ES2562005T3 - Cyanide-free electrolyte for galvanic deposition of gold alloys - Google Patents
Cyanide-free electrolyte for galvanic deposition of gold alloys Download PDFInfo
- Publication number
- ES2562005T3 ES2562005T3 ES10724310.7T ES10724310T ES2562005T3 ES 2562005 T3 ES2562005 T3 ES 2562005T3 ES 10724310 T ES10724310 T ES 10724310T ES 2562005 T3 ES2562005 T3 ES 2562005T3
- Authority
- ES
- Spain
- Prior art keywords
- cyanide
- mercapto
- galvanic deposition
- gold alloys
- free electrolyte
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003792 electrolyte Substances 0.000 title abstract 3
- 229910001020 Au alloy Inorganic materials 0.000 title abstract 2
- 230000008021 deposition Effects 0.000 title abstract 2
- 239000003353 gold alloy Substances 0.000 title abstract 2
- AHPNCBGROYEARC-UHFFFAOYSA-N 2-sulfanylbutane-1,1,1-triol Chemical compound CCC(S)C(O)(O)O AHPNCBGROYEARC-UHFFFAOYSA-N 0.000 abstract 2
- NBUVVXNTRSKQSQ-UHFFFAOYSA-N 2-sulfanylpropane-1,3-diol Chemical compound OCC(S)CO NBUVVXNTRSKQSQ-UHFFFAOYSA-N 0.000 abstract 2
- 125000000129 anionic group Chemical group 0.000 abstract 2
- 150000001450 anions Chemical class 0.000 abstract 2
- UFULAYFCSOUIOV-UHFFFAOYSA-N cysteamine Chemical compound NCCS UFULAYFCSOUIOV-UHFFFAOYSA-N 0.000 abstract 2
- 239000010931 gold Substances 0.000 abstract 2
- 229960003151 mercaptamine Drugs 0.000 abstract 2
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 abstract 2
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 229910052787 antimony Inorganic materials 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 229910052797 bismuth Inorganic materials 0.000 abstract 1
- 229910052793 cadmium Inorganic materials 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 229910052733 gallium Inorganic materials 0.000 abstract 1
- 229910052732 germanium Inorganic materials 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 229910052738 indium Inorganic materials 0.000 abstract 1
- 229910052741 iridium Inorganic materials 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 229910052745 lead Inorganic materials 0.000 abstract 1
- 230000007935 neutral effect Effects 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 abstract 1
- 229910052703 rhodium Inorganic materials 0.000 abstract 1
- 229910052707 ruthenium Inorganic materials 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
- 229910052726 zirconium Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Electrolito libre de cianuro para la deposición galvánica de aleaciones de oro que comprende una solución acuosa neutra o alcalina de al menos un complejo aniónico de la fórmula general I [Au(L)n](n-1)- I con L seleccionado del grupo de los aniones de 1- y 2-tioglicerina, monotioglicol, mercapto-n-butanotriol, mercapto-ibutanotriol, mercaptopentanotetrol, cisteamina o combinaciones de los mismos, y n >= 2 a 5, y al menos un complejo aniónico de la fórmula general II [M(L)m]x- 10 II con M >= formador de aleaciones para oro seleccionado del grupo que comprende Cu, Ag, Fe, Ru, In, Ga, Ge, Sn, Pd, Sb, Bi, Co, Rh, Ir, Ni, Zn, Cd, Zr y Pb, L se selecciona del grupo de los aniones de 1- y 2-tioglicerina, monotioglicol, mercapto-n-butanotriol, mercapto-i butanotriol, mercaptopentanotetrol, cisteamina o combinaciones de los mismos, y m >= 2 a 6 y x >= 1 a 4, caracterizado por que el electrolito comprende al menos un abrillantador.Cyanide-free electrolyte for the galvanic deposition of gold alloys comprising a neutral or alkaline aqueous solution of at least one anionic complex of the general formula I [Au(L)n](n-1)- I with L selected from the group of the anions of 1- and 2-thioglycerin, monothioglycol, mercapto-n-butanetriol, mercapto-ibutanetriol, mercaptopentanotetrol, cysteamine or combinations thereof, and n >= 2 to 5, and at least one anionic complex of general formula II [M(L)m]x- 10 II with M >= alloy former for gold selected from the group consisting of Cu, Ag, Fe, Ru, In, Ga, Ge, Sn, Pd, Sb, Bi, Co, Rh , Ir, Ni, Zn, Cd, Zr and Pb, L is selected from the group of the anions of 1- and 2-thioglycerin, monothioglycol, mercapto-n-butanetriol, mercapto-i-butanetriol, mercaptopentanotetrol, cysteamine or combinations thereof , ym >= 2 to 6 and x >= 1 to 4, characterized in that the electrolyte comprises at least one brightener.
