ES2584429A1 - Método de fabricación de un disipador térmico poroso para dispositivos electrónicos - Google Patents

Método de fabricación de un disipador térmico poroso para dispositivos electrónicos Download PDF

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Publication number
ES2584429A1
ES2584429A1 ES201530394A ES201530394A ES2584429A1 ES 2584429 A1 ES2584429 A1 ES 2584429A1 ES 201530394 A ES201530394 A ES 201530394A ES 201530394 A ES201530394 A ES 201530394A ES 2584429 A1 ES2584429 A1 ES 2584429A1
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ES
Spain
Prior art keywords
porous
heat sink
heat
electronic devices
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES201530394A
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English (en)
Other versions
ES2584429B1 (es
Inventor
Sergio GÓMEZ GONZÁLEZ
Enrique FERNÁNDEZ AGUADO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Universitat Politecnica de Catalunya UPC
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Universitat Politecnica de Catalunya UPC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Universitat Politecnica de Catalunya UPC filed Critical Universitat Politecnica de Catalunya UPC
Priority to ES201530394A priority Critical patent/ES2584429B1/es
Publication of ES2584429A1 publication Critical patent/ES2584429A1/es
Application granted granted Critical
Publication of ES2584429B1 publication Critical patent/ES2584429B1/es
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
    • F23N—REGULATING OR CONTROLLING COMBUSTION
    • F23N5/00—Systems for controlling combustion
    • F23N5/02—Systems for controlling combustion using devices responsive to thermal changes or to thermal expansion of a medium
    • F23N5/10—Systems for controlling combustion using devices responsive to thermal changes or to thermal expansion of a medium using thermocouples
    • F23N5/107—Systems for controlling combustion using devices responsive to thermal changes or to thermal expansion of a medium using thermocouples using mechanical means, e.g. safety valves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T17/00—Three-dimensional [3D] modelling for computer graphics
    • G06T17/10—Constructive solid geometry [CSG] using solid primitives, e.g. cylinders, cubes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
    • F23N—REGULATING OR CONTROLLING COMBUSTION
    • F23N2900/00—Special features of, or arrangements for controlling combustion
    • F23N2900/05101—Connections between thermocouple and magnetic valves, e.g. by plug and socket connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Computer Graphics (AREA)
  • Software Systems (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Método de fabricación de un disipador térmico poroso para dispositivos electrónicos utilizando técnicas computacionales de diseño asistido por ordenador basadas en un método basado en diagramas de Voronoi. El disipador térmico poroso obtenido se caracteriza por poseer macroporosidad variable e interconectada. Dicha macroporosidad se establece a partir de la definición del espesor trabecular de sección no constante (Tb.Th), de la separación trabecular (Tb.Sp), del número de puntos de nucleación de Voronoi y del volumen de la zona a rellenar. Dicho disipador térmico poroso se fabrica a partir de técnicas aditivas por impresión tridimensional (3D) con materiales conductores. Esta invención es aplicable en el campo dedicado a la fabricación de disipadores o intercambiadores de calor encargados de la evacuación de calor desde un elemento con elevada temperatura hacia un medio con menor temperatura con o sin circulación forzada de aire. Su elevada superficie específica y la posibilidad de conformarlo adaptándolo a un volumen predefinido permite optimizar la evacuación de calor en espacios reducidos.

Description

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Claims (1)

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ES201530394A 2015-03-25 2015-03-25 Método de fabricación de un disipador térmico poroso para dispositivos electrónicos Active ES2584429B1 (es)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ES201530394A ES2584429B1 (es) 2015-03-25 2015-03-25 Método de fabricación de un disipador térmico poroso para dispositivos electrónicos

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES201530394A ES2584429B1 (es) 2015-03-25 2015-03-25 Método de fabricación de un disipador térmico poroso para dispositivos electrónicos

Publications (2)

Publication Number Publication Date
ES2584429A1 true ES2584429A1 (es) 2016-09-27
ES2584429B1 ES2584429B1 (es) 2017-07-17

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
ES201530394A Active ES2584429B1 (es) 2015-03-25 2015-03-25 Método de fabricación de un disipador térmico poroso para dispositivos electrónicos

Country Status (1)

Country Link
ES (1) ES2584429B1 (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020208749A1 (de) 2020-07-14 2022-01-20 Volkswagen Aktiengesellschaft Verfahren zum Herstellen eines gekühlten Leistungselektronikmoduls

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090321045A1 (en) * 2008-06-30 2009-12-31 Alcatel-Lucent Technologies Inc. Monolithic structurally complex heat sink designs
WO2011060312A2 (en) * 2009-11-12 2011-05-19 Smith & Nephew, Inc. Controlled randomized porous structures and methods for making same
CN104028758A (zh) * 2014-07-04 2014-09-10 成都三鼎日新激光科技有限公司 一种热沉的制作方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090321045A1 (en) * 2008-06-30 2009-12-31 Alcatel-Lucent Technologies Inc. Monolithic structurally complex heat sink designs
WO2011060312A2 (en) * 2009-11-12 2011-05-19 Smith & Nephew, Inc. Controlled randomized porous structures and methods for making same
CN104028758A (zh) * 2014-07-04 2014-09-10 成都三鼎日新激光科技有限公司 一种热沉的制作方法

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Kou, Shuting. ¿Porous structure modeling with computers¿. Postgraduate Thesis. University of Hong Kong. [en línea] Noviembre 2014 [recuperado el 6-4-2016] Recuperado de Internet: < http://hub.hku.hk/handle/10722/206700 > DOI: < 10.5353/th_b5223989 > *
V. Petrovic et al. ¿Additive layer manufacturing: state of the art in industrial applications through case studies¿. International Journal of Production research. Volume 49, issue 4, pages 1061-1079 [en línea] Febrero 2010 [recuperado el 6-4-2016] Recuperado de Internet: < http://www.tandfonline.com/doi/abs/10.1080/00207540903479786 > DOI: < *
X.Y. Kou et al. ¿A simple and effective geometric representation for irregular porous structure modeling¿. Computer-Aided Design. Volume 42, Issue 10, October 2010, Pages 930¿941 [en línea] Octubre 2010 [recuperado el 6-4-2016] Recuperado de Internet: < http://www.sciencedirect.com/science/article/pii/S0010448510001211 > DOI: < doi:10.1016/j.cad.2010.06.006 > *

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Publication number Publication date
ES2584429B1 (es) 2017-07-17

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