ES2625308T3 - Elemento de construcción con una pista de láser de extremos en solape; procedimiento para la fabricación de un elemento de construcción semejante - Google Patents
Elemento de construcción con una pista de láser de extremos en solape; procedimiento para la fabricación de un elemento de construcción semejante Download PDFInfo
- Publication number
- ES2625308T3 ES2625308T3 ES10710351.7T ES10710351T ES2625308T3 ES 2625308 T3 ES2625308 T3 ES 2625308T3 ES 10710351 T ES10710351 T ES 10710351T ES 2625308 T3 ES2625308 T3 ES 2625308T3
- Authority
- ES
- Spain
- Prior art keywords
- laser
- construction element
- procedure
- manufacture
- similar construction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P54/00—Cutting or separating of wafers, substrates or parts of devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic materials other than metals or composite materials
- B23K2103/52—Ceramics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic materials other than metals or composite materials
- B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/15—Sheet, web, or layer weakened to permit separation through thickness
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Producing Shaped Articles From Materials (AREA)
- Golf Clubs (AREA)
- Conveying And Assembling Of Building Elements In Situ (AREA)
Abstract
Elemento de construcción (1) con una pista de láser (2) como línea de iniciación de rotura, la cual se compone de entradas de láser (3) de un rayo láser, para la preparación para una ulterior separación del elemento de construcción (1) en elementos de construcción individuales, siendo la distancia A entre dos entradas de láser adyacentes (3) menor o igual que el diámetro D de estas entradas de láser (3), medida respectivamente en la superficie del elemento de construcción (1), caracterizado por que la pista de láser (2) está combinada con rebajes (11) y zonas de la pista de láser (2) están sin entradas de láser (3).
Description
Claims (1)
-
imagen1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009015087 | 2009-03-31 | ||
| DE102009015087 | 2009-03-31 | ||
| PCT/EP2010/053972 WO2010112412A1 (de) | 2009-03-31 | 2010-03-26 | Bauteil mit einer überlappendenden laserspur; verfahren zur herstellung eines solchen bauteils |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2625308T3 true ES2625308T3 (es) | 2017-07-19 |
Family
ID=42229244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES10710351.7T Active ES2625308T3 (es) | 2009-03-31 | 2010-03-26 | Elemento de construcción con una pista de láser de extremos en solape; procedimiento para la fabricación de un elemento de construcción semejante |
Country Status (18)
| Country | Link |
|---|---|
| US (1) | US8822003B2 (es) |
| EP (1) | EP2414132B1 (es) |
| JP (1) | JP5661733B2 (es) |
| KR (1) | KR20120004498A (es) |
| CN (1) | CN102448659B (es) |
| BR (1) | BRPI1012662A2 (es) |
| CA (1) | CA2757229A1 (es) |
| DE (1) | DE102010003314A1 (es) |
| DK (1) | DK2414132T3 (es) |
| ES (1) | ES2625308T3 (es) |
| IL (1) | IL215452A0 (es) |
| MX (1) | MX2011010284A (es) |
| MY (1) | MY156815A (es) |
| PT (1) | PT2414132T (es) |
| RU (1) | RU2542056C2 (es) |
| SG (1) | SG174996A1 (es) |
| TW (1) | TW201039958A (es) |
| WO (1) | WO2010112412A1 (es) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102848084B (zh) * | 2012-09-28 | 2015-09-16 | 合肥彩虹蓝光科技有限公司 | 一种具有不同切割深度的发光原件切割方法 |
| US20150364374A1 (en) * | 2014-06-12 | 2015-12-17 | Toshiba Corporation | Semiconductor Device Die Singulation by Discontinuous Laser Scribe and Break |
| EP3023397A1 (de) * | 2014-11-24 | 2016-05-25 | Manz AG | Verfahren zum Abtrennen eines Teils eines spröden Materials |