Description
Claims (1)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009024396 | 2009-06-09 | ||
| DE102009024396A DE102009024396A1 (en) | 2009-06-09 | 2009-06-09 | Cyanide-free electrolyte for electrodeposition of gold or its alloys |
| US18578909P | 2009-06-10 | 2009-06-10 | |
| US185789P | 2009-06-10 | ||
| PCT/EP2010/003465 WO2010142437A1 (en) | 2009-06-09 | 2010-06-09 | Cyanide-free electrolyte for galvanic deposition of gold or alloys thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2562005T3 true ES2562005T3 (en) | 2016-03-02 |
Family
ID=43069719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES10724310.7T Active ES2562005T3 (en) | 2009-06-09 | 2010-06-09 | Cyanide-free electrolyte for galvanic deposition of gold alloys |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP2313541B1 (en) |
| DE (1) | DE102009024396A1 (en) |
| ES (1) | ES2562005T3 (en) |
| WO (1) | WO2010142437A1 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2978765A1 (en) * | 2011-08-04 | 2013-02-08 | Commissariat Energie Atomique | NOVEL IONIC LIQUIDS USEFUL FOR ENTERING THE ELECTROLYTE COMPOSITION FOR ENERGY STORAGE DEVICES |
| CN103122471B (en) * | 2013-03-01 | 2015-10-28 | 沈阳师范大学 | A kind of electroplate liquid of non-cyanide plating indium |
| CN103741180B (en) * | 2014-01-10 | 2015-11-25 | 哈尔滨工业大学 | Non-cyanide bright electrogilding additive and application thereof |
| CN105499560B (en) * | 2015-11-25 | 2017-11-28 | 国家纳米科学中心 | A kind of method and its application for promoting silver in gold nanosphere surface regeneration length |
| CN106932511A (en) * | 2017-02-14 | 2017-07-07 | 中国环境科学研究院 | The detection method of different valence state antimony in a kind of environment water |
| ES2773771T3 (en) | 2017-05-23 | 2020-07-14 | Saxonia Edelmetalle Gmbh | Preparation of noble metal salt, a method for the preparation thereof, and use for electroplating |
| CN108950617B (en) * | 2018-07-11 | 2020-11-24 | 广州传福化学技术有限公司 | Tellurium-containing zinc-nickel alloy electroplating solution and electroplating process thereof |
| EP3604626A1 (en) * | 2018-08-03 | 2020-02-05 | COVENTYA S.p.A. | Electroplating bath for depositing a black alloy, method for the electrochemical deposition of a black alloy on a substrate, a black alloy and an article coated with such black alloy |
| DE102019202899B3 (en) * | 2019-03-04 | 2019-11-14 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Aqueous formulation for producing a layer of gold and silver |
| CN109881223B (en) * | 2019-03-11 | 2020-02-14 | 深圳市联合蓝海科技开发有限公司 | Cyanide-free gold plating solution and preparation method and application thereof |
| CN111411376A (en) * | 2020-03-09 | 2020-07-14 | 中国工程物理研究院激光聚变研究中心 | Electroplating solution and electroplating method for cyanide-free sulfite system |
| CN119392325B (en) * | 2024-12-31 | 2025-04-01 | 深圳创智芯联科技股份有限公司 | Cyanide-free gold plating solution and electroplating method for gold plating of micro blind holes |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3238112A (en) * | 1962-07-03 | 1966-03-01 | Du Pont | Electroplating of metals using mercapto-metal complex salts |
| US4435253A (en) | 1983-01-28 | 1984-03-06 | Omi International Corporation | Gold sulphite electroplating solutions and methods |
| US5302278A (en) | 1993-02-19 | 1994-04-12 | Learonal, Inc. | Cyanide-free plating solutions for monovalent metals |
| DE19629658C2 (en) * | 1996-07-23 | 1999-01-14 | Degussa | Cyanide-free galvanic bath for the deposition of gold and gold alloys |
| US6251249B1 (en) * | 1996-09-20 | 2001-06-26 | Atofina Chemicals, Inc. | Precious metal deposition composition and process |
| DE19924895B4 (en) * | 1999-06-01 | 2004-03-25 | W. C. Heraeus Gmbh & Co. Kg | Process for the preparation of a cyanide-free gold connection solution suitable for galvanic gold baths |
| US6911068B2 (en) * | 2001-10-02 | 2005-06-28 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| JP3985220B2 (en) * | 2001-12-06 | 2007-10-03 | 石原薬品株式会社 | Non-cyan gold-tin alloy plating bath |
| JP2004176171A (en) * | 2002-09-30 | 2004-06-24 | Shinko Electric Ind Co Ltd | Non-cyanide electrolytic gold plating solution |
-
2009
- 2009-06-09 DE DE102009024396A patent/DE102009024396A1/en not_active Ceased
-
2010
- 2010-06-09 EP EP10724310.7A patent/EP2313541B1/en not_active Not-in-force
- 2010-06-09 ES ES10724310.7T patent/ES2562005T3/en active Active
- 2010-06-09 WO PCT/EP2010/003465 patent/WO2010142437A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| EP2313541A1 (en) | 2011-04-27 |
| EP2313541B1 (en) | 2016-01-13 |
| DE102009024396A1 (en) | 2010-12-16 |
| WO2010142437A1 (en) | 2010-12-16 |
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