ES2576486T3 - Dispositivo de soldadura para unir células solares - Google Patents

Dispositivo de soldadura para unir células solares Download PDF

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Publication number
ES2576486T3
ES2576486T3 ES13180396.7T ES13180396T ES2576486T3 ES 2576486 T3 ES2576486 T3 ES 2576486T3 ES 13180396 T ES13180396 T ES 13180396T ES 2576486 T3 ES2576486 T3 ES 2576486T3
Authority
ES
Spain
Prior art keywords
solar cells
welding device
heat source
pin
magnetic field
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES13180396.7T
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English (en)
Inventor
Peter Morf
Adolf Hofer
Stefan Kaufmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Komax Holding AG
Original Assignee
Komax Holding AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komax Holding AG filed Critical Komax Holding AG
Application granted granted Critical
Publication of ES2576486T3 publication Critical patent/ES2576486T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/002—Soldering by means of induction heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B23K3/0475—Heating appliances electric using induction effects, e.g. Kelvin or skin effects
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/137—Batch treatment of the devices
    • H10F71/1375—Apparatus for automatic interconnection of photovoltaic cells in a module
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10143—Solar cell
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/101—Using electrical induction, e.g. for heating during soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Dermatology (AREA)
  • General Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Photovoltaic Devices (AREA)
  • Magnetic Resonance Imaging Apparatus (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)

Abstract

Dispositivo de soldadura para unir células solares (9), que incluye: - una fuente de calor cuyo funcionamiento se basa en el principio de inducción, gracias a la cual pistas conductoras (11) de las células solares, provistas de un agente de soldadura, se puede conectar con conductores eléctricos (10), presentando la fuente de calor un bucle de inducción (2) para generar un campo magnético de alta frecuencia con el fin de soldar los conductores a las células solares, y - al menos un pisador (3) para apretar el conductor (10) sobre la pista conductora (11) de la célula solar (9), caracterizado porque el o los pisadores (3) están realizados como concentradores de campo de forma que se puede intensificar y concentrar localmente el campo magnético.

Description

imagen1
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naturalmente también sería posible producir la espiga de pisador con otro material con alta permeabilidad magnética.
Las Figuras 5 a 7 muestran variantes en las que la espiga de pisador 5, por ejemplo guiada o alojada de forma móvil en dirección vertical en un casquillo (no representado) asignado a una carcasa del dispositivo de soldadura, está formada por dos o más piezas. En lugar de realizar toda la espiga de pasador como concentrador de campo, en las espigas de pisador según las Figuras 5 a 7 está dispuesto un elemento independiente 7 que consiste en un material con alta permeabilidad magnética (por ejemplo ferrita). Este elemento, que en adelante se designa como elemento concentrador de campo, está dispuesto en el área del extremo delantero de las espitas de pisador.
En la Figura 5, la espiga de pisador 5 consiste en un cuerpo de base tubular 15 en el que está dispuesto un elemento concentrador de campo 7. El cuerpo de base 15 consiste en un tubo cilíndrico realizado, por ejemplo, en vidrio, cerámica o plástico. Por consiguiente, el tubo en sí es neutro en relación con los campos magnéticos. El elemento concentrador de campo 7 de ferrita está dispuesto en el extremo delantero del cuerpo de base 15, que está orientado hacia la célula solar. Por ejemplo, el elemento concentrador de campo puede estar pegado o encajado en el interior del cuerpo de base 15.
En el ejemplo de realización según la Figura 6, el cuerpo de base para la espiga de pisador 5 está cerrado en el área del extremo libre. Un fondo 14 está unido a la parte delantera de la sección tubular. De este modo se asegura que el elemento concentrador de campo 7 no pueda tocar directamente el conductor. En lugar de un fondo conformado en el tubo, la espiga de pisador 5 también puede estar provista de un componente separado que cierre la sección tubular.
La Figura 7 muestra una pieza en forma de pie 13 fijada al cuerpo de base tubular
15. Por lo tanto, la pieza 13, ensanchada con respecto al cuerpo de base 15, constituye una mayor superficie de apoyo, que ejerce presión contra el conductor durante el proceso de apriete.