| CN106932944B (zh) | 2017-04-28 | 2020-06-30 | 上海天马有机发光显示技术有限公司 | 一种显示面板及其制作方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3583279B2 (ja) * | 1998-01-13 | 2004-11-04 | 三菱電機株式会社 | 穴あけ加工方法 |
| US20050263854A1 (en) * | 1998-10-23 | 2005-12-01 | Shelton Bryan S | Thick laser-scribed GaN-on-sapphire optoelectronic devices |
| JP2003002677A (ja) * | 2001-06-22 | 2003-01-08 | Seiko Epson Corp | レーザ割断用支持テーブル、レーザ割断装置、レーザ割断方法、及び、液晶パネルの製造方法 |
| JP2003320466A (ja) * | 2002-05-07 | 2003-11-11 | Disco Abrasive Syst Ltd | レーザビームを使用した加工機 |
| JP2004063803A (ja) * | 2002-07-29 | 2004-02-26 | Ngk Spark Plug Co Ltd | プリント配線基板の製造方法、プリント配線基板製造用金属板、連結プリント配線基板 |
| JP2005209719A (ja) * | 2004-01-20 | 2005-08-04 | Disco Abrasive Syst Ltd | 半導体ウエーハの加工方法 |
| JP3908236B2 (ja) | 2004-04-27 | 2007-04-25 | 株式会社日本製鋼所 | ガラスの切断方法及びその装置 |
| JP2006319198A (ja) * | 2005-05-13 | 2006-11-24 | Disco Abrasive Syst Ltd | ウエーハのレーザー加工方法およびレーザー加工装置 |
| CN101341100A (zh) * | 2005-12-29 | 2009-01-07 | H2B光电技术有限公司 | 用于分离加工脆性材料构件的装置 |
| TWI449137B (zh) * | 2006-03-23 | 2014-08-11 | 製陶技術創新製陶工程股份公司 | 構件或電路用的攜帶體 |
| WO2008062496A1 (en) * | 2006-10-31 | 2008-05-29 | Kyocera Corporation | Ceramic member, method of forming groove in ceramic member, and substrate for electronic part |
| JP2008198905A (ja) * | 2007-02-15 | 2008-08-28 | Hitachi Metals Ltd | セラミックス基板及びセラミックス回路基板の製造方法並びに集合基板と半導体モジュール |
| CN101939129A (zh) * | 2007-11-07 | 2011-01-05 | 陶瓷技术股份公司 | 用于激光蚀刻脆性构件的方法 |
| JP5230240B2 (ja) * | 2008-04-04 | 2013-07-10 | 芝浦メカトロニクス株式会社 | レーザ加工装置 |
-
2010
- 2010-03-19 TW TW099108082A patent/TW201039958A/zh unknown
- 2010-03-26 MX MX2011010284A patent/MX2011010284A/es active IP Right Grant
- 2010-03-26 DE DE102010003314A patent/DE102010003314A1/de not_active Withdrawn
- 2010-03-26 SG SG2011071354A patent/SG174996A1/en unknown
- 2010-03-26 WO PCT/EP2010/053972 patent/WO2010112412A1/de not_active Ceased
- 2010-03-26 CA CA2757229A patent/CA2757229A1/en not_active Abandoned
- 2010-03-26 KR KR1020117025967A patent/KR20120004498A/ko not_active Ceased
- 2010-03-26 EP EP10710351.7A patent/EP2414132B1/de active Active
- 2010-03-26 CN CN201080024963.5A patent/CN102448659B/zh not_active Expired - Fee Related
- 2010-03-26 JP JP2012502596A patent/JP5661733B2/ja active Active
- 2010-03-26 RU RU2011143585/03A patent/RU2542056C2/ru not_active IP Right Cessation
- 2010-03-26 BR BRPI1012662A patent/BRPI1012662A2/pt not_active IP Right Cessation
- 2010-03-26 DK DK10710351.7T patent/DK2414132T3/en active
- 2010-03-26 MY MYPI2011004671A patent/MY156815A/en unknown
- 2010-03-26 US US13/259,449 patent/US8822003B2/en not_active Expired - Fee Related
- 2010-03-26 ES ES10710351.7T patent/ES2625308T3/es active Active
- 2010-03-26 PT PT107103517T patent/PT2414132T/pt unknown
-
2011
- 2011-10-02 IL IL215452A patent/IL215452A0/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20120004498A (ko) | 2012-01-12 |
| US8822003B2 (en) | 2014-09-02 |
| EP2414132A1 (de) | 2012-02-08 |
| BRPI1012662A2 (pt) | 2016-04-05 |
| JP2012521895A (ja) | 2012-09-20 |
| US20120015129A1 (en) | 2012-01-19 |
| PT2414132T (pt) | 2017-04-24 |
| RU2011143585A (ru) | 2013-05-10 |
| RU2542056C2 (ru) | 2015-02-20 |
| SG174996A1 (en) | 2011-11-28 |
| EP2414132B1 (de) | 2017-03-22 |
| JP5661733B2 (ja) | 2015-01-28 |
| MY156815A (en) | 2016-03-31 |
| CN102448659A (zh) | 2012-05-09 |
| WO2010112412A1 (de) | 2010-10-07 |
| DE102010003314A1 (de) | 2010-10-07 |
| MX2011010284A (es) | 2011-12-08 |
| TW201039958A (en) | 2010-11-16 |
| CA2757229A1 (en) | 2010-10-07 |
| IL215452A0 (en) | 2011-12-29 |
| CN102448659B (zh) | 2015-10-21 |
| DK2414132T3 (en) | 2017-06-26 |
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