute the substrate with which the wafer is formed using a head with inserts that allows to obtain ribbons of expanded material; adjust the thickness of the ribbons of expanded material in a laminator and cut to form cookies; place the cookies in a vibrating distributor in a single plane without the same 20 being ignited and delivered to a conveyor belt, baked and then cooled in a headband; transport the cookies to the cookie feeder; continuously and tidy up the cookies bathed with coverage of chocolate, and once coated passes through a cooling tunnel; Once the cooling stage is finished, the bathed wafer is transported to the packaging line where the process is completed. 2. The process according to claim 1, characterized in that the ribbons of expanded material leave the extruder with a linear speed between 10 and 30 m / min. 3. The process according to claim 1, characterized in that the ribbons of expanded material leave the extruder with a linear speed between 15 and 25 m / min. 4. The process according to claim 1, characterized in that the ribbons of expanded material have a width of between 20 and 60 mm. The process according to claim 1, characterized in that the ribbons of expanded material have a width of between 40 and 50 mm.

The process according to claim 1, characterized in that the ribbons of expanded material have a thickness of between 3 and 10 mm.

7. The process according to claim 1, characterized in that the ribbons of expanded material have a thickness of between 6 and 8 mm.

The process according to claim 1, characterized in that the ribbons of expanded material have an apparent density of between 0.08 and 0.13 g / cm3.

9. The process according to claim 1, characterized in that the ribbons of expanded material have an apparent density of between 0.10 and 0.11 g / cm3.

10.

The process according to claim 8 and 9, characterized in that said bulk density is achieved with process temperatures in the extruder above 140 oC.

eleven.

The process according to claim 1, characterized by cutting the ribbons of expanded material to form cookies without the generation of fine powders, the product has a humidity of between 5% and 15%.

The process according to claim 1, characterized by cutting the tapes of expanded material to form cookies without the generation of fine powders the product has a humidity of between 8% and 12%. The process according to claim 11 or 12, characterized by cutting the 10 ribbons of expanded material to form a cookie, the product has a temperature between 50'C and 95'C. 14. The process according to claim 11 or 12, characterized by cutting the tapes of expanded material to form biscuit, the product has a temperature between 70 ° C and 15 85 'C. 15. The process according to claim 1, characterized in that the ribbons are cut between 4 and 5 cm wide and 5 and 10 cm long. The process according to claim 1, characterized in that the ribbons are cut between 4.4 and 4.6 cm wide and 8 and 8.2 cm long. 17. The process according to claim 1, characterized in that the cookies are delivered to a conveyor belt with a speed between 5 and 20 m / min. 25 18. The process according to claim 1, characterized in that the cookies are delivered to a conveyor belt with a speed of 18 and 14 m / min. 19. The process according to claim 1, characterized in that the baking is carried out in a direct flame oven with a residence time of between 2 and 5 minutes. 20. The process according to claim 1, characterized in that the baking is carried out in a direct flame oven with a residence time of between 10 and 14 min. The process according to claim 1, characterized in that the cooling on a belt is carried out at room temperature with a residence time of between 10 and 20 minutes. 22. The process according to claim 1, characterized in that the cooling in 40 a tape is made at room temperature with a residence time of between 12 and 15 minutes. 23. The process according to claim 22, characterized in that the humidity final cookie prior to wafer assembly, is between 2 and 6%. Four. Five

24.

The process according to claim 22, characterized in that the final moisture of the cookie prior to the wafer assembly is between 3 and 4%.

25.

The process according to claim 23, characterized in that said humidity allows to reach a water activity between 0.30 and 0.40.

The process according to claim 24, characterized in that said humidity allows to reach a water activity between 0.32 and 0.36. 27. The process according to claim 1, characterized in that the cookies are transported a feeder whose function is to feed in a continuous and orderly way the 10 units that will make up the wafer sandwich.

28.

The process according to claim 27, characterized in that said feeder has 8 cookie feed channels and works at a rate between 20 and 40 cookies / minute per channel.

29.

The process according to claim 27, characterized in that said feeder has 8 cookie feed channels and works at a rate between 30 and 36 cookies / minute per channel.

The process according to claim 28 or 29, characterized in that the feeder alternately doses the filling coming from the filling manufacturing line at a rate that is half of the cookie feeder. 31. The process according to claim 30, characterized in that the amount of filling to be dosed per sandwich must be between 5 and 10 g. 32. The process according to claim 30, characterized in that the amount of filling to be dosed per sandwich must be between 6 and 7 g. The process according to claim 31 or 32, characterized in that the dosing temperature must be between 20 and 30 oC. 34. The process according to claim 31 or 32, characterized in that the Dosing temperature should preferably be between 23 to 27 oC. 35 35. The process according to claim 1, characterized in that once the sandwich is formed, it is coated with a bath whose melting point must be between 30 and 45C. The process according to claim 1, characterized in that once the sandwich is formed, it is coated with a bath whose melting point must be between 34 and 40C. 37. The process according to claim 36, characterized in that the coverage dosage between 6 and 12 g / unit.

38.

The process according to claim 36, characterized in that the coverage dosage between 8 and 9 g / unit.

39.

The process according to claim 37 and 38, characterized in that at the exit of the bath, the wafer superficially has a temperature between 34 and 40 oC and must be cooled to solidify the bath.

40

The process according to claim 39, characterized in that the bathed wafer is cooled in a cooling tunnel at a temperature between 5 and 15 oC.

41. The process according to claim 39, characterized in that the bathed wafer 10 is cooled in a cooling tunnel at a temperature between 8 and 10 oC. 42. The process according to claim 40 or 41, characterized in that the wafers must be cooled for 4 minutes so that the wafer surface is below 20 ° C and the chocolate bath is completely solidified. 43. The process according to claim 42, characterized in that the bathed wafers are transported to a packaging line. 44. Gluten-free wafer suitable for coeliacs made by the procedure of Claim 1, characterized in that it is formed from an extruded rice cracker of low moisture content. 45. The wafer of claim 44, characterized in that the cookies are formed with a mixture of ingredients with a high proportion of starchy products, preferably flour 25 of rice in a proportion of between 90 and 95%, skim milk powder between 6 and 4%, salt between 0.5 and 2% and sugar and between 0.5 and 2%. 46. The wafer of claim 44, characterized in that the cookies are filled with a mixture of high proportion of sugars and / or liquid and solid fat in a 30 proportion between 40 and 50% of refined sugar, between 25 and 30% of sunflower oil, between 5 and 10 of hydrogenated vegetable oil, milk powder between 5 and 8%, corn starch between 6 and 8%, yogurt powder between 1 and 3%, dextrin malt between 2 and 4.5%, lecithin between 0.1 and 0.3% anhydrous citric acid between 0.1 and 0.5%, salt between 0.3 and 0.6 %, and essence 0.3%.