Claims (1)

  1. imagen1
    imagen2
ES13180396.7T 2013-08-14 2013-08-14 Dispositivo de soldadura para unir células solares Active ES2576486T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP13180396.7A EP2838123B1 (de) 2013-08-14 2013-08-14 Löteinrichtung zum Verbinden von Solarzellen

Publications (1)

Publication Number Publication Date
ES2576486T3 true ES2576486T3 (es) 2016-07-07

Family

ID=48998454

Family Applications (1)

Application Number Title Priority Date Filing Date
ES13180396.7T Active ES2576486T3 (es) 2013-08-14 2013-08-14 Dispositivo de soldadura para unir células solares

Country Status (4)

Country Link
US (1) US20150048078A1 (es)
EP (1) EP2838123B1 (es)
CN (1) CN104368889A (es)
ES (1) ES2576486T3 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9186741B2 (en) * 2009-09-11 2015-11-17 Sunpower Corporation Induction soldering of photovoltaic system components
CN105609584B (zh) * 2014-11-19 2023-10-24 苏州易益新能源科技有限公司 一种太阳能电池组件生产方法
CN107698790B (zh) 2016-08-05 2023-10-03 法国圣戈班玻璃公司 用于玻璃上的薄膜及其制造方法以及车窗
KR102480461B1 (ko) 2017-11-30 2022-12-21 쌩-고벵 글래스 프랑스 차량용 창유리의 터미널 솔더링 장치 및 방법
CN110944785A (zh) * 2018-07-20 2020-03-31 法国圣戈班玻璃厂 用于利用感应热量来钎焊接触元件的装置和方法
US20210276112A1 (en) * 2018-07-20 2021-09-09 Saint-Gobain Glass France Soldering tool for inductive soldering
KR20250129378A (ko) * 2024-02-22 2025-08-29 한화솔루션 주식회사 가압 장치 및 이를 포함하는 태빙 장치

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2496950A (en) * 1946-07-31 1950-02-07 Western Electric Co High-frequency heating apparatus for sequentially brazing a plurality of parts in a protective atmosphere
US3375141A (en) * 1963-07-22 1968-03-26 Aiken Ind Inc Solar cell array
CH647908A5 (de) * 1979-06-05 1985-02-15 Siemens Ag Albis Verfahren und anordnung zum kontaktieren der leiterbahnen von leiterplatten mit kontaktstiften.
FR2558941B1 (fr) * 1984-01-26 1986-05-02 Cem Comp Electro Mec Dispositif de chauffage de produits plats au defile par induction electromagnetique
US4685608A (en) * 1985-10-29 1987-08-11 Rca Corporation Soldering apparatus
IT1238290B (it) * 1990-03-28 1993-07-12 Stazione di saldatura ad induzione nelle macchine di inserimento dei contatti sui substrati dei circuiti ibridi o su schede di circuito stampato tradizionale.
JPH06297137A (ja) * 1993-04-13 1994-10-25 Tomishiyou:Kk ろう付用高周波誘導コイルとこれを用いたろう付方法
WO1995035013A1 (de) * 1994-06-15 1995-12-21 Otto Junker Gmbh Vorrichtung und verfahren zur induktiven querfelderwärmung von flachem metallischem gut
JP3326450B2 (ja) * 1997-04-25 2002-09-24 高周波熱錬株式会社 非直線棒状部材の誘導加熱処理装置
ATE524265T1 (de) * 2008-03-20 2011-09-15 Komax Holding Ag Löteinrichtung zum verbinden von solarzellen
US20100038358A1 (en) 2008-03-20 2010-02-18 Dingle Brad M Inductive soldering device
DE102009026236A1 (de) * 2009-07-23 2011-04-07 Atn Automatisierungstechnik Niemeier Gmbh Verfahren zum stoffschlüssigen Verbinden von Fügepartnern
US9186741B2 (en) * 2009-09-11 2015-11-17 Sunpower Corporation Induction soldering of photovoltaic system components
EP2607007A1 (de) * 2011-12-19 2013-06-26 Komax Holding AG Lötvorrichtung zum Befestigen eines elektrisch leitfähigen Bandes an einer Solarzelle
ES2613033T3 (es) * 2011-12-19 2017-05-22 Komax Holding Ag Dispositivo de soldadura para fijar una cinta conductora de electricidad en una barra colectora eléctrica de una célula solar mediante soldadura inductiva
CN202479657U (zh) * 2012-03-16 2012-10-10 宁夏小牛自动化设备有限公司 太阳能电池串焊设备及太阳能电池串焊焊头
US20130277361A1 (en) * 2012-04-19 2013-10-24 Lian Hok Tan Apparatus and method of interconnecting a plurality of solar cells

Also Published As

Publication number Publication date
CN104368889A (zh) 2015-02-25
EP2838123A1 (de) 2015-02-18
EP2838123B1 (de) 2016-03-16
US20150048078A1 (en) 2015-02-19

